LOAD PORT AND METHOD FOR LOADING AND UNLOADING CASSETTE
    1.
    发明申请
    LOAD PORT AND METHOD FOR LOADING AND UNLOADING CASSETTE 有权
    负载端口和加载和卸载CASSETTE的方法

    公开(公告)号:US20160225649A1

    公开(公告)日:2016-08-04

    申请号:US14609038

    申请日:2015-01-29

    CPC classification number: H01L21/67775 B65G1/137 H01L21/67769

    Abstract: A load port for a processing tool includes a carrier, a carrier actuator, an input table, an input table actuator, and a controller. The carrier has a plurality of cassette buffering spaces. The carrier is movable relative to the processing tool. The carrier actuator is operably connected to the carrier. The input table is configured to receive at least one cassette. The input table is movable relative to the carrier. The input table actuator is operably connected to the input table. The controller is configured to control the carrier actuator to move the carrier, such that one of the cassette buffering spaces is aligned with the input table, configured to control the input table actuator to move the input table with the cassette into the aligned cassette buffering space, and configured to control the input table to load the cassette into the aligned cassette buffering space.

    Abstract translation: 用于加工工具的装载端口包括载体,载体致动器,输入工作台,输入工作台致动器和控制器。 载体具有多个盒缓冲空间。 承载件相对于处理工具是可移动的。 载体致动器可操作地连接到载体。 输入表被配置为接收至少一个盒。 输入表相对于载体是可移动的。 输入表致动器可操作地连接到输入表。 所述控制器被配置成控制所述载体致动器以移动所述载体,使得所述盒缓冲空间中的一个与所述输入台对准,所述输入台配置成控制所述输入台致动器以使所述输入台与所述盒移动到所述对准的盒缓冲空间 并且被配置为控制输入表以将盒装载到对准的盒缓冲空间中。

    AUTOMATED MASK STORAGE AND RETRIEVAL SYSTEM
    3.
    发明申请

    公开(公告)号:US20190121245A1

    公开(公告)日:2019-04-25

    申请号:US16166993

    申请日:2018-10-22

    Abstract: An automated photomask storage and retrieval system includes a plurality of mobile storage units aligned in a first direction. Each mobile storage unit is movable in the first direction and includes a plurality of storage cells. A gantry is disposed over the plurality of mobile storage units. The gantry includes a supporting frame movable in the first direction. The plurality of mobile storage units interpose a pair of supporting members of the supporting frame. A beam connects the pair of supporting members and is movable along the pair of supporting members in a second direction perpendicular to the first direction. The beam includes a plurality of buffer cells. A robotic arm is disposed adjacent to the plurality of buffer cells and movable along the beam. The robotic arm is configured to transfer a container containing a photomask between a storage cell and a buffer cell.

    VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

    公开(公告)号:US20250112081A1

    公开(公告)日:2025-04-03

    申请号:US18981155

    申请日:2024-12-13

    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

    VACUUM WAFER CHUCK FOR MANUFACTURING SEMICONDUCTOR DEVICES

    公开(公告)号:US20220059393A1

    公开(公告)日:2022-02-24

    申请号:US16998461

    申请日:2020-08-20

    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

    AUTOMATED MASK STORAGE AND RETRIEVAL SYSTEM
    8.
    发明申请

    公开(公告)号:US20170343906A1

    公开(公告)日:2017-11-30

    申请号:US15168424

    申请日:2016-05-31

    CPC classification number: G03F7/70741

    Abstract: An automated photomask storage and retrieval system includes a plurality of mobile storage units aligned in a first direction. Each mobile storage unit is movable in the first direction and includes a plurality of storage cells. A gantry is disposed over the plurality of mobile storage units. The gantry includes a supporting frame movable in the first direction. The plurality of mobile storage units interpose a pair of supporting members of the supporting frame. A beam connects the pair of supporting members and is movable along the pair of supporting members in a second direction perpendicular to the first direction. The beam includes a plurality of buffer cells. A robotic arm is disposed adjacent to the plurality of buffer cells and movable along the beam. The robotic arm is configured to transfer a container containing a photomask between a storage cell and a buffer cell.

    WAFER TRANSFER METHOD AND SYSTEM
    9.
    发明申请
    WAFER TRANSFER METHOD AND SYSTEM 有权
    转移方法和系统

    公开(公告)号:US20160111311A1

    公开(公告)日:2016-04-21

    申请号:US14518373

    申请日:2014-10-20

    CPC classification number: H01L21/67259 H01L21/67265 H01L21/67778 H01L21/68

    Abstract: A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.

    Abstract translation: 晶片转印方法包括以下步骤。 检测晶片盒中的第一晶片的初始位置。 基于第一晶片的初始位置来确定晶片盒中的拾取进入位置,其中拾取进入位置与第一晶片的初始位置间隔开。 晶片转印刀片移动到拾取进入位置。

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