公开(公告)号：US20130084658A1

公开(公告)日：2013-04-04

申请号：US13252816

申请日：2011-10-04

申请人： Mathias Vaupel ,  Sebastian Bernrieder ,  Adolf Koller ,  Stefan Martens

发明人： Mathias Vaupel ,  Sebastian Bernrieder ,  Adolf Koller ,  Stefan Martens

IPC分类号： H01L21/66 ,  H01L21/50 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67 ,  H01L21/67092 ,  H01L21/67144 ,  H01L21/683 ,  H01L21/6836 ,  H01L23/3107 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

摘要： In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process.

摘要翻译： 根据本发明的实施例，通过在框架上配置多个半导体器件来制造半导体器件，所述半导体器件具有粘合箔。 多个半导体器件附接到粘合箔。 使用二氧化碳喷射和/或激光工艺，使用粘合剂箔从框架中移除多个半导体器件。

公开(公告)号：US08883565B2

公开(公告)日：2014-11-11

申请号：US13252816

申请日：2011-10-04

申请人： Mathias Vaupel ,  Sebastian Bernrieder ,  Adolf Koller ,  Stefan Martens

发明人： Mathias Vaupel ,  Sebastian Bernrieder ,  Adolf Koller ,  Stefan Martens

IPC分类号： H01L21/00 ,  H01L21/78 ,  H01L21/683 ,  H01L21/67 ,  H01L21/50 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/78 ,  H01L21/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67 ,  H01L21/67092 ,  H01L21/67144 ,  H01L21/683 ,  H01L21/6836 ,  H01L23/3107 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/0002 ,  H01L2924/00

摘要： In accordance with an embodiment of the present invention, a semiconductor device is manufactured by arranging a plurality of semiconductor devices on a frame with an adhesive foil. The plurality of semiconductor devices is attached to the adhesive foil. The plurality of semiconductor devices is removed from the frame with the adhesive foil using a carbon dioxide snow jet and/or a laser process.

摘要翻译： 根据本发明的实施例，通过在框架上配置多个半导体器件来制造半导体器件，所述半导体器件具有粘合箔。 多个半导体器件附接到粘合箔。 使用二氧化碳喷射和/或激光工艺，使用粘合剂箔从框架中移除多个半导体器件。

公开(公告)号：US08809120B2

公开(公告)日：2014-08-19

申请号：US13029984

申请日：2011-02-17

申请人： Giuseppe Miccoli ,  Adolf Koller ,  Jayachandran Bhaskaran

发明人： Giuseppe Miccoli ,  Adolf Koller ,  Jayachandran Bhaskaran

IPC分类号： H01L21/301

CPC分类号： H01L21/78 ,  B23K26/032 ,  B23K26/042 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50

摘要： A method of dicing a semiconductor wafer includes forming a layer stack on a first main surface of a substrate. The layer stack and a portion of the substrate are etched according to a pattern defining an intended dicing location to obtain a trench structure. The substrate is irradiated with a laser beam to locally modify the substrate between a bottom of the trench structure and a second main surface of the substrate opposite to the first main surface.

摘要翻译： 切割半导体晶片的方法包括在基板的第一主表面上形成层叠体。 根据限定预定切割位置的图案蚀刻层叠层和基板的一部分以获得沟槽结构。 用激光束照射衬底以局部地修改沟槽结构的底部和与第一主表面相对的衬底的第二主表面之间的衬底。

公开(公告)号：US08207018B2

公开(公告)日：2012-06-26

申请号：US12903482

申请日：2010-10-13

申请人： Horst Theuss ,  Adolf Koller

发明人： Horst Theuss ,  Adolf Koller

IPC分类号： H01L21/00

CPC分类号： H05K3/3442 ,  H01L21/78 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/02371 ,  H01L2224/035 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/29035 ,  H01L2224/29111 ,  H01L2224/32105 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H05K2201/098 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2224/05552

摘要： A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip.

摘要翻译： 公开了半导体封装。 一个实施例提供了从晶片单个化的半导体封装，其包括限定有源表面的芯片，与有源表面相对的后侧，以及在有源表面和背面之间延伸的周边; 设置在所述活动表面上的接触垫; 以及从接触垫延伸到芯片周边的一部分上的金属化层。

公开(公告)号：US20100201356A1

公开(公告)日：2010-08-12

申请号：US12369255

申请日：2009-02-11

申请人： Adolf Koller ,  Klaus Elian

发明人： Adolf Koller ,  Klaus Elian

IPC分类号： G01R33/09 ,  H01L21/28

CPC分类号： G01R33/098 ,  B29C45/0013 ,  B29C45/14639 ,  B29K2995/0008 ,  B82Y25/00 ,  G01D1/00 ,  G01D15/00 ,  G01D21/00 ,  G01P3/487 ,  G01P3/488 ,  G01R33/093 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00012

摘要： A sensor including a substrate and magnetic material. The substrate has a main major surface and includes at least two spaced apart ferromagnetic layers. The magnetic material encapsulates the substrate such that the magnetic material is adjacent the main major surface.

