Abstract:
An active probe card capable of improving testing bandwidth of a device under (DUT) test includes a printed circuit board; at least one probe needle, affixed to a first surface of the printed circuit board for probing the DUT; at least one connection member, electrically connected to the at least one probe needle; and an amplification circuit, formed on the printed circuit board and coupled to the at least one connection member for amplifying an input or output signal of the DUT.
Abstract:
An active probe card capable of improving testing bandwidth of a device under (DUT) test includes a printed circuit board; at least one probe needle, affixed to a first surface of the printed circuit board for probing the DUT; at least one connection member, electrically connected to the at least one probe needle; and an amplification circuit, formed on the printed circuit board and coupled to the at least one connection member for amplifying an input or output signal of the DUT.
Abstract:
An integrated circuit (IC) testing interface capable of upgrading an automatic test equipment (ATE) for testing a semiconductor device includes at least one pin for receiving or transmitting at least a test signal to a tester of the automatic test equipment, a plurality of digitizers coupled to the at least one pin for generating a digital signal, a processing means coupled to the plurality of digitizers for processing the digital signal, and a connection unit for connecting the processing means with a computing device for transmitting an output signal from the processing means to the computing device, where the IC testing interface is disposed between the tester and a prober of the automatic test equipment.
Abstract:
An integrated circuit (IC) testing interface capable of upgrading an automatic test equipment (ATE) for testing a semiconductor device includes at least one pin for receiving or transmitting at least a test signal to a tester of the automatic test equipment, a plurality of digitizers coupled to the at least one pin for generating a digital signal, a processing means coupled to the plurality of digitizers for processing the digital signal, and a connection unit for connecting the processing means with a computing device for transmitting an output signal from the processing means to the computing device, where the IC testing interface is disposed between the tester and a prober of the automatic test equipment.