摘要:
A command decoder receives an externally supplied command independently of an internal clock signal, decodes the command, generates a column access mode instruction signal, and activates a column address activation signal when the internal clock signal rises. An internal column address signal generating circuit generates an internal column address signal from an externally supplied address signal according to the column address activation signal. Accordingly, the internal column address is generated at an advanced timing to enable a following column selecting operation to be started at a faster timing. A synchronous semiconductor memory device capable of performing the column selecting operation at a high speed is thus provided.
摘要:
A command decoder receives an externally supplied command independently of an internal clock signal, decodes the command, generates a column access mode instruction signal, and activates a column address activation signal when the internal clock signal rises. An internal column address signal generating circuit generates an internal column address signal from an externally supplied address signal according to the column address activation signal. Accordingly, the internal column address is generated at an advanced timing to enable a following column selecting operation to be started at a faster timing. A synchronous semiconductor memory device capable of performing the column selecting operation at a high speed is thus provided.
摘要:
A voltage generation circuit has a charge pump circuit, a clamping circuit for clamping an output voltage of the charge pump circuit, and detecting means for detecting the output voltage of the charge pump circuit and supplying a control signal for boosting the output voltage to the charge pump circuit when the detected output voltage is lower than a reference voltage, wherein the detecting means includes a circuit for stopping supply of a control signal. This circuit stops supply of the control signal to the charge pump circuit when the clamping circuit is in operation.
摘要:
A semiconductor memory device is provided which can apply a voltage stress to every adjacent bit lines even when data is written using a data bit compression function in a burn-in test mode. More specifically, when data is written using the data bit compression function in the test mode, an input buffer circuit is brought to a state in which it receives a signal corresponding to a signal dq0 applied to a specific input/output terminal by a switch circuit controlled by a test mode specify signal TE in common. When an inversion designate signal INV is in an active state, a complementary signal corresponding to a signal obtained by inversion of signal dq0 by an inverting circuit is output to internal data buses IO0, ZIO0, and IO2, ZIO2. On the other hand, a complementary signal corresponding to signal dq0 is output to internal data buses IO1, ZIO1, and IO3, ZIO3.
摘要:
A ring oscillator according to the invention includes a plurality of inverters cascade-connected between an input node and an output node. Each inverter includes four transistors connected in series between a power supply node and a ground node. A first pair of transistors each have a channel sized to have an input capacitance for delaying the signal of a preceding stage inverter for a prescribed time period. A second pair of transistors are coupled to a current mirror circuit and limits current flowing through the first pair of transistors. Thus, power consumption for obtaining a signal in a prescribed cycle is reduced.
摘要:
A reference voltage generating circuit having a fuse for controlling resistance includes a burn-in circuit for supplying burn-in voltage between opposite terminals of the fuse when a control signal is inputted to the burn-in circuit.
摘要:
An output buffer includes an NAND circuit, a first N channel MOS transistor connected between a power supply node and an output node, a second N channel MOS transistor connected between the output node and a ground node, the first to third drive circuits, and a delay circuit. The power supply voltage is first supplied to the gate of the second N channel MOS transistor by the second drive circuit. After a delay time delayed by the delay circuit has passed, boosted voltage is supplied to the gate of the second N channel MOS transistor by the third drive circuit. Accordingly, the output buffer is not influenced by the ringing and the pull-down characteristic improves.