摘要翻译： 包括基板和磁性材料的传感器。 衬底具有主要主表面并且包括至少两个间隔开的铁磁层。 磁性材料封装基板，使得磁性材料与主要主表面相邻。

公开(公告)号：US20120211748A1

公开(公告)日：2012-08-23

申请号：US13029984

申请日：2011-02-17

申请人： Giuseppe Miccoli ,  Adolf Koller ,  Jayachandran Bhaskaran

发明人： Giuseppe Miccoli ,  Adolf Koller ,  Jayachandran Bhaskaran

IPC分类号： H01L21/268 ,  H01L29/30 ,  H01L29/04

CPC分类号： H01L21/78 ,  B23K26/032 ,  B23K26/042 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50

摘要： A method of dicing a semiconductor wafer includes forming a layer stack on a first main surface of a substrate. The layer stack and a portion of the substrate are etched according to a pattern defining an intended dicing location to obtain a trench structure. The substrate is irradiated with a laser beam to locally modify the substrate between a bottom of the trench structure and a second main surface of the substrate opposite to the first main surface.

摘要翻译： 切割半导体晶片的方法包括在基板的第一主表面上形成层叠体。 根据限定预定切割位置的图案蚀刻层叠层和基板的一部分以获得沟槽结构。 用激光束照射衬底以局部地修改沟槽结构的底部和与第一主表面相对的衬底的第二主表面之间的衬底。

公开(公告)号：US07772693B2

公开(公告)日：2010-08-10

申请号：US11677774

申请日：2007-02-22

申请人： Adolf Koller ,  Horst Theuss ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Reinhard Ploss

发明人： Adolf Koller ,  Horst Theuss ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Reinhard Ploss

IPC分类号： H01L23/34

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45099

摘要： A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components.

摘要翻译： 面板具有具有上部第一金属层和多个垂直半导体部件的基板。 每种情况下的垂直半导体部件具有第一侧，其具有第一负载电极和控制电极，而第二侧具有第二负载电极。 半导体部件的第二面分别安装在基板的金属层上。 半导体部件被配置成使得相邻的半导体部件的边缘彼此分离。 第二金属层布置在半导体部件之间的分离区域中。

公开(公告)号：US20090102054A1

公开(公告)日：2009-04-23

申请号：US11876241

申请日：2007-10-22

申请人： Horst Theuss ,  Adolf Koller

发明人： Horst Theuss ,  Adolf Koller

IPC分类号： H01L23/488 ,  H01L21/304

CPC分类号： H05K3/3442 ,  H01L21/78 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/02371 ,  H01L2224/035 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/29035 ,  H01L2224/29111 ,  H01L2224/32105 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H05K2201/098 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2224/05552

摘要： A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip.

摘要翻译： 公开了半导体封装。 一个实施例提供了从晶片单个化的半导体封装，其包括限定有源表面的芯片，与有源表面相对的后侧，以及在有源表面和背面之间延伸的周边; 设置在所述活动表面上的接触垫; 以及从接触垫延伸到芯片周边的一部分上的金属化层。

公开(公告)号：US20080191359A1

公开(公告)日：2008-08-14

申请号：US11677774

申请日：2007-02-22

申请人： Adolf Koller ,  Horst Theuss ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Reinhard Ploss

发明人： Adolf Koller ,  Horst Theuss ,  Ralf Otremba ,  Josef Hoeglauer ,  Helmut Strack ,  Reinhard Ploss

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45099

摘要： A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components.

摘要翻译： 面板具有具有上部第一金属层和多个垂直半导体部件的基板。 每种情况下的垂直半导体部件具有第一侧，其具有第一负载电极和控制电极，而第二侧具有第二负载电极。 半导体部件的第二面分别安装在基板的金属层上。 半导体部件被配置成使得相邻的半导体部件的边缘彼此分离。 第二金属层布置在半导体部件之间的分离区域中。

公开(公告)号：US10107875B2

公开(公告)日：2018-10-23

申请号：US12627848

申请日：2009-11-30

申请人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

发明人： Klaus Elian ,  Martin Petz ,  Uwe Schindler ,  Horst Theuss ,  Adolf Koller

IPC分类号： G01R33/09 ,  B82Y25/00 ,  G01D5/244 ,  G01P1/02 ,  G01P3/488 ,  H01L43/02

摘要： An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.