公开(公告)号：US20140264539A1

公开(公告)日：2014-09-18

申请号：US14191625

申请日：2014-02-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Hieu Van Tran ,  Chien-Sheng Su ,  Prateep Tuntasood

IPC: H01L27/115

CPC classification number: H01L21/76224 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/42336 ,  H01L29/66825 ,  H01L29/788 ,  H01L29/7881

Abstract: A memory device array with spaced apart parallel isolation regions formed in a semiconductor substrate, with an active region between each pair of adjacent isolation regions. Each isolation region includes a trench formed into the substrate surface and an insulation material formed in the trench. Portions of a top surface of the insulation material are recessed below the surface of the substrate. Each active region includes a column of memory cells each having spaced apart first and second regions with a channel region therebetween, a floating gate over a first channel region portion, and a select gate over a second channel region portion. The select gates are formed as continuous word lines extending perpendicular to the isolation regions and each forming the select gates for one row of the memory cells. Portions of each word line extend down into the trenches and disposed laterally adjacent to sidewalls of the trenches.

Abstract translation: 一种存储器件阵列，其具有形成在半导体衬底中的间隔开的平行隔离区域，在每对相邻隔离区域之间具有有源区域。 每个隔离区域包括形成在衬底表面中的沟槽和形成在沟槽中的绝缘材料。 绝缘材料的顶表面的部分凹陷在基底的表面下方。 每个有源区域包括一列存储单元，每个存储单元具有间隔开的第一和第二区域，其间具有通道区域，在第一沟道区域部分上的浮动栅极以及在第二沟道区域部分上的选择栅极。 选择栅极形成为垂直于隔离区域延伸的连续字线，并且每个形成用于一行存储器单元的选择栅极。 每个字线的一部分向下延伸到沟槽中并且横向设置成与沟槽的侧壁相邻。

公开(公告)号：US09673208B2

公开(公告)日：2017-06-06

申请号：US15264457

申请日：2016-09-13

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Chien-Sheng Su ,  Feng Zhou ,  Xian Liu ,  Nhan Do ,  Prateep Tuntasood ,  Parviz Ghazavi

IPC: H01L27/115 ,  H01L29/66 ,  H01L27/11531

CPC classification number: H01L27/11531 ,  H01L27/11524 ,  H01L27/11536 ,  H01L27/11539 ,  H01L27/11541 ,  H01L27/11543

Abstract: A method of forming a memory device on a substrate having memory, core and HV device areas. The method includes forming a pair of conductive layers in all three areas, forming an insulation layer over the conductive layers in all three areas (to protect the core and HV device areas), and then etching through the insulation layer and the pair of conductive layers in the memory area to form memory stacks. The method further includes forming an insulation layer over the memory stacks (to protect the memory area), removing the pair of conductive layers in the core and HV device areas, and forming conductive gates disposed over and insulated from the substrate in the core and HV device areas.

公开(公告)号：US09293359B2

公开(公告)日：2016-03-22

申请号：US14191625

申请日：2014-02-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Hieu Van Tran ,  Chien-Sheng Su ,  Prateep Tuntasood

IPC: H01L29/788 ,  H01L21/762 ,  H01L29/66 ,  H01L27/115 ,  H01L21/28 ,  H01L29/423

CPC classification number: H01L21/76224 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/42336 ,  H01L29/66825 ,  H01L29/788 ,  H01L29/7881

Abstract: A memory device array with spaced apart parallel isolation regions formed in a semiconductor substrate, with an active region between each pair of adjacent isolation regions. Each isolation region includes a trench formed into the substrate surface and an insulation material formed in the trench. Portions of a top surface of the insulation material are recessed below the surface of the substrate. Each active region includes a column of memory cells each having spaced apart first and second regions with a channel region therebetween, a floating gate over a first channel region portion, and a select gate over a second channel region portion. The select gates are formed as continuous word lines extending perpendicular to the isolation regions and each forming the select gates for one row of the memory cells. Portions of each word line extend down into the trenches and disposed laterally adjacent to sidewalls of the trenches.

Abstract translation: 一种存储器件阵列，其具有形成在半导体衬底中的间隔开的平行隔离区域，在每对相邻隔离区域之间具有有源区域。 每个隔离区域包括形成在衬底表面中的沟槽和形成在沟槽中的绝缘材料。 绝缘材料的顶表面的部分凹陷在基底的表面下方。 每个有源区域包括一列存储单元，每个存储单元具有间隔开的第一和第二区域，其间具有通道区域，在第一沟道区域部分上的浮动栅极以及在第二沟道区域部分上的选择栅极。 选择栅极形成为垂直于隔离区域延伸的连续字线，并且每个形成用于一行存储器单元的选择栅极。 每个字线的一部分向下延伸到沟槽中并且横向设置成与沟槽的侧壁相邻。