公开(公告)号：US20190382556A1

公开(公告)日：2019-12-19

申请号：US16123509

申请日：2018-09-06

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： CHIH-WEI LIAO ,  GUAN-SYUN TSENG ,  TSUNG-HSIEN LIN ,  JU-MING HUANG

IPC: C08K5/357 ,  C08J5/24 ,  H05K1/03 ,  H05K3/02

Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.

公开(公告)号：US20190203003A1

公开(公告)日：2019-07-04

申请号：US16009266

申请日：2018-06-15

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： CHIH-WEI LIAO ,  GUAN-SYUN TSENG ,  TSUNG-HSIEN LIN ,  JU-MING HUANG ,  CHEN-HUA YU

IPC: C08J5/24 ,  C08L63/00 ,  C09D163/00 ,  C09D5/18 ,  B32B15/092 ,  H05K1/03 ,  H05K1/02 ,  H05K3/02

CPC classification number: C08J5/24 ,  B32B15/092 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2421/00 ,  C08J2465/02 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2207/53 ,  C09D5/18 ,  C09D163/00 ,  H05K1/024 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0212 ,  H05K2201/0227

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.