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公开(公告)号:US20120273462A1
公开(公告)日:2012-11-01
申请号:US13095956
申请日:2011-04-28
CPC分类号: H01L21/67086 , H01L21/67017 , H01L21/6704 , H01L21/67057 , H01L21/67075
摘要: An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the etchant, and a workpiece handler configured to move a workpiece through the laminar flow of the etchant along a predefined track.
摘要翻译: 提供了一种蚀刻装置,该蚀刻装置包括一个包括蚀刻剂的处理室,被配置为提供蚀刻剂层流的结构,以及一个被配置为沿着预定轨迹使工件移动通过蚀刻剂的层流的工件处理器。
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公开(公告)号:US09318358B2
公开(公告)日:2016-04-19
申请号:US13095956
申请日:2011-04-28
CPC分类号: H01L21/67086 , H01L21/67017 , H01L21/6704 , H01L21/67057 , H01L21/67075
摘要: An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the etchant, and a workpiece handler configured to move a workpiece through the laminar flow of the etchant along a predefined track.
摘要翻译: 提供了一种蚀刻装置,该蚀刻装置包括一个包括蚀刻剂的处理室,被配置为提供蚀刻剂层流的结构,以及一个被配置为沿着预定轨迹使工件移动通过蚀刻剂的层流的工件处理器。
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公开(公告)号:US20130084658A1
公开(公告)日:2013-04-04
申请号:US13252816
申请日:2011-10-04
CPC分类号: H01L21/78 , H01L21/50 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67 , H01L21/67092 , H01L21/67144 , H01L21/683 , H01L21/6836 , H01L23/3107 , H01L2221/68322 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要: In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process.
摘要翻译: 根据本发明的实施例,通过在框架上配置多个半导体器件来制造半导体器件,所述半导体器件具有粘合箔。 多个半导体器件附接到粘合箔。 使用二氧化碳喷射和/或激光工艺,使用粘合剂箔从框架中移除多个半导体器件。
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公开(公告)号:US08883565B2
公开(公告)日:2014-11-11
申请号:US13252816
申请日:2011-10-04
CPC分类号: H01L21/78 , H01L21/50 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/67 , H01L21/67092 , H01L21/67144 , H01L21/683 , H01L21/6836 , H01L23/3107 , H01L2221/68322 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2924/0002 , H01L2924/00
摘要: In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process.
摘要翻译: 根据本发明的实施例,通过在框架上配置多个半导体器件来制造半导体器件,所述半导体器件具有粘合箔。 多个半导体器件附接到粘合箔。 使用二氧化碳喷射和/或激光工艺,使用粘合剂箔从框架中移除多个半导体器件。
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