公开(公告)号：US08912844B2

公开(公告)日：2014-12-16

申请号：US13647392

申请日：2012-10-09

Applicant: United Microelectronics Corp.

Inventor： Tzung-Lin Li ,  Chun-Chang Wu ,  Chih-Yu Tseng

IPC: H03K5/00

CPC classification number: H01L28/40 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/64 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/48091 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06568 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a semiconductor structure, including a substrate, a first TSV, an inductor and a capacitor. The first TSV is disposed in the substrate and has a first signal. The inductor is disposed in the substrate. The capacitor is electrically connected to the inductor to form an LC circuit to bypass the noise from the first signal. The present invention further provides a method of reducing the signal noise in a semiconductor structure.

Abstract translation: 本发明提供一种包括基板，第一TSV，电感器和电容器的半导体结构。 第一TSV设置在基板中并且具有第一信号。 电感器设置在基板中。 电容器电连接到电感器以形成LC电路以绕过来自第一信号的噪声。 本发明还提供一种降低半导体结构中的信号噪声的方法。

公开(公告)号：US20140097890A1

公开(公告)日：2014-04-10

申请号：US13647392

申请日：2012-10-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Tzung-Lin Li ,  Chun-Chang Wu ,  Chih-Yu Tseng

IPC: H01L27/06 ,  H03K5/00

CPC classification number: H01L28/40 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/64 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/48091 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06568 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention provides a semiconductor structure, including a substrate, a first TSV, an inductor and a capacitor. The first TSV is disposed in the substrate and has a first signal. The inductor is disposed in the substrate. The capacitor is electrically connected to the inductor to form an LC circuit to bypass the noise from the first signal. The present invention further provides a method of reducing the signal noise in a semiconductor structure.

Abstract translation: 本发明提供一种包括基板，第一TSV，电感器和电容器的半导体结构。 第一TSV设置在基板中并且具有第一信号。 电感器设置在基板中。 电容器电连接到电感器以形成LC电路以绕过来自第一信号的噪声。 本发明还提供一种降低半导体结构中的信号噪声的方法。