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    METHOD OF FABRICATING CONNECTION STRUCTURE FOR A SUBSTRATE
    2.
    发明申请
    METHOD OF FABRICATING CONNECTION STRUCTURE FOR A SUBSTRATE 审中-公开
    制作基板连接结构的方法

    公开(公告)号：US20150214169A1

    公开(公告)日：2015-07-30

    申请号：US14683716

    申请日：2015-04-10

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Chih-Sheng Lin ,  Chun-Lung Chen ,  Hsin-Hung Lee

    IPC: H01L23/00 ,  C25D7/12 ,  C23C14/34 ,  C25D5/02

    CPC classification number: H01L24/11 ,  C23C14/34 ,  C25D5/02 ,  C25D7/12 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/03001 ,  H01L2224/0401 ,  H01L2224/11001 ,  H01L2924/01029 ,  H05K1/111 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/0367 ,  Y10T29/49124

    Abstract: A connection structure for a substrate is provided. The substrate has a plurality of connection pads and an insulation protection layer with the connection pads being exposed therefrom. The connection structure includes a metallic layer formed on an exposed surface of each of the connection pads and extending to the insulation protection layer, and a plurality of conductive bumps disposed on the metallic layer and spaced apart from one another at a distance less than or equal to 80 μm, each of conductive bumps having a width less than a width of each of the connection pads. Since the metallic layer covers the exposed surfaces of the connection pads completely, a colloid material will not flow to a surface of the connection pads during a subsequent underfilling process of a flip-chip process. Therefore, the colloid material will not be peeled off from the connection pads.

    Abstract translation: 提供了一种用于基板的连接结构。 衬底具有多个连接焊盘和绝缘保护层，其中连接焊盘从其暴露。 连接结构包括形成在每个连接焊盘的暴露表面上并延伸到绝缘保护层的金属层，以及设置在金属层上并以小于或等于的距离彼此间隔开的多个导电凸块 每个导电凸块的宽度小于每个连接焊盘的宽度。 由于金属层完全覆盖连接焊盘的暴露表面，所以在随后的倒装芯片工艺的底部填充过程中，胶体材料将不会流到连接焊盘的表面。 因此，胶体材料不会从连接垫剥离。

    CONNECTION STRUCTURE FOR A SUBSTRATE AND A METHOD OF FABRICATING THE CONNECTION STRUCTURE
    3.
    发明申请
    CONNECTION STRUCTURE FOR A SUBSTRATE AND A METHOD OF FABRICATING THE CONNECTION STRUCTURE 审中-公开
    一种基板的连接结构和一种制作连接结构的方法

    公开(公告)号：US20140131072A1

    公开(公告)日：2014-05-15

    申请号：US13729710

    申请日：2012-12-28

    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

    Inventor： Chih-Sheng Lin ,  Chun-Lung Chen ,  Hsin-Hung Lee

    IPC: H05K1/11 ,  H05K3/00

    CPC classification number: H01L24/11 ,  C23C14/34 ,  C25D5/02 ,  C25D7/12 ,  H01L24/06 ,  H01L24/14 ,  H01L2224/03001 ,  H01L2224/0401 ,  H01L2224/11001 ,  H01L2924/01029 ,  H05K1/111 ,  H05K3/4007 ,  H05K2201/0338 ,  H05K2201/0367 ,  Y10T29/49124

    Abstract: A connection structure for a substrate is provided. The substrate has a plurality of connection pads and an insulation protection layer with the connection pads being exposed therefrom. The connection structure includes a metallic layer formed on an exposed surface of each of the connection pads and extending to the insulation protection layer, and a plurality of conductive bumps disposed on the metallic layer and spaced apart from one another at a distance less than or equal to 80 μm, each of conductive bumps having a width less than a width of each of the connection pads. Since the metallic layer covers the exposed surfaces of the connection pads completely, a colloid material will not flow to a surface of the connection pads during a subsequent underfilling process of a flip-chip process. Therefore, the colloid material will not be peeled off from the connection pads.

    Abstract translation: 提供了一种用于基板的连接结构。 衬底具有多个连接焊盘和绝缘保护层，其中连接焊盘从其暴露。 连接结构包括形成在每个连接焊盘的暴露表面上并延伸到绝缘保护层的金属层，以及设置在金属层上并以小于或等于的距离彼此间隔开的多个导电凸块 每个导电凸块的宽度小于每个连接焊盘的宽度。 由于金属层完全覆盖连接焊盘的暴露表面，所以在随后的倒装芯片工艺的底部填充过程中，胶体材料将不会流到连接焊盘的表面。 因此，胶体材料不会从连接垫剥离。

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