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公开(公告)号：US20220382004A1
公开(公告)日：2022-12-01
申请号：US17332988
申请日：2021-05-27
发明人： Chung-Ming Weng , Chen-Hua Yu , Chung-Shi Liu , Hao-Yi Tsai , Cheng-Chieh Hsieh , Hung-Yi Kuo , Tsung-Yuan Yu , Hua-Kuei Lin , Yu-Hsiang Hu , Chewn-Pu Jou , Feng-Wei Kuo
摘要： An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.
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公开(公告)号：US11508656B2
公开(公告)日：2022-11-22
申请号：US17359892
申请日：2021-06-28
发明人： Kuo Lung Pan , Shu-Rong Chun , Teng-Yuan Lo , Hung-Yi Kuo , Chih-Horng Chang , Tin-Hao Kuo , Hao-Yi Tsai
IPC分类号： H01L23/522 , H01L21/48 , H01L21/56 , H01L21/768 , H01L23/29 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/065
摘要： In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.
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公开(公告)号：US11506843B1
公开(公告)日：2022-11-22
申请号：US17319103
申请日：2021-05-13
发明人： Chung-Ming Weng , Chen-Hua Yu , Chung-Shi Liu , Hao-Yi Tsai , Cheng-Chieh Hsieh , Hung-Yi Kuo , Che-Hsiang Hsu , Chewn-Pu Jou , Feng-Wei Kuo , Min-Hsiang Hsu
摘要： A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.
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公开(公告)号：US20220285317A1
公开(公告)日：2022-09-08
申请号：US17192903
申请日：2021-03-05
发明人： Tsung-Yuan Yu , Hung-Yi Kuo , Cheng-Chieh Hsieh , Hao-Yi Tsai , Chung-Shi Liu , Chen-Hua Yu
IPC分类号： H01L25/065 , H01L23/31 , H01L23/00 , H01L21/56
摘要： A package structure and method of forming the same are provided. The package structure includes a semiconductor unit, a package component and an underfill layer. The semiconductor structure unit includes a first semiconductor structure and a second semiconductor structure disposed as side by side, and an isolation region laterally between the first semiconductor structure and the second semiconductor structure. The isolation region vertically extends from a top surface to a bottom surface of the semiconductor structure unit. The semiconductor structure unit is disposed on and electrically connected to the package component. The underfill layer is disposed to fill a space between the semiconductor structure unit and the package component.
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公开(公告)号：US20220208680A1
公开(公告)日：2022-06-30
申请号：US17696910
申请日：2022-03-17
发明人： Po-Yuan Teng , Hung-Yi Kuo , Hao-Yi Tsai , Tin-Hao Kuo , Yu-Chia Lai , Shih-Wei Chen
IPC分类号： H01L23/538 , H01L23/31 , H01L23/473 , H01L21/56 , H01L21/48
摘要： A semiconductor device includes a first chip package, a heat dissipation structure and an adapter. The first chip package includes a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die has an active surface and a back surface opposite to the active surface. The heat dissipation structure is connected to the chip package. The adapter is disposed over the first chip package and electrically connected to the semiconductor die.
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公开(公告)号：US11075176B2
公开(公告)日：2021-07-27
申请号：US16569890
申请日：2019-09-13
发明人： Tzu-Sung Huang , Chen-Hua Yu , Hung-Yi Kuo , Hao-Yi Tsai , Ming Hung Tseng
IPC分类号： H01L23/485 , H01L23/552 , H01L23/64 , H01L49/02 , H01L21/48 , H01L21/50 , H01L21/56 , H01L21/683 , H01L23/31
摘要： In an embodiment, a device includes: a conductive shield on a first dielectric layer; a second dielectric layer on the first dielectric layer and the conductive shield, the first and second dielectric layers surrounding the conductive shield, the second dielectric layer including: a first portion disposed along an outer periphery of the conductive shield; a second portion extending through a center region of the conductive shield; and a third portion extending through a channel region of the conductive shield, the third portion connecting the first portion to the second portion; a coil on the second dielectric layer, the coil disposed over the conductive shield; an integrated circuit die on the second dielectric layer, the integrated circuit die disposed outside of the coil; and an encapsulant surrounding the coil and the integrated circuit die, top surfaces of the encapsulant, the integrated circuit die, and the coil being level.
