Acrylic polymer having multilayer structure and methacrylic resin composition containing the same
    7.
    发明授权
    Acrylic polymer having multilayer structure and methacrylic resin composition containing the same 有权
    具有多层结构的丙烯酸类聚合物和含有它的甲基丙烯酸树脂组合物

    公开(公告)号:US06310137B1

    公开(公告)日:2001-10-30

    申请号:US09424851

    申请日:1999-12-06

    IPC分类号: C08L5106

    CPC分类号: C08F285/00 C08F220/12

    摘要: A multilayered acrylic polymer comprising an innermost layer polymer (A) formed from a C1-4 alkyl methacrylate, a C1-8 alkyl acrylate, etc., an intermediate layer polymer (B) formed from a C1-8 alkyl acrylate, an aromatic vinyl monomer, etc., and an outermost layer polymer (C) formed from a C1-4 alkyl methacrylate, a C1-8 alkyl acrylate, etc., and wherein the average value of the coating ratio, i.e. [(minimum thickness of the intermediate layer)÷(maximum thickness of the intermediate layer)]×100, is not less than 30%; and a methacrylic resin composition containing the same. This multilayered acrylic polymer can improve the falling-ball or falling-weight impact strength, resistance to impact whitening, transparency and other properties of the methacrylic resin composition.

    摘要翻译: 包括由甲基丙烯酸C 1-4烷基酯,丙烯酸C 1-8烷基酯等形成的最内层聚合物(A),丙烯酸C 1-8烷基酯形成的中间层聚合物(B),芳香族乙烯基 单体等,以及由甲基丙烯酸C 1-4烷基酯,丙烯酸C 1-8烷基酯等形成的最外层聚合物(C),并且其中涂布比的平均值,即[(中间体的最小厚度 层)÷(中间层的最大厚度)]×100,不小于30%; 和含有它们的甲基丙烯酸系树脂组合物。 这种多层丙烯酸类聚合物可以改善甲基丙烯酸树脂组合物的落球或落锤冲击强度,耐冲击增白,透明度等特性。

    Tetrazole compound-containing photopolymerizable resin composition
    8.
    发明授权
    Tetrazole compound-containing photopolymerizable resin composition 失效
    含四唑化合物的光聚合树脂组合物

    公开(公告)号:US4629679A

    公开(公告)日:1986-12-16

    申请号:US834148

    申请日:1986-02-25

    摘要: A photopolymerizable resin composition is described which comprises, (a) 40 to 85 wt. %, based on the composition, of a thermoplastic polymer binder, (b) 15 to 60 wt. %, based on the composition, of a cross-linkable monomer having at least one ethylenically unsaturation, (c) 0.5 to 10 wt. %, based on the total of the binder (a) and the monomer (b), of a photopolymerization initiator, and (d) 0.005 to 1 wt. %, based on the total of the binder (a) and the monomer (b), of a tetrazole compound of the formula: ##STR1## wherein R.sub.1 is H, halogen, methyl, ethyl, phenyl, carboxyl, amino, dimethylamino, diethylamino, methoxy, ethoxy, mercapto or sulfonic acid; and R.sub.2 is H, methyl, ethyl, phenyl, amino or mercapto. The photopolymerization resin composition exhibits an enhanced adhesion to a metal surface, and is useful as a photoresist for fabrication of a printed circuit board.

    摘要翻译: 描述了一种可光聚合的树脂组合物,其包含(a)40至85重量% (b)15至60wt。%的基于组合物的热塑性聚合物粘合剂, 基于组合物,具有至少一个烯属不饱和键的可交联单体的(%),(c)0.5至10重量% %,基于光聚合引发剂的粘合剂(a)和单体(b)的总量,和(d)0.005〜1重量% 其中R 1为H,卤素,甲基,乙基,苯基,羧基,氨基,二甲基氨基,二乙基氨基的四唑化合物的总量,基于粘合剂(a)和单体(b) ,甲氧基,乙氧基,巯基或磺酸; R2是H,甲基,乙基,苯基,氨基或巯基。 光聚合树脂组合物对金属表面具有增强的粘合性,并且可用作制造印刷电路板的光致抗蚀剂。