公开(公告)号：US20230178413A1

公开(公告)日：2023-06-08

申请号：US18072730

申请日：2022-12-01

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Dzafir Bin Mohd SHARIFF ,  IL KWON SHIM ,  Enrique E. SARILE, JR. ,  Jackson Fernandez ROSARIO ,  Ronnie M. DE VILLA ,  Chan Loong NEO

IPC: H01L21/683 ,  H01L21/78 ,  B23K26/38 ,  H01L21/3065

CPC classification number: H01L21/6836 ,  B23K26/38 ,  H01L21/78 ,  H01L21/3065 ,  H01L2221/68327

Abstract: Reliable plasma dicing of a wafer with a die attach film (DAF) to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. A combination of plama dicing and laser cutting is employed. Plasma is employed to etch the wafer while laser is employed to cut the DAF.

公开(公告)号：US20230154795A1

公开(公告)日：2023-05-18

申请号：US18054547

申请日：2022-11-11

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Dzafir Bin Mohd Shariff ,  IL KWON SHIM ,  Enrique Jr Sarile ,  Jackson Fernandez Rosario ,  Ronnie M. De Villa ,  Chan Loong Neo

IPC: H01L21/78 ,  H01L21/308

CPC classification number: H01L21/78 ,  H01L21/3086 ,  H01L21/3085 ,  H01L21/3081

Abstract: The present disclosure relates to plasma dicing of wafer. More specifically, the present disclosure is directed to frame masks and methods for plasma dicing wafers utilizing frame masks. The frame mask includes a mask frame, wherein the mask frame includes a top ring mask support and a side ring mask support. A plurality of mask segments suspended from the top ring mask support by segment supports, the mask segments are configured to define dicing channels on a blank wafer. The frame mask is configured to removably sit onto a frame lift assembly in a plasma chamber of a plasma dicing tool, when fitted onto the frame lift assembly, the mask segments are disposed above a wafer on a wafer ring frame for plasma dicing. The mask frame is configured to enable flow of plasma therethrough to the wafer to etch the wafer to form dicing channels defined by the mask segments.

公开(公告)号：US20250120204A1

公开(公告)日：2025-04-10

申请号：US18981677

申请日：2024-12-16

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  IL KWON SHIM

IPC: H10F39/00 ,  H10F39/95

Abstract: Multi-chip image sensor semiconductor packages and methods for forming such packages are disclosed. A multi-chip package includes at least one cover covering a sensor die. Some multi-chip packages include multiple covers for covering each sensor die. In one multi-chip packages, a single cover covers multiple sensor chips.

公开(公告)号：US20250038037A1

公开(公告)日：2025-01-30

申请号：US18393621

申请日：2023-12-21

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： IL KWON SHIM ,  Dzafir Bin Mohd Shariff ,  Ronnie M. De Villa ,  Enrique E. SARILE, JR. ,  Chee Kay Chow ,  Jackson Fernandez Rosario ,  Chan Loong Neo

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: Lamination systems and methods of fabricating devices are disclosed. The lamination system includes multiple processing modules for delaminating a backgrinding (BG) from a surface of the wafer and laminating a dicing tape on the surface of the wafer. The system includes a wafer receiving module which is configured to hold the wafer in place with a position chuck throughout the delamination and lamination process. By using a single positioning chuck, more efficient processing is achieved. For example, there is no need to re-lign the wafer when it is moved from one chuck to another.

公开(公告)号：US20220093664A1

公开(公告)日：2022-03-24

申请号：US17478978

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  IL KWON SHIM

IPC: H01L27/146

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover with a cover adhesive is disposed over a sensor region of the die and attached to the die by the cover adhesive. The cover adhesive is disposed in a cap bonding region of the protective cover.

公开(公告)号：US20220093482A1

公开(公告)日：2022-03-24

申请号：US17480090

申请日：2021-09-20

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Jeffrey Punzalan ,  IL KWON SHIM

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00

Abstract: A semiconductor package and a method of manufacturing thereof is disclosed. The package includes a package substrate having a die attach region with a die attached thereto. A protective cover is disposed over a sensor region of the die and attached to the die by a cover adhesive. The package includes a dam structure configured to protect components of the semiconductor package from contamination.