公开(公告)号：US20230292504A1

公开(公告)日：2023-09-14

申请号：US17834746

申请日：2022-06-07

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H01L27/11531 ,  H01L29/423 ,  H01L21/28 ,  H01L29/788 ,  H01L29/66

CPC classification number: H01L27/11531 ,  H01L29/42328 ,  H01L29/40114 ,  H01L29/7883 ,  H01L29/66825

Abstract: A method includes recessing an upper surface of a substrate in first and second areas relative to a third area, forming a first conductive layer in the first area, forming a second conductive layer in the three areas, selectively removing the first and second conductive layers in the first area, while maintaining the second conductive layer in the second and third areas, leaving pairs of stack structures in the first area respectively having a control gate of the second conductive layer and a floating gate of the first conductive layer, forming a third conductive layer in the three areas, recessing the upper surface of the third conductive layer below tops of the stack structures and removing the third conductive layer from the second and third areas, removing the second conductive layer from the second and third areas, and forming blocks of metal material in the second and third areas.

公开(公告)号：US11968829B2

公开(公告)日：2024-04-23

申请号：US17834746

申请日：2022-06-07

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H10B41/42 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788

CPC classification number: H10B41/42 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7883

Abstract: A method includes recessing an upper surface of a substrate in first and second areas relative to a third area, forming a first conductive layer in the first area, forming a second conductive layer in the three areas, selectively removing the first and second conductive layers in the first area, while maintaining the second conductive layer in the second and third areas, leaving pairs of stack structures in the first area respectively having a control gate of the second conductive layer and a floating gate of the first conductive layer, forming a third conductive layer in the three areas, recessing the upper surface of the third conductive layer below tops of the stack structures and removing the third conductive layer from the second and third areas, removing the second conductive layer from the second and third areas, and forming blocks of metal material in the second and third areas.

公开(公告)号：US12144172B2

公开(公告)日：2024-11-12

申请号：US17745639

申请日：2022-05-16

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H10B41/49 ,  H01L21/28 ,  H01L29/66 ,  H10B41/35 ,  H10B41/41 ,  H01L29/423

Abstract: A method of forming a device on a semiconductor substrate having first, second, third and dummy areas, includes recessing the substrate upper surface in the first, second and dummy areas, forming a first conductive layer over the substrate, removing the first conductive layer from the third area and a second portion of the dummy area, forming a first insulation layer over the substrate, forming first trenches through the first insulation layer and into the substrate in the third area and the second portion of the dummy area, forming second trenches through the first insulation layer, the first conductive layer and into the substrate in the first and second areas and a first portion of the dummy area, and filling the first and second trenches with insulation material. Then, memory cells are formed in the first area, HV devices in the second area and logic devices in the third area.

公开(公告)号：US20230262975A1

公开(公告)日：2023-08-17

申请号：US17745639

申请日：2022-05-16

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H01L27/11546 ,  H01L27/11524 ,  H01L21/28 ,  H01L29/66 ,  H01L27/11529

CPC classification number: H01L27/11546 ,  H01L27/11524 ,  H01L29/40114 ,  H01L29/66825 ,  H01L27/11529 ,  H01L29/42328

Abstract: A method of forming a device on a semiconductor substrate having first, second, third and dummy areas, includes recessing the substrate upper surface in the first, second and dummy areas, forming a first conductive layer over the substrate, removing the first conductive layer from the third area and a second portion of the dummy area, forming a first insulation layer over the substrate, forming first trenches through the first insulation layer and into the substrate in the third area and the second portion of the dummy area, forming second trenches through the first insulation layer, the first conductive layer and into the substrate in the first and second areas and a first portion of the dummy area, and filling the first and second trenches with insulation material. Then, memory cells are formed in the first area, HV devices in the second area and logic devices in the third area.