公开(公告)号：US20190006571A1

公开(公告)日：2019-01-03

申请号：US15637900

申请日：2017-06-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Hsien TSAI ,  Shang-Ying TSAI ,  Fu-Lung HSUEH ,  Shih-Ming YANG ,  Jheng-Yuan WANG ,  Ming-De CHEN

IPC: H01L35/32 ,  H01L35/34 ,  H01L35/04 ,  H01L35/22

CPC classification number: H01L35/32 ,  H01L35/04 ,  H01L35/22 ,  H01L35/34

Abstract: A semiconductor device includes a substrate; a first thermoelectric conduction leg, disposed on the substrate, and doped with a first type of dopant; a second thermoelectric conduction leg, disposed on the substrate, and doped with a second type of dopant, wherein the first and second thermoelectric conduction legs are spatially spaced from each other but disposed along a common row on the substrate; and a first intermediate thermoelectric conduction structure, disposed on a first end of the second thermoelectric conduction leg, and doped with the first type of dopant.

公开(公告)号：US20220209093A1

公开(公告)日：2022-06-30

申请号：US17571299

申请日：2022-01-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ming-Hsien TSAI ,  Shang-Ying TSAI ,  Fu-Lung HSUEH ,  Shih-Ming YANG ,  Jheng-Yuan WANG ,  Ming-De CHEN

IPC: H01L35/32 ,  H01L35/34 ,  H01L35/04 ,  H01L35/22

Abstract: A semiconductor device includes a substrate; a first thermoelectric conduction leg, disposed on the substrate, and doped with a first type of dopant; a second thermoelectric conduction leg, disposed on the substrate, and doped with a second type of dopant, wherein the first and second thermoelectric conduction legs are spatially spaced from each other but disposed along a common row on the substrate; and a first intermediate thermoelectric conduction structure, disposed on a first end of the second thermoelectric conduction leg, and doped with the first type of dopant.

公开(公告)号：US20250112081A1

公开(公告)日：2025-04-03

申请号：US18981155

申请日：2024-12-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chien-Fa LEE ,  Chin-Lin CHOU ,  Shang-Ying TSAI ,  Shou-Wen KUO ,  Kuei-Sung CHANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU ,  Chun-wen CHENG

IPC: H01L21/683 ,  B25B11/00

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

公开(公告)号：US20220059393A1

公开(公告)日：2022-02-24

申请号：US16998461

申请日：2020-08-20

Applicant: Taiwan Semiconductor Manufacturing Co, Ltd.

Inventor： Chien-Fa LEE ,  Chin-Lin CHOU ,  Shang-Ying TSAI ,  Shou-Wen KUO ,  Kuei-Sung CHANG ,  Jiun-Rong PAI ,  Hsu-Shui LIU ,  Chun-wen CHENG

IPC: H01L21/683 ,  B25B11/00

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

公开(公告)号：US20150284240A1

公开(公告)日：2015-10-08

申请号：US14276295

申请日：2014-05-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chia-Hua CHU ,  Chun-Wen CHENG ,  Shang-Ying TSAI ,  Chin-Wei LIANG

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0041 ,  B81B7/02 ,  B81C1/00238 ,  B81C1/00293

Abstract: A micro-electro mechanical system (MEMS) device is provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first closed chamber between the MEMS substrate and the cap substrate, and the first movable element is in the first closed chamber. The MEMS device further includes an outgassing layer in the first closed chamber. In addition, the MEMS device includes a second closed chamber between the MEMS substrate and the cap substrate, and the second movable element is in the second closed chamber.

Abstract translation: 提供了微机电系统（MEMS）装置。 MEMS器件包括盖衬底和与衬底接合的MEMS衬底。 MEMS基板包括第一可移动元件和第二可移动元件。 MEMS器件还包括在MEMS衬底和盖衬底之间的第一闭合腔，并且第一可移动元件位于第一封闭腔室中。 MEMS装置还包括在第一封闭室中的除气层。 另外，MEMS器件包括在MEMS衬底和盖衬底之间的第二闭合腔，并且第二可移动元件位于第二闭合腔中。

公开(公告)号：US20150137280A1

公开(公告)日：2015-05-21

申请号：US14525827

申请日：2014-10-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chia-Hua CHU ,  Chun-Wen CHENG ,  Shang-Ying TSAI ,  Chin-Wei LIANG

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B7/02 ,  B81C1/00238

Abstract: A structure and a formation method of a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first enclosed space surrounded by the MEMS substrate and the cap substrate, and the first movable element is in the first enclosed space. The MEMS device further includes a second enclosed space surrounded by the MEMS substrate and the cap substrate, and the second movable element is in the second enclosed space. In addition, the MEMS device includes a pressure-changing layer in the first enclosed space.

Abstract translation: 提供了微机电系统（MEMS）装置的结构和形成方法。 MEMS器件包括盖衬底和与衬底接合的MEMS衬底。 MEMS基板包括第一可移动元件和第二可移动元件。 MEMS器件还包括由MEMS衬底和盖衬底围绕的第一封闭空间，第一可移动元件位于第一封闭空间中。 MEMS器件还包括由MEMS衬底和盖衬底围绕的第二封闭空间，并且第二可移动元件位于第二封闭空间中。 此外，MEMS器件在第一封闭空间中包括压力变化层。