公开(公告)号：US07245884B2

公开(公告)日：2007-07-17

申请号：US09884274

申请日：2001-06-19

申请人： Toshifumi Oida ,  Takahiro Watanabe ,  Eigoro Ina ,  Norio Nakajima

发明人： Toshifumi Oida ,  Takahiro Watanabe ,  Eigoro Ina ,  Norio Nakajima

IPC分类号： H04B1/38

CPC分类号： H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q23/00 ,  H04B1/38 ,  H05K1/16 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate.

摘要翻译： RF模块包括多层基板。 基带IC，存储器IC，石英振荡器和表面安装部件安装在多层基板的上表面上。 金属帽也附接到多层基板的上表面。 在多层基板的下表面的大致中央形成有空腔。 第一个RF-IC和第二个RF-IC嵌入在腔中。 用于提供基带IC与存储器IC，通孔，RF无源部件和屏蔽接地电极图案之间的连接的布线图案设置在多层基板的内部。