公开(公告)号：US11609836B2

公开(公告)日：2023-03-21

申请号：US17180897

申请日：2021-02-22

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei Lin ,  Ji-Fu Kung ,  Te-Hsuan Chen ,  Yi-Lin Hung

IPC: G06F11/00 ,  G06F11/32 ,  G06F11/30 ,  G06F11/34 ,  G06F18/214 ,  G05B23/02

Abstract: An operation method and an operation device of a failure detection and classification (FDC) model are provided. The operation method of the FDC model includes the following steps. A plurality of raw traces are continuously obtained. If the raw traces have started to be changed from the first waveform to the second waveform, whether at least N pieces in the race traces have been changed to the second waveform is determined. If at least N pieces in the raw traces have been changed to the second waveform, the raw traces which have been changed to the second waveform are automatically segmented to obtain several windows. An algorithm is automatically set for each of the windows. Through each of the algorithms, an indicator of each of the windows is obtained. The FDC model is retrained based on these indicators.

公开(公告)号：US11119625B1

公开(公告)日：2021-09-14

申请号：US17099872

申请日：2020-11-17

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zheng-Yang Li ,  Chung-Jung Chen ,  Chun-Man Li ,  Li-Hsin Yang ,  Ching-Pei Lin ,  Ji-Fu Kung

IPC: G06F3/0481 ,  G06F3/0484

Abstract: A remote control device for a manufacturing equipment and a method for detecting manual control are provided. The method for detecting the manual control on the manufacturing equipment includes the following steps. A cursor pattern is created. When the user interface is automatically controlled, a history location of the cursor pattern shown on a user interface of the manufacturing equipment is detected to obtain a location distribution. The location distribution is stored. A current location of the cursor pattern shown on the user interface is detected. If the current location is not within the location distribution, it is deemed that the user interface is manually controlled.

公开(公告)号：US10570507B2

公开(公告)日：2020-02-25

申请号：US15950152

申请日：2018-04-10

Applicant: United Microelectronics Corp.

Inventor： Neng-Hsing Shen ,  Chien-Wen Yang ,  Chun-Man Li ,  Ji-Fu Kung ,  Ching-Pei Lin

IPC: G06F19/00 ,  C23C14/54 ,  C23C14/48 ,  H01L21/66 ,  G06K9/00 ,  G05B15/02 ,  H01L21/265

Abstract: An apparatus for controlling an operation of a machine includes an optical recognition system, a control unit, and a remote control interface. The optical recognition system is configured to monitor and obtain actual operation information displayed on a panel of a processing machine in accordance with an operation time. The control unit is configured to receive the actual operation information and check the actual operation information with expected operation information. The expected operation information is obtained based on an operation model which is already built up corresponding to a current fabrication process. Deviation information between the actual operation information and the expected operation information is determined and converted into a parameter set. The remote control interface receives the parameter set and converts the parameter set into a control signal set to control the operation of the processing machine.

公开(公告)号：US20190276930A1

公开(公告)日：2019-09-12

申请号：US15950152

申请日：2018-04-10

Applicant: United Microelectronics Corp.

Inventor： Neng-Hsing Shen ,  Chien-Wen Yang ,  Chun-Man Li ,  Ji-Fu Kung ,  Ching-Pei Lin

IPC: C23C14/54 ,  C23C14/48 ,  H01L21/66 ,  G05B15/02 ,  G06K9/00

Abstract: An apparatus for controlling an operation of a machine includes an optical recognition system, a control unit, and a remote control interface. The optical recognition system is configured to monitor and obtain actual operation information displayed on a panel of a processing machine in accordance with an operation time. The control unit is configured to receive the actual operation information and check the actual operation information with expected operation information. The expected operation information is obtained based on an operation model which is already built up corresponding to a current fabrication process. Deviation information between the actual operation information and the expected operation information is determined and converted into a parameter set. The remote control interface receives the parameter set and converts the parameter set into a control signal set to control the operation of the processing machine.

公开(公告)号：US12061669B2

公开(公告)日：2024-08-13

申请号：US17343798

申请日：2021-06-10

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei Lin ,  Ming-Tsung Yeh ,  Chuan-Guei Wang ,  Ji-Fu Kung

IPC: G06F18/2134 ,  G06F18/2137 ,  G06N5/04 ,  G06V20/62

CPC classification number: G06F18/21345 ,  G06F18/2137 ,  G06N5/04 ,  G06V20/635

Abstract: A manufacturing data analyzing method and a manufacturing data analyzing device are provided. The manufacturing data analyzing method includes the following steps. Each of at least one numerical data, at least one image data and at least one text data is transformed into a vector. The vectors are gathered to obtain a combined vector. The combined vector is inputted into an inference model to obtain a defect cause and a modify suggestion.

公开(公告)号：US10656518B2

公开(公告)日：2020-05-19

申请号：US15844617

申请日：2017-12-17

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei Lin ,  Chuang-Tse Wang ,  Fa-Fu Hu

IPC: G03F1/84 ,  G06N3/08 ,  G06N3/04 ,  G03F7/20 ,  H01L21/66 ,  H01L21/67 ,  H01L21/027

Abstract: A method for automatic inline detection and wafer disposition includes the following steps. An exposure process is performed to wafers in an exposure apparatus. A virtual inspection is performed based on log files of the exposure process. A wafer automatic disposition is performed according to a result of the virtual inspection. An automatic inline detection and wafer disposition system includes a first computer system coupled to an exposure apparatus and a second computer system coupled to the first computer system. The exposure apparatus is configured to perform an exposure process to wafers, and the first computer system is configured to perform a virtual inspection based on log files of the exposure process. The second computer system is configured to receive a result of the virtual inspection and perform a wafer automatic disposition according to the result of the virtual inspection.

公开(公告)号：US20190187555A1

公开(公告)日：2019-06-20

申请号：US15844617

申请日：2017-12-17

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei Lin ,  Chuang-Tse Wang ,  Fa-Fu Hu

IPC: G03F1/84 ,  G06N3/08 ,  G06N3/04 ,  H01L21/027 ,  H01L21/66 ,  H01L21/67 ,  G03F7/20

CPC classification number: G03F1/84 ,  G03F7/20 ,  G03F7/7065 ,  G06N3/04 ,  G06N3/08 ,  H01L21/0274 ,  H01L21/67259 ,  H01L22/12

Abstract: A method for automatic inline detection and wafer disposition includes the following steps. An exposure process is performed to wafers in an exposure apparatus. A virtual inspection is performed based on log files of the exposure process. A wafer automatic disposition is performed according to a result of the virtual inspection. An automatic inline detection and wafer disposition system includes a first computer system coupled to an exposure apparatus and a second computer system coupled to the first computer system. The exposure apparatus is configured to perform an exposure process to wafers, and the first computer system is configured to perform a virtual inspection based on log files of the exposure process. The second computer system is configured to receive a result of the virtual inspection and perform a wafer automatic disposition according to the result of the virtual inspection.