公开(公告)号：US20240071892A1

公开(公告)日：2024-02-29

申请号：US17900446

申请日：2022-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kwang-Soo KIM ,  Vivek ARORA ,  Woochan KIM

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49866 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2224/48245 ,  H01L2224/48464 ,  H01L2924/1811 ,  H01L2924/1815 ,  H01L2924/182

Abstract: In examples, a method of manufacturing a semiconductor package comprises providing a lead frame having multiple conductive pins coupled thereto; positioning the lead frame within a mold chase and applying a strip of mold compound to the multiple conductive pins along a length of the lead frame; trimming connections between the lead frame and the multiple conductive pins; bending the multiple conductive pins; trimming the strip of mold compound to singulate the multiple conductive pins from each other and from the lead frame to form singulated conductive pins; coupling a singulated conductive pin from among the singulated conductive pins to a substrate such that a portion of the strip of mold compound coupled to the singulated conductive pin is in contact with the substrate and such that a segment of the singulated conductive pin extends vertically in a plane that is orthogonal to the substrate; coupling a semiconductor die to the substrate; and covering the substrate, the semiconductor die, the portion of the strip of mold compound, and part of the singulated conductive pin with a second mold compound, such that a portion of the segment of the singulated conductive pin extends beyond a top surface of the second mold compound.

公开(公告)号：US20240128246A1

公开(公告)日：2024-04-18

申请号：US17966530

申请日：2022-10-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Kwang-Soo KIM ,  Makoto SHIBUYA ,  Johan STRYDOM

IPC: H01L25/16 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H02M3/00

CPC classification number: H01L25/16 ,  H01L21/4853 ,  H01L23/49844 ,  H01L24/48 ,  H02M3/003 ,  H01L23/49822 ,  H01L2224/48106 ,  H01L2224/48137 ,  H01L2224/48225 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1306 ,  H01L2924/1426 ,  H01L2924/19041 ,  H01L2924/30107

Abstract: One example includes an apparatus that includes an insulating layer and an electrically conductive layer on the insulating layer. The conductive layer includes a plurality of electrically isolated and conductive regions. A first switch is on a first of the conductive regions, and the first switch has a first terminal and a second terminal. A second switch is on a second of the conductive regions, and the second switch has a third terminal and fourth terminal. A passive component has a fifth terminal and a sixth terminal. The first and third terminals are coupled to the first conductive region. The fourth and sixth terminals are coupled to the second conductive region. The second and fifth terminals are coupled to a third of the conductive regions.