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公开(公告)号：US20230140856A1
公开(公告)日：2023-05-11
申请号：US17915349
申请日：2021-03-30
Applicant: TDK CORPORATION
Inventor： Seijiro SUNAGA , Makoto YAMASHITA , Toshinobu MIYAGOSHI , Yasuo KATO , Tatsunori OTOMO , Mitsuyoshi MAKIDA , Yohei SATO
CPC classification number: H01L21/67132 , H01L21/681 , B65G47/90 , B41K3/64
Abstract: A stamp tool holding device capable of holding a stamp tool while keeping a stamp surface of the stamp tool clean, a stamp tool positioning device that easily positions a stamp tool with respect to a transport head, a multi-element transfer device for efficiently transferring a transport object element such as an element using a stamp tool, and a method of manufacturing an element array using the same, wherein the stamp tool holding device has an installation stage on which a stamp tool is detachably installed. The installation stage has an installation surface on which a housing recess for accommodating a stamp layer of the stamp tool is formed, and a suction hole capable of detachably adsorbing a part of the stamp tool located around the stamp layer is formed on the installation surface.
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公开(公告)号：US20230093241A1
公开(公告)日：2023-03-23
申请号：US17909080
申请日：2021-03-04
Applicant: TDK CORPORATION
Inventor： Hiroshi KOIZUMI , Yasuo KATO , Makoto YAMASHITA , Mitsuyoshi MAKIDA , Ryo SHINDO , Osamu SHINDO , Hiroshi IIZUKA , Seijiro SUNAGA , Toshinobu MIYAGOSHI
IPC: H01L33/00
Abstract: An element array pressurizing device has a pressurizing plate having a pressurizing unit that pressurizes an element array comprising a plurality of elements disposed on a mounting substrate. The pressurizing unit has a plate-shaped hard material for which a surface precision is higher than that of a surface of the pressurizing plate.
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Patent Agency Ranking
公开(公告)号：US20230382069A1
公开(公告)日：2023-11-30
申请号：US18323467
申请日：2023-05-25
Applicant: TDK CORPORATION
Inventor： Yohei SATO , Osamu SHINDO , Hiroshi KOIZUMI , Makoto YAMASHITA , Yasuo KATO , Mitsuyoshi MAKIDA , Masashi MATSUMOTO
CPC classification number: B30B12/00 , B30B15/04 , B30B15/062
Abstract: Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46, and a support member 45 supporting the lower jig plate 46 and providing a support force to the lower jig plate 46 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.
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公开(公告)号：US20230381904A1
公开(公告)日：2023-11-30
申请号：US18323618
申请日：2023-05-25
Applicant: TDK CORPORATION
Inventor： Yohei SATO , Hiroshi KOIZUMI , Toshinobu MIYAGOSHI , Osamu SHINDO , Seijiro SUNAGA , Makoto YAMASHITA , Yasuo KATO , Mitsuyoshi MAKIDA , Masashi MATSUMOTO
IPC: B23Q3/02
CPC classification number: B23Q3/02
Abstract: A substrate processing apparatus 10 having a lower jig plate 46 for arranging a substrate 2 as an object to be pressurized, a support member 45 including an installation portion 52 for installing columnar members 50 supporting the lower jig plate 46, in which the columnar members 50 are placed to the installation portion 52 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.
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公开(公告)号：US20230382070A1
公开(公告)日：2023-11-30
申请号：US18323745
申请日：2023-05-25
Applicant: TDK CORPORATION
Inventor： Yohei SATO , Hiroshi KOIZUMI , Toshinobu MIYAGOSHI , Osamu SHINDO , Seijiro SUNAGA , Mitsuyoshi MAKIDA , Makoto YAMASHITA , Yasuo KATO , Ryo SHINDO , Masashi MATSUMOTO
CPC classification number: B30B12/00 , B30B15/062 , B30B15/04
Abstract: A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.
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公开(公告)号：US20230381903A1
公开(公告)日：2023-11-30
申请号：US18323820
申请日：2023-05-25
Applicant: TDK CORPORATION
Inventor： Yohei SATO , Hiroshi KOIZUMI , Osamu SHINDO , Mitsuyoshi MAKIDA , Masashi MATSUMOTO
IPC: B23Q1/03
CPC classification number: B23Q1/032
Abstract: A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.
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公开(公告)号：US20230187258A1
公开(公告)日：2023-06-15
申请号：US17915320
申请日：2021-03-30
Applicant: TDK CORPORATION
Inventor： Seijiro SUNAGA , Makoto YAMASHITA , Toshinobu MIYAGOSHI , Yasuo KATO , Tatsunori OTOMO , Mitsuyoshi MAKIDA , Yohei SATO
IPC: H01L21/683 , H05K13/04 , H01L21/67 , H01L21/687 , B29C59/02
CPC classification number: H01L21/6838 , B29C59/026 , H01L21/67144 , H01L21/68707 , H05K13/0404 , B29L2007/00
Abstract: [Object] Provided are a stamp tool whose transport head can be easily shared, a transport device capable of allowing the stamp tool to easily pick up an transport object element disposed on a surface of a substrate from the substrate and transporting the element without being left on the substrate side, and an element array manufacturing method using the same.
[Solution] A stamp tool 10 includes a stamp layer 12 allowing an element 32r as an transport object element to detachably adhere thereto, a support plate 14 to which the stamp layer 12 is fixed, and an adapter plate 16 having a mounting surface 16a, the support plate 14 being replaceably attached thereto, and a transport head 22 being allowed to be detachably attached thereon.
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