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公开(公告)号：US12100642B2
公开(公告)日：2024-09-24
申请号：US17854241
申请日：2022-06-30
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L21/48 , H01L23/00 , H01L23/433
CPC classification number: H01L23/433 , H01L21/4871 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29194 , H01L2224/32245
Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
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公开(公告)号：US11676948B2
公开(公告)日：2023-06-13
申请号：US17337752
申请日：2021-06-03
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Kong-Toon Ng , Hung-Ho Lee , Chee-Key Chung , Chang-Fu Lin , Chi-Hsin Chiu
CPC classification number: H01L25/105 , H01L21/568 , H01L24/16 , H01L24/24 , H01L24/81 , H01L24/82 , H01L25/50 , H01L2224/16145 , H01L2224/24153 , H01L2224/73209 , H01L2224/82005 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058
Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
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公开(公告)号：US11069661B1
公开(公告)日：2021-07-20
申请号：US16909043
申请日：2020-06-23
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Wei-Jhen Chen , Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L25/065 , H01L23/00 , H01L23/538 , H01L23/31
Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
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公开(公告)号：US10950520B2
公开(公告)日：2021-03-16
申请号：US16533716
申请日：2019-08-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Kuo-Hua Yu , Wen-Shan Tsai , En-Li Lin , Kaun-I Cheng , Wei-Ping Wang
IPC: H01L23/367 , H01L23/00 , H01L21/48 , F28F13/18
Abstract: An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.
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5.发明授权公开(公告)号：US10863626B1
公开(公告)日：2020-12-08
申请号：US16669872
申请日：2019-10-31
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
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Patent Agency Ranking
公开(公告)号：US10763237B2
公开(公告)日：2020-09-01
申请号：US16691477
申请日：2019-11-21
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Yu-Min Lo , Chee-Key Chung , Chang-Fu Lin , Kuo-Hua Yu , Hsiang-Hua Huang
Abstract: The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.
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公开(公告)号：US11482470B2
公开(公告)日：2022-10-25
申请号：US16872740
申请日：2020-05-12
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L23/433 , H01L21/48 , H01L23/00
Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
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公开(公告)号：US11410954B2
公开(公告)日：2022-08-09
申请号：US16922169
申请日：2020-07-07
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L23/00
Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.
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公开(公告)号：US20210296295A1
公开(公告)日：2021-09-23
申请号：US17337752
申请日：2021-06-03
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Kong-Toon Ng , Hung-Ho Lee , Chee-Key Chung , Chang-Fu Lin , Chi-Hsin Chiu
Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.
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公开(公告)号：US20210287962A1
公开(公告)日：2021-09-16
申请号：US16872740
申请日：2020-05-12
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Yu-Lung Huang , Chee-Key Chung , Chang-Fu Lin , Yuan-Hung Hsu
IPC: H01L23/433 , H01L21/48 , H01L23/00
Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.
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