公开(公告)号：US10297946B1

公开(公告)日：2019-05-21

申请号：US15957298

申请日：2018-04-19

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Vijay Daga ,  Kavitha Bharadwaj ,  Sunny Sethi ,  Ting Gao

IPC: H01R13/52 ,  H01R43/20 ,  H01R43/00 ,  H01R4/72

Abstract: An electrical connection sealer includes an outer jacket and a low-viscosity sealant. The outer jacket includes a first piece of heat-shrinkable tubing. The outer jacket has a pre-sealed end and an open end opposite the pre-sealed end. The first piece of heat-shrinkable tubing at the open end is heat-recoverable and forms a cavity for insertion of an electrical connection. The low-viscosity sealant is insertable into the cavity. Upon application of heat to the electrical connection sealer with the electrical connection and the low-viscosity sealant in the cavity of the electrical connection sealer, the low-viscosity sealant flows across and through the first wires and the at least one second wire and the first piece of heat-shrinkable tubing shrinks to encapsulate the electrical connection and seal the electrical connection and the low-viscosity sealant substantially within the outer jacket.

公开(公告)号：US10103458B2

公开(公告)日：2018-10-16

申请号：US15493342

申请日：2017-04-21

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Sunny Sethi ,  Vijay Daga ,  Kavitha Bharadwaj ,  Ting Gao

IPC: H01R13/52 ,  H01R4/72

Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein a shrinkable tubing is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A band of the high viscosity sealant/adhesive is placed within the heat shrink tubing adjacent to the edge of heat shrink tubing. A band of the low viscosity sealant/adhesive is placed within the heat shrink tubing. Upon the application of heat to the device, the shrinkable tubing starts to recover, the high viscosity sealant/adhesive seals the edge of the shrinkable tubing and the low-viscosity sealant/adhesive flows across and through the plurality of electrical wires to create a seal. The high viscosity sealant/adhesive prevents flow of the low-viscosity sealant/adhesive from contaminating the electrical terminal.

公开(公告)号：US20180280973A1

公开(公告)日：2018-10-04

申请号：US15473899

申请日：2017-03-30

Applicant: TE CONNECTIVITY CORPORATION ,  Tyco Electronics (Shanghai) Co., Ltd.

Inventor： Min Zheng Haeberle ,  Ting Gao ,  Jiankun Zhou ,  James Toth

IPC: B01L3/00

Abstract: A fluid sensing system includes a microfluidic chip, multiple sensors, and a communication device. The microfluidic chip includes at least one microfluidic channel extending a length through the microfluidic chip. The microfluidic chip is fluidly connected to a process fluid such that a fluid sample from the process fluid flows through the at least one microfluidic channel. The multiple sensors are operatively connected to the at least one microfluidic channel of the microfluidic chip. The multiple sensors are configured to monitor multiple different properties of the fluid sample within the at least one microfluidic channel. The communication device is operatively connected to the multiple sensors. The communication device is configured to receive data parameters representative of the multiple different properties of the fluid sample from the multiple sensors and wirelessly transmit the data parameters to a remote location.

公开(公告)号：US10974241B2

公开(公告)日：2021-04-13

申请号：US15473899

申请日：2017-03-30

Applicant: TE CONNECTIVITY CORPORATION ,  Tyco Electronics (Shanghai) Co., Ltd.

Inventor： Min Zheng Haeberle ,  Ting Gao ,  Jiankun Zhou ,  James Toth

IPC: B01L3/00 ,  C25D21/12 ,  G01N27/42 ,  G01N27/07

Abstract: A fluid sensing system includes a microfluidic chip, multiple sensors, and a communication device. The microfluidic chip includes at least one microfluidic channel extending a length through the microfluidic chip. The microfluidic chip is fluidly connected to a process fluid such that a fluid sample from the process fluid flows through the at least one microfluidic channel. The multiple sensors are operatively connected to the at least one microfluidic channel of the microfluidic chip. The multiple sensors are configured to monitor multiple different properties of the fluid sample within the at least one microfluidic channel. The communication device is operatively connected to the multiple sensors. The communication device is configured to receive data parameters representative of the multiple different properties of the fluid sample from the multiple sensors and wirelessly transmit the data parameters to a remote location.

公开(公告)号：US20200274300A1

公开(公告)日：2020-08-27

申请号：US16286840

申请日：2019-02-27

Applicant: TE CONNECTIVITY CORPORATION

Inventor： John Joseph Consoli ,  Chad William Morgan ,  Timothy Robert Minnick ,  David Wayne Helster ,  Ting Gao ,  Jialing Wang ,  Mark Wartenberg

IPC: H01R13/6585

Abstract: An electrical connector including a housing defining an interior cavity and extending from a mounting end to an engagement end, and at least one signal component disposed within the interior cavity of the housing. The housing is formed from a conductive composite material and engages the at least one signal component to shield the interior cavity.

