公开(公告)号：US20200013883A1

公开(公告)日：2020-01-09

申请号：US16576389

申请日：2019-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L29/66 ,  H01L21/3213 ,  H01L27/11521 ,  H01L27/11536 ,  H01L27/11531 ,  H01L29/423 ,  H01L49/02

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US20190214397A1

公开(公告)日：2019-07-11

申请号：US16208072

申请日：2018-12-03

Applicant: Silicon Storage Technology, Inc.

Inventor： Leo Xing ,  Andy Liu ,  Xian Liu ,  Chunming Wang ,  Melvin Dao ,  Nhan Do

IPC: H01L27/11521 ,  H01L29/423 ,  H01L29/08 ,  H01L29/10 ,  H01L23/532

CPC classification number: H01L27/11521 ,  H01L23/53295 ,  H01L29/0847 ,  H01L29/1037 ,  H01L29/42328 ,  H01L29/42336

Abstract: A pair of memory cells that includes first and second spaced apart trenches formed into the upper surface of a semiconductor substrate, and first and second floating gates disposed in the first and second trenches. First and second word line gates disposed over and insulated from a portion of the upper surface that is adjacent to the first and second floating gates respectively. A source region is formed in the substrate laterally between the first and second floating gates. First and second channel regions extend from the source region, under the first and second trenches respectively, along side walls of the first and second trenches respectively, and along portions of the upper surface disposed under the first and second word line gates respectively. The first and second trenches only contain the first and second floating gates and insulation material respectively.

公开(公告)号：US10276696B2

公开(公告)日：2019-04-30

申请号：US15494499

申请日：2017-04-22

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L29/66 ,  H01L27/11531 ,  H01L27/11536 ,  H01L27/115 ,  H01L21/3213 ,  H01L27/11521 ,  H01L29/423

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US11737266B2

公开(公告)日：2023-08-22

申请号：US17339880

申请日：2021-06-04

Applicant: Silicon Storage Technology, Inc.

Inventor： Guo Xiang Song ,  Chunming Wang ,  Leo Xing ,  Xian Liu ,  Nhan Do

IPC: H01L27/088 ,  H10B41/41

CPC classification number: H10B41/41

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the three areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in all three areas, forming a protective layer in the first and second areas and then removing the third conductive layer from the third area, then forming blocks of dummy conductive material in the third area, then etching in the first and second areas to form select and HV gates, and then replacing the blocks of dummy conductive material with blocks of metal material.

公开(公告)号：US20230189520A1

公开(公告)日：2023-06-15

申请号：US18103265

申请日：2023-01-30

Applicant: Silicon Storage Technology, Inc.

Inventor： Guo Xiang Song ,  Chunming Wang ,  Leo Xing ,  Xian Liu ,  Nhan Do

IPC: H10B41/42 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/788 ,  H10B41/30

CPC classification number: H10B41/42 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66545 ,  H01L29/66795 ,  H01L29/66825 ,  H01L29/7851 ,  H01L29/7883 ,  H10B41/30

Abstract: A method of forming memory cells, high voltage devices and logic devices on fins of a semiconductor substrate's upper surface, and the resulting memory device formed thereby. The memory cells are formed on a pair of the fins, where the floating gate is disposed between the pair of fins, the word line gate wraps around the pair of fins, the control gate is disposed over the floating gate, and the erase gate is disposed over the pair of fins and partially over the floating gate. The high voltage devices include HV gates that wrap around respective fins, and the logic devices include logic gates that are metal and wrap around respective fins.

公开(公告)号：US20220102517A1

公开(公告)日：2022-03-31

申请号：US17165934

申请日：2021-02-02

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Xian Liu ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L29/423 ,  G11C16/04 ,  H01L29/66 ,  H01L29/788

Abstract: A memory device, and method of making the same, that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a first channel region in the substrate extending between the first and second regions, a first floating gate disposed over and insulated from a first portion of the first channel region adjacent to the second region, a first coupling gate disposed over and insulated from the first floating gate, a first word line gate disposed over and insulated from a second portion of the first channel region adjacent the first region, and a first erase gate disposed over and insulated from the first word line gate.

公开(公告)号：US20210398995A1

公开(公告)日：2021-12-23

申请号：US17129865

申请日：2020-12-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Jack Sun ,  Chunming Wang ,  Xian Liu ,  Andy Yang ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L27/11531 ,  H01L27/11524 ,  H01L27/11529 ,  H01L29/423 ,  H01L29/66

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the first and second areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in the first and second areas, forming a protective layer in the first and second areas and then removing the second conductive layer from the third area, then forming blocks of conductive material in the third area, then etching in the first and second areas to form select and HV gates, and replacing the blocks of conductive material with blocks of metal material.

公开(公告)号：US10833178B2

公开(公告)日：2020-11-10

申请号：US16576370

申请日：2019-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L27/11521 ,  H01L27/11531 ,  H01L29/66 ,  H01L21/3213 ,  H01L27/11536 ,  H01L29/423 ,  H01L49/02

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US10600794B2

公开(公告)日：2020-03-24

申请号：US16160812

申请日：2018-10-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Andy Liu ,  Xian Liu ,  Leo Xing ,  Melvin Diao ,  Nhan Do

IPC: H01L29/66 ,  H01L29/788 ,  H01L29/423 ,  H01L27/11521 ,  H01L27/11524 ,  H01L21/28

Abstract: A twin bit memory cell includes first and second spaced apart floating gates formed in first and second trenches in the upper surface of a semiconductor substrate. An erase gate, or a pair of erase gates, are disposed over and insulated from the floating gates, respectively. A word line gate is disposed over and insulated from a portion of the upper surface that is between the first and second trenches. A first source region is formed in the substrate under the first trench, and a second source region formed in the substrate under the second trench. A continuous channel region of the substrate extends from the first source region, along a side wall of the first trench, along the portion of the upper surface that is between the first and second trenches, along a side wall of the second trench, and to the second source region.

公开(公告)号：US11968829B2

公开(公告)日：2024-04-23

申请号：US17834746

申请日：2022-06-07

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H10B41/42 ,  H01L21/28 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788

CPC classification number: H10B41/42 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7883

Abstract: A method includes recessing an upper surface of a substrate in first and second areas relative to a third area, forming a first conductive layer in the first area, forming a second conductive layer in the three areas, selectively removing the first and second conductive layers in the first area, while maintaining the second conductive layer in the second and third areas, leaving pairs of stack structures in the first area respectively having a control gate of the second conductive layer and a floating gate of the first conductive layer, forming a third conductive layer in the three areas, recessing the upper surface of the third conductive layer below tops of the stack structures and removing the third conductive layer from the second and third areas, removing the second conductive layer from the second and third areas, and forming blocks of metal material in the second and third areas.