公开(公告)号：US09644250B2

公开(公告)日：2017-05-09

申请号：US13585076

申请日：2012-08-14

申请人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H05K1/09

CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0355 ,  H01L2924/00

摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

公开(公告)号：US08063471B2

公开(公告)日：2011-11-22

申请号：US12441904

申请日：2007-09-26

申请人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： C22C9/04 ,  C22C9/00 ,  C22C9/02 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

摘要翻译： 提供具有高强度并且具有改善的氧化膜剥离性的Cu-Fe-P合金板，以解决诸如包装裂纹和剥离等问题。 本发明的电气电子部件用铜合金板是含有Fe：0.01〜0.50质量％，P：0.01〜0.15质量％，余量为Cu和不可避免的杂质的铜合金板。 中心线平均粗糙度Ra为0.2μm以下，最大高度Rmax为1.5μm以下，粗糙度曲线的峰值（度峰值）Rku为5.0以下，在根据 JIS B0601。

公开(公告)号：US20090311128A1

公开(公告)日：2009-12-17

申请号：US12374154

申请日：2007-06-20

申请人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： C22C9/00 ,  C22C9/04 ,  C22C9/02

CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0355 ,  H01L2924/00

摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more.In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less.In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

摘要翻译： 通过将Cu-Fe-P合金板的表面中{311}面的衍射强度的半值宽度β除以其峰值高度而得到的值的位错密度， H为0.015以上。 另外，具有Fe含量较低的Cu-Fe-P合金板具有（I（200））与（I（200））衍射强度的比（I（200）/ I（220） （220））的衍射强度为0.3以下。 此外，具有Fe含量较低的Cu-Fe-P合金板具有通过FE-SEM使用EBSP的结晶取向分析法测定的黄铜取向的取向分布密度为25％的结构， 更多; 平均粒径为6.0μm以下。

公开(公告)号：US20120039743A1

公开(公告)日：2012-02-16

申请号：US13283012

申请日：2011-10-27

申请人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： C22C9/02 ,  C22C9/00 ,  C22C9/04

CPC分类号： C22C9/04 ,  C22C9/00 ,  C22C9/02 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

公开(公告)号：US09631260B2

公开(公告)日：2017-04-25

申请号：US12374154

申请日：2007-06-20

申请人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H05K1/09

CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0355 ,  H01L2924/00

摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width p of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I (200) /I (220)) of intensity of diffraction of (1 (200)) from the (200) plane in the sheet surface to intensity of diffraction of (I (220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

公开(公告)号：US20120308429A1

公开(公告)日：2012-12-06

申请号：US13585076

申请日：2012-08-14

申请人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： C22C9/02

CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0355 ,  H01L2924/00

摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

摘要翻译： 剪切平面比减小了位错密度，其中通过将半值宽度＆bgr; Cu-Fe-P合金板表面的{311}面的衍射强度的峰值高度H为0.015以上。 另外，具有Fe含量较低的Cu-Fe-P合金板具有（I（200））与（I（200））衍射强度的比（I（200）/ I（220） （220））的衍射强度为0.3以下。 此外，具有Fe含量较低的Cu-Fe-P合金板具有通过FE-SEM使用EBSP的结晶取向分析法测定的黄铜取向的取向分布密度为25％的结构， 更多; 并且片材中的平均粒径为6.0μm以下。

公开(公告)号：US20120039742A1

公开(公告)日：2012-02-16

申请号：US13282915

申请日：2011-10-27

申请人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： C22C9/02 ,  C22C9/04 ,  C22C9/00

CPC分类号： C22C9/04 ,  C22C9/00 ,  C22C9/02 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

公开(公告)号：US20100072584A1

公开(公告)日：2010-03-25

申请号：US12441904

申请日：2007-09-26

申请人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

发明人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

IPC分类号： H01L23/495 ,  H01B5/00

CPC分类号： C22C9/04 ,  C22C9/00 ,  C22C9/02 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

摘要翻译： 提供具有高强度并且具有改善的氧化膜剥离性的Cu-Fe-P合金板，以解决诸如包装裂纹和剥离等问题。 本发明的电气电子部件用铜合金板是含有Fe：0.01〜0.50质量％，P：0.01〜0.15质量％，余量为Cu和不可避免的杂质的铜合金板。 中心线平均粗糙度Ra为0.2μm以下，最大高度Rmax为1.5μm以下，粗糙度曲线的峰值（度峰值）Rku为5.0以下，在根据 JIS B0601。

公开(公告)号：US07928541B2

公开(公告)日：2011-04-19

申请号：US12363974

申请日：2009-02-02

申请人： Yosuke Miwa ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Shinya Katsura

发明人： Yosuke Miwa ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Shinya Katsura

IPC分类号： H01L23/495

CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  H01L2924/0002 ,  H01L2924/00

摘要： A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

摘要翻译： QFN封装具有通过加工含有0.01〜0.50质量％Fe，0.01〜0.20质量％P的铜合金板和作为其他成分的Cu和不可避免的杂质，微维氏硬度为150或者 或均匀伸长率在5％以下，局部伸长率在10％以下，或含有0.05〜2质量％的Ni，0.001〜0.3质量％的P，0.005〜5质量％的Zn， Cu和不可避免的杂质作为其他组分，其微维氏硬度为150以上，均匀伸长率为5％以下，局部伸长率为10％以下。 在QFN封装切割过程中形成的引脚毛刺很短，用于切割QFN封装的切割刀片以较低的磨损率磨损。

公开(公告)号：US20080025867A1

公开(公告)日：2008-01-31

申请号：US11756117

申请日：2007-05-31

申请人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Katsura Kajihara

发明人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Katsura Kajihara

IPC分类号： C22C9/02

CPC分类号： C22C9/02 ,  C22C9/00 ,  C22C9/04 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.

摘要翻译： 公开了能够实现高强度，高导电性和优异的耐软化性共存的Cu-Fe-P合金。 Cu-Fe-P合金适用于半导体器件的引线框架的构成材料。 对于通过使含Fe化合物微粉化而使强度提高的Cu-Fe-P合金，当通过使Sn含量增加超过0.5质量％来提高耐软化性时，选自Ni，Mg，Ca ，Al，Si和Cr的微量添加，从而可以检测在铜合金的制造过程中在锻造和热轧时容易发生的裂纹，结果是 Sn含量。