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    Methods and fixture for coupling a lid to a support substrate
    1.
    发明授权
    Methods and fixture for coupling a lid to a support substrate 有权
    用于将盖连接到支撑基底的方法和夹具

    公开(公告)号：US07256065B1

    公开(公告)日：2007-08-14

    申请号：US10859673

    申请日：2004-06-03

    申请人： Seah Sun Too ,  Edward Alcid ,  Ahmad Juwanda ,  Keng Sang Cha ,  Leang Hua Kam ,  Tek Seng Tan

    发明人： Seah Sun Too ,  Edward Alcid ,  Ahmad Juwanda ,  Keng Sang Cha ,  Leang Hua Kam ,  Tek Seng Tan

    IPC分类号： H01L21/00

    CPC分类号： H01L23/10 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/00

    摘要： A method for coupling a lid to a support substrate having a semiconductor chip coupled thereto and a clamp fixture. Each semiconductor component has a semiconductor chip mounted to a semiconductor component and a lid coupled to the support substrate via a lid attach material. The lid attach material is cured either using a two-step process that includes a partial cure step followed by a clampless cure step or by curing the die attach material in a clamp fixture without including a pre-cure step. The semiconductor component manufacture decides on the curing approach based on cost and the number of semiconductor components being manufactured. If the semiconductor manufacturer opts for curing with a clamp fixture, the clamp fixture includes a base plate insert on which the semiconductor components are placed and a compression mechanism that includes a compression plate having a compressive material disposed thereon.

    摘要翻译： 一种用于将盖连接到具有与其连接的半导体芯片的支撑基板和夹具固定装置的方法。 每个半导体部件具有安装到半导体部件的半导体芯片和通过盖子连接材料连接到支撑基板的盖子。 使用包括部分固化步骤然后是无钳位固化步骤的两步工艺或通过在不包括预固化步骤的情况下将夹具附着材料固化在夹具夹具中来固化盖附接材料。 半导体部件制造基于成本和正在制造的半导体部件的数量来决定固化方法。 如果半导体制造商选择用夹具固定固化，则夹具夹具包括其上放置半导体部件的基板插件和包括其上设置有压缩材料的压缩板的压缩机构。