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    Copper alloy sheet and QFN package
    1.
    发明授权
    Copper alloy sheet and QFN package 有权
    铜合金板和QFN封装

    公开(公告)号：US07928541B2

    公开(公告)日：2011-04-19

    申请号：US12363974

    申请日：2009-02-02

    申请人： Yosuke Miwa ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Shinya Katsura

    发明人： Yosuke Miwa ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Shinya Katsura

    IPC分类号： H01L23/495

    CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

    摘要翻译： QFN封装具有通过加工含有0.01〜0.50质量％Fe，0.01〜0.20质量％P的铜合金板和作为其他成分的Cu和不可避免的杂质，微维氏硬度为150或者 或均匀伸长率在5％以下，局部伸长率在10％以下，或含有0.05〜2质量％的Ni，0.001〜0.3质量％的P，0.005〜5质量％的Zn， Cu和不可避免的杂质作为其他组分，其微维氏硬度为150以上，均匀伸长率为5％以下，局部伸长率为10％以下。 在QFN封装切割过程中形成的引脚毛刺很短，用于切割QFN封装的切割刀片以较低的磨损率磨损。

    COPPER ALLOY SHEET AND QFN PACKAGE
    2.
    发明申请
    COPPER ALLOY SHEET AND QFN PACKAGE 有权
    铜合金板和QFN封装

    公开(公告)号：US20090224379A1

    公开(公告)日：2009-09-10

    申请号：US12363974

    申请日：2009-02-02

    申请人： Yosuke MIWA ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Shinya Katsura

    发明人： Yosuke MIWA ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Shinya Katsura

    IPC分类号： H01L23/52 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/01 ,  C22C9/06

    CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/06 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.

    摘要翻译： QFN封装具有通过加工含有0.01〜0.50质量％Fe，0.01〜0.20质量％P的铜合金板和作为其他成分的Cu和不可避免的杂质，微维氏硬度为150或者 或均匀伸长率在5％以下，局部伸长率在10％以下，或含有0.05〜2质量％的Ni，0.001〜0.3质量％的P，0.005〜5质量％的Zn， Cu和不可避免的杂质作为其他组分，其微维氏硬度为150以上，均匀伸长率为5％以下，局部伸长率为10％以下。 在QFN封装切割过程中形成的引脚毛刺很短，用于切割QFN封装的切割刀片以较低的磨损率磨损。

    COPPER ALLOY SHEETS FOR ELECTRICAL/ELECTRONIC PART
    3.
    发明申请
    COPPER ALLOY SHEETS FOR ELECTRICAL/ELECTRONIC PART 有权
    电子部件铜合金板

    公开(公告)号：US20090311128A1

    公开(公告)日：2009-12-17

    申请号：US12374154

    申请日：2007-06-20

    申请人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

    发明人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

    IPC分类号： C22C9/00 ,  C22C9/04 ,  C22C9/02

    CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0355 ,  H01L2924/00

    摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more.In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less.In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

    摘要翻译： 通过将Cu-Fe-P合金板的表面中{311}面的衍射强度的半值宽度β除以其峰值高度而得到的值的位错密度， H为0.015以上。 另外，具有Fe含量较低的Cu-Fe-P合金板具有（I（200））与（I（200））衍射强度的比（I（200）/ I（220） （220））的衍射强度为0.3以下。 此外，具有Fe含量较低的Cu-Fe-P合金板具有通过FE-SEM使用EBSP的结晶取向分析法测定的黄铜取向的取向分布密度为25％的结构， 更多; 平均粒径为6.0μm以下。

    Copper alloy sheet for electric and electronic parts
    5.
    发明授权
    Copper alloy sheet for electric and electronic parts 有权
    铜合金板用于电气和电子零件

    公开(公告)号：US08063471B2

    公开(公告)日：2011-11-22

    申请号：US12441904

    申请日：2007-09-26

    申请人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

    发明人： Yasuhiro Aruga ,  Ryoichi Ozaki ,  Yosuke Miwa

    IPC分类号： H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： C22C9/04 ,  C22C9/00 ,  C22C9/02 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

    摘要翻译： 提供具有高强度并且具有改善的氧化膜剥离性的Cu-Fe-P合金板，以解决诸如包装裂纹和剥离等问题。 本发明的电气电子部件用铜合金板是含有Fe：0.01〜0.50质量％，P：0.01〜0.15质量％，余量为Cu和不可避免的杂质的铜合金板。 中心线平均粗糙度Ra为0.2μm以下，最大高度Rmax为1.5μm以下，粗糙度曲线的峰值（度峰值）Rku为5.0以下，在根据 JIS B0601。

    Plated copper alloy material and process for production thereof
    7.
    发明授权
    Plated copper alloy material and process for production thereof 有权
    镀铜合金材料及其生产方法

    公开(公告)号：US06759142B2

    公开(公告)日：2004-07-06

    申请号：US10207027

    申请日：2002-07-30

    申请人： Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

    发明人： Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

    IPC分类号： B32B1520

    CPC分类号： C23C28/021 ,  C23C26/00 ,  C23C28/023 ,  C25D5/12 ,  H05K3/244 ,  Y10S428/929 ,  Y10S428/935 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

    摘要： A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

    摘要翻译： 提供一种用于连接端子的电镀铜合金材料，其包括铜或铜合金的母体材料，镍层和铜 - 锡合金层。 镍层的厚度为0.1-1.0μm。 铜 - 锡合金层的厚度为0.1-1.0μm，含有35-75at％的铜。 对于非接合型连接器，对于含有0.001-0.1质量％的碳或大于0.5μm的接合型端子，该材料可另外具有不超过0.5μm的锡层。 该材料在高温环境下能够以较小的力，良好的电气可靠性（由于接触电阻低）而满足对插入能力的要求，无裂纹的急剧弯曲的可加工性，良好的焊料润湿性和对二氧化硫气体的良好的耐腐蚀性。

    COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART
    9.
    发明申请
    COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART 审中-公开
    电力电子部件铜合金板

    公开(公告)号：US20120308429A1

    公开(公告)日：2012-12-06

    申请号：US13585076

    申请日：2012-08-14

    申请人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

    发明人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

    IPC分类号： C22C9/02

    CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0355 ,  H01L2924/00

    摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

    摘要翻译： 剪切平面比减小了位错密度，其中通过将半值宽度＆bgr; Cu-Fe-P合金板表面的{311}面的衍射强度的峰值高度H为0.015以上。 另外，具有Fe含量较低的Cu-Fe-P合金板具有（I（200））与（I（200））衍射强度的比（I（200）/ I（220） （220））的衍射强度为0.3以下。 此外，具有Fe含量较低的Cu-Fe-P合金板具有通过FE-SEM使用EBSP的结晶取向分析法测定的黄铜取向的取向分布密度为25％的结构， 更多; 并且片材中的平均粒径为6.0μm以下。