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公开(公告)号：US11004811B2
公开(公告)日：2021-05-11
申请号：US17002624
申请日：2020-08-25
发明人： Vincent Chen , Hung-Yi Kuo , Chuei-Tang Wang , Hao-Yi Tsai , Chen-Hua Yu , Wei-Ting Chen , Ming Hung Tseng , Yen-Liang Lin
摘要： A semiconductor structure includes a transceiver, a molding surrounding the transceiver, and a RDL disposed over the transceiver. The RDL includes an antenna and a dielectric layer. The antenna is disposed over and electrically connected to the transceiver. The dielectric layer surrounds the antenna. The antenna includes an elongated portion and a via portion. The elongated portion extends over the molding, and the via portion is electrically connected to the transceiver.
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公开(公告)号：US10720388B2
公开(公告)日：2020-07-21
申请号：US16192005
申请日：2018-11-15
发明人： Chen-Hua Yu , Chiang-Jui Chu , Chung-Shi Liu , Hao-Yi Tsai , Ming Hung Tseng , Hung-Yi Kuo
IPC分类号： H01L29/00 , H01L23/522 , H01L23/31 , H01L25/065 , H01L25/00 , H01L49/02 , H01L21/48 , H01L21/56 , H01L23/48 , H01L23/498 , H01L23/538 , H01L23/00 , H01L25/16 , H01L21/683
摘要： A package includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die. A coil extends from the top surface to a bottom surface of the encapsulating material, and the device die is in the region encircled by the coil. At least one dielectric layer is formed over the encapsulating material and the coil. A plurality of redistribution lines is in the at least one dielectric layer. The coil is electrically coupled to the device die through the plurality of redistribution lines.
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公开(公告)号：US10269904B2
公开(公告)日：2019-04-23
申请号：US14529772
申请日：2014-10-31
发明人： Chen-Hua Yu , Mirng-Ji Lii , Hung-Yi Kuo , Hao-Yi Tsai , Tsung-Yuan Yu , Min-Chien Hsiao , Chao-Wen Shih
IPC分类号： H01L23/522 , H01L29/40 , H01L21/765 , H01L23/00 , H01L23/525
摘要： The present disclosure provides a semiconductor structure. The semiconductor structure includes a circuit region, a seal ring region and an assembly isolation region. The circuit region includes a first conductive layer. The seal ring region includes a second conductive layer. The assembly isolation region is between the circuit region and the seal ring region. The first conductive layer and the second conductive layer respectively include a portion extending into the assembly isolation region thereby forming an electric component in the assembly isolation region.
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公开(公告)号：US09943239B2
公开(公告)日：2018-04-17
申请号：US15062901
申请日：2016-03-07
发明人： Hung-Yi Kuo , Hao-Yi Tsai , Hsien-Ming Tu , Shih-Wei Liang , Chang-Pin Huang , Chih-Hua Chen , Yu-Feng Chen , Chen-Hua Yu
CPC分类号： A61B5/02427 , A61B5/721 , A61B2562/0233 , A61B2562/12 , H04B10/40
摘要： An optical sensing system is disclosed. The optical sensing system includes a printed circuit board (PCB), a supporter and an optical sensor. The PCB includes a top surface, a bottom surface and a through cavity, wherein the through cavity extends downwardly from the top surface to the bottom surface. The supporter has a top surface and a bottom surface. The optical sensor is bonded and coupled to the top surface of the supporter, wherein the optical sensor includes a primary optic structure. Wherein the supporter is flipped over and bonded to the PCB with the top surface facing the through cavity, so that the optical sensor is coupled to the PCB and at least partially extends to the through cavity. Associated electronic devices are also disclosed.
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