公开(公告)号：US20180054889A1

公开(公告)日：2018-02-22

申请号：US15603326

申请日：2017-05-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. BAHL ,  Konstantine KARAVAKIS

IPC: H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K1/11 ,  H05K3/46 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US11647583B2

公开(公告)日：2023-05-09

申请号：US16095120

申请日：2017-04-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shimpei Obata ,  Ryuuji Takahashi ,  Yasunori Hoshino ,  Shigetoshi Fujita

IPC: H05K1/03 ,  B32B15/08 ,  B32B5/28 ,  C08J5/10 ,  C08J5/24 ,  H01L23/498 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/08 ,  C08J5/10 ,  C08J5/244 ,  H01L23/49894 ,  H05K1/0271 ,  H05K1/03 ,  H05K1/0366 ,  B32B2262/101 ,  B32B2457/08 ,  C08J2361/06 ,  C08J2361/08 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2425/12 ,  C08J2433/00 ,  C08J2433/04 ,  C08J2433/12 ,  C08J2433/20 ,  C08J2461/06 ,  C08J2461/08 ,  C08J2463/00 ,  C08J2475/00 ,  C08J2479/08 ,  C08J2483/04 ,  H05K2201/0218 ,  H05K2201/0227

Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.

公开(公告)号：US09942981B2

公开(公告)日：2018-04-10

申请号：US15603326

申请日：2017-05-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  H05K1/11 ,  H05K3/46 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US20130096233A1

公开(公告)日：2013-04-18

申请号：US13637629

申请日：2011-03-22

Applicant: Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

Inventor： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC: C08L63/00 ,  C08K9/02 ,  C08K3/10 ,  C08K3/22

CPC classification number: C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Abstract translation: 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US20120305295A1

公开(公告)日：2012-12-06

申请号：US13576893

申请日：2010-02-03

Applicant: Kazuya Kimura ,  Kazuhiko Ooga ,  Kiichiro Miura

Inventor： Kazuya Kimura ,  Kazuhiko Ooga ,  Kiichiro Miura

IPC: C09D175/04 ,  H05K3/22 ,  H05K1/02

CPC classification number: C08G18/6674 ,  C08G18/0852 ,  C08G18/4833 ,  C08G18/4845 ,  C08G18/758 ,  C08L63/00 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0227

Abstract: It is an object of the present invention to provide a thermosetting composition which is excellent in low warpage properties and long-term electrical insulation reliability and is capable of forming an insulating film that inhibits disconnection of wiring of a flexible wiring board. The thermosetting composition of the present invention is a thermosetting composition for forming an insulating film, by curing the composition, on a flexible wiring board comprising a wiring pattern formed on a flexible substrate, and is characterized in that a cured product obtained by curing the composition has a tensile elastic modulus of 0.5 to 2.0 GPa.

Abstract translation: 本发明的目的是提供一种热弯性组合物，其具有优异的低翘曲性能和长期的电绝缘可靠性，并且能够形成一种绝缘膜，其阻止柔性布线板的布线断开。 本发明的热固性组合物是通过固化该组合物而形成绝缘膜的热固性组合物，该柔性布线板包括形成在柔性基板上的布线图案，其特征在于，将通过固化该组合物而获得的固化产物 拉伸弹性模量为0.5〜2.0GPa。

公开(公告)号：US11895768B2

公开(公告)日：2024-02-06

申请号：US17641548

申请日：2019-10-02

Applicant: ROGERS CORPORATION

Inventor： Eui Kyoon Kim ,  Bruce Fitts ,  Christopher Brown

IPC: H05K1/02 ,  H05K1/03 ,  C23C16/455 ,  C23C16/40

CPC classification number: H05K1/0204 ,  C23C16/403 ,  C23C16/45525 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0293

Abstract: In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.

公开(公告)号：US20190203003A1

公开(公告)日：2019-07-04

申请号：US16009266

申请日：2018-06-15

Applicant: TAIWAN UNION TECHNOLOGY CORPORATION

Inventor： CHIH-WEI LIAO ,  GUAN-SYUN TSENG ,  TSUNG-HSIEN LIN ,  JU-MING HUANG ,  CHEN-HUA YU

IPC: C08J5/24 ,  C08L63/00 ,  C09D163/00 ,  C09D5/18 ,  B32B15/092 ,  H05K1/03 ,  H05K1/02 ,  H05K3/02

CPC classification number: C08J5/24 ,  B32B15/092 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2421/00 ,  C08J2465/02 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2207/53 ,  C09D5/18 ,  C09D163/00 ,  H05K1/024 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0212 ,  H05K2201/0227

Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.

公开(公告)号：US09670340B2

公开(公告)日：2017-06-06

申请号：US15351151

申请日：2016-11-14

Applicant: LG Innotek Co., Ltd.

Inventor： Sang A Ju ,  Hyun Gu Im ,  Jae Man Park

IPC: C08K9/06 ,  C08K9/02 ,  C08K3/22

CPC classification number: C08K9/06 ,  B05D3/0254 ,  C08K3/22 ,  C08K3/38 ,  C08K9/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/385 ,  H01L33/641 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  C08L63/00

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

公开(公告)号：US20170058107A1

公开(公告)日：2017-03-02

申请号：US15351151

申请日：2016-11-14

Applicant: LG Innotek Co., Ltd.

Inventor： Sang A Ju ,  Hyun Gu Im ,  Jae Man Park

IPC: C08K9/06 ,  C08L63/00 ,  H05K1/02 ,  H01L33/64 ,  H05K1/03 ,  C08K3/38 ,  C08L83/08

CPC classification number: C08K9/06 ,  B05D3/0254 ,  C08K3/22 ,  C08K3/38 ,  C08K9/02 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/385 ,  H01L33/641 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0227 ,  C08L63/00

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract translation: 根据本发明的一个实施方案的无机填料包括氮化硼附聚物和形成在氮化硼附聚物上并包含-Si-R-NH 2基团的涂层，R选自具有 1至3个碳原子，具有2至3个碳原子的烯烃基和具有2至3个碳原子的炔基。

公开(公告)号：US20150187453A1

公开(公告)日：2015-07-02

申请号：US14140534

申请日：2013-12-26

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： CHANG-CHIN WU ,  PEI-RONG SHIEH

IPC: H01B1/16 ,  H01B13/00

CPC classification number: H01B1/16 ,  G02F1/13452 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0227 ,  Y10T428/249983

Abstract: An anisotropic conductive film includes a base board and an insulation adhesive layer coated on a side surface of the base board. The insulation adhesive layer includes a plurality of conductive particles dispersed in the insulation adhesive layer. Each of the plurality of conductive particles includes a spherical base portion, a conductive film formed on the spherical base portion, and an insulation layer with ceramic materials formed on the conductive film. The insulation layer defines a plurality of holes, thus the insulation layer is porous, the insulation layer is capable of being partly exposed from the plurality of holes when the plurality of conductive particles is pressed. A method for manufacturing the anisotropic conductive film is also provided.

Abstract translation: 各向异性导电膜包括基板和涂覆在基板的侧表面上的绝缘粘合剂层。 绝缘粘合剂层包括分散在绝缘粘合剂层中的多个导电颗粒。 多个导电粒子中的每一个包括球形基部，形成在球形基部上的导电膜，以及在导电膜上形成有陶瓷材料的绝缘层。 绝缘层限定多个孔，因此绝缘层是多孔的，当多个导电颗粒被按压时，绝缘层能够从多个孔部分露出。 还提供了制造各向异性导电膜的方法。