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    Sensor Arrangement and Method for Manufacturing a Sensor Arrangement
    2.
    发明公开
    Sensor Arrangement and Method for Manufacturing a Sensor Arrangement 审中-公开

    公开(公告)号：US20230160759A1

    公开(公告)日：2023-05-25

    申请号：US17639236

    申请日：2021-10-13

    Applicant: TDK Electronics AG

    Inventor： Jan Ihle ,  Torben Seifert ,  Sasa Sabeder-Daiminger ,  Gerhard Hojas

    IPC: G01K7/22 ,  G01K7/08

    CPC classification number: G01K7/22 ,  G01K7/08

    Abstract: In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

    Sensor element and method for producing a sensor element
    4.
    发明授权
    Sensor element and method for producing a sensor element 有权

    公开(公告)号：US12287246B2

    公开(公告)日：2025-04-29

    申请号：US17639781

    申请日：2021-08-31

    Applicant: TDK Electronics AG

    Inventor： Anke Weidenfelder ,  Jan Ihle ,  Bernhard Ostrick ,  Jeffrey Krotosky

    IPC: G01K7/20 ,  B81C1/00 ,  G01K7/16

    Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

    Sensor arrangement and method for producing a sensor arrangement
    5.
    发明授权
    Sensor arrangement and method for producing a sensor arrangement 有权

    公开(公告)号：US12259283B2

    公开(公告)日：2025-03-25

    申请号：US17639236

    申请日：2021-10-13

    Applicant: TDK Electronics AG

    Inventor： Jan Ihle ,  Torben Seifert ,  Sasa Sabeder-Daiminger ,  Gerhard Hojas

    IPC: G01K1/12 ,  G01K7/08 ,  G01K7/22 ,  H01C1/148 ,  H01C7/00

    Abstract: In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

    Sensor Element and Method for Producing a Sensor Element
    7.
    发明申请
    Sensor Element and Method for Producing a Sensor Element 有权

    公开(公告)号：US20220357214A1

    公开(公告)日：2022-11-10

    申请号：US17639781

    申请日：2021-08-31

    Applicant: TDK Electronics AG ,  Tronics MEMS, Inc.

    Inventor： Anke Weidenfelder ,  Jan Ihle ,  Bernhard Ostrick ,  Jeffrey Krotosky

    IPC: G01K7/20

    Abstract: In an embodiment a sensor element includes at least one carrier having a top side and a bottom side, the top side being electrically insulating, at least one functional layer including a material with a temperature-dependent electrical resistance, the functional layer being arranged on the carrier, at least two electrodes arranged on the carrier at a distance from one another and at least two contact pads configured for electrically contacting the sensor element, wherein a respective contact pad is arranged directly on a partial region of one of the electrodes, wherein the sensor element is configured to measure a temperature, and wherein the sensor element is configured for direct integration into an electrical system as a discrete component.

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