公开(公告)号：US20200035383A1

公开(公告)日：2020-01-30

申请号：US16046577

申请日：2018-07-26

Applicant: TE Connectivity Corporation

Inventor： Sunny Sethi ,  Vijay Daga ,  Kavitha Bharadwaj ,  Ting Gao

IPC: H01B13/00 ,  H01B3/44 ,  H01B3/30

Abstract: A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.

公开(公告)号：US10109947B2

公开(公告)日：2018-10-23

申请号：US15426552

申请日：2017-02-07

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Sunny Sethi ,  Vijay Daga ,  Kavitha Bharadwaj ,  Ting Gao

IPC: H01R13/52 ,  H01R4/72

Abstract: A system and device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal, wherein the device further includes a first piece of heat shrink tubing having a predetermined length, wherein the first piece of heat shrink tubing has been placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal; a second piece of heat shrink tubing having a predetermined length, wherein the second piece of heat shrink tubing has a smaller diameter than the first piece of heat shrink tubing, and wherein the second piece of heat shrink tubing is placed partially inside the end of the first piece of heat shrink tubing that extends over the wire attachment portion of the electrical terminal; and a band of adhesive placed within the first piece of heat shrink tubing adjacent to the second piece of heat shrink tubing.

公开(公告)号：US11855401B2

公开(公告)日：2023-12-26

申请号：US16902580

申请日：2020-06-16

Applicant: TE Connectivity Germany GmbH ,  TE Connectivity Corporation

Inventor： Lei Wang ,  Soenke Sachs ,  Ting Gao ,  Dejie Tao ,  Helge Schmidt

IPC: H01R4/70 ,  C10M169/02 ,  C08G77/442 ,  C08K3/36 ,  C08L23/14 ,  C08L83/10 ,  H01B3/46 ,  H01R4/18 ,  H01R43/048 ,  H02G1/14 ,  H02G15/04

CPC classification number: H01R4/70 ,  C08G77/442 ,  C08K3/36 ,  C08L23/145 ,  C08L83/10 ,  C10M169/02 ,  H01B3/465 ,  H01R4/18 ,  H01R43/048 ,  H02G1/14 ,  H02G15/04 ,  C08K2201/005 ,  C08L2201/56 ,  C08L2203/206 ,  C08L2207/324

Abstract: A dispensable grease sealant includes a base component in an amount of 50 wt % or more, based on a total weight of the sealant, and a thickener. The base component is selected from a group including a silicone wax, a liquid rubber, and a combination thereof.

公开(公告)号：US11257612B2

公开(公告)日：2022-02-22

申请号：US16046577

申请日：2018-07-26

Applicant: TE Connectivity Corporation

Inventor： Sunny Sethi ,  Vijay Daga ,  Kavitha Bharadwaj ,  Ting Gao

IPC: H01B7/285 ,  H01B13/00 ,  H01B3/30 ,  H01B3/44 ,  H02G15/013

Abstract: A method for sealing a bundle of wires includes providing an adhesive material having a viscosity of less than about 300 Pa·s at the installation temperature. The method further includes forming a structure from the adhesive and inserting a plurality of wires into the structure. A first amount of heat is applied to the structure in a first heating operation. The first amount of heat being higher than an ambient temperature and lower than a softening temperature of the structure. Subsequently, a second amount of heat is applied in a second heating operation to the adhesive structure to thereby fully melt the adhesive structure and cause the adhesive of the structure to fill voids between the plurality of wires to thereby seal the wires. Application of the first amount of heat during the first operation to the structure facilitates improved melt uniformity of the structure during the second heating operation.

公开(公告)号：US10483661B2

公开(公告)日：2019-11-19

申请号：US16037093

申请日：2018-07-17

Applicant: TE CONNECTIVITY CORPORATION

Inventor： Sunny Sethi ,  Vijay Daga ,  Kavitha Bharadwaj ,  Ting Gao

IPC: H01R13/52 ,  H01R4/72 ,  H01R4/18 ,  H02G15/04 ,  H01R11/12

Abstract: A system for sealing an electrical terminal which includes a device for sealing a plurality of electrical wires to a wire attachment portion of an electrical terminal. The device includes a shrinkable tubing which is placed over the plurality of electrical wires such that one end thereof extends over the wire attachment portion of the electrical terminal. A sealant/adhesive is placed within the heat shrink tubing and has a first portion proximate to the edge of heat shrink tubing. The sealant/adhesive has a strip of high viscosity sealant/adhesive proximate a strip of low viscosity sealant/adhesive. Upon the application of heat to the device after installation of the device over the electrical terminal, the shrinkable tubing starts to recover, the first portion of the sealant/adhesive flows and seals free ends of the plurality of electrical wires to seal the free ends of the electrical wires.