Method of apparatus for detecting particles on a specimen
    2.
    发明授权
    Method of apparatus for detecting particles on a specimen 有权
    用于检测样品上的颗粒的装置的方法

    公开(公告)号:US07952700B2

    公开(公告)日:2011-05-31

    申请号:US12907895

    申请日:2010-10-19

    IPC分类号: G01N21/00

    CPC分类号: G01N21/956

    摘要: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

    摘要翻译: 通过检查其中形成有多个图案的样本的表面的样本来检测缺陷的方法和装置,通过从仰角不同的多个方向之一的细长形状的光束照射, 根据要检测的缺陷的种类从照明光源发射的光束。 通过用安装在不同仰角方向上的多个图像传感器捕获由细长形状光束照射的样本的多个光学图像,通过根据在照射细长的照射区域中在样品上形成的图案的密度来改变放大倍率 形状光通量。 通过处理由多个图像传感器捕获的图像来检测样本上的缺陷。

    Method of apparatus for detecting particles on a specimen
    3.
    发明授权
    Method of apparatus for detecting particles on a specimen 有权
    用于检测样品上的颗粒的装置的方法

    公开(公告)号:US07817261B2

    公开(公告)日:2010-10-19

    申请号:US12114139

    申请日:2008-05-02

    IPC分类号: G01N21/00

    CPC分类号: G01N21/956

    摘要: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

    摘要翻译: 通过检查其中形成有多个图案的样本的表面的样本来检测缺陷的方法和装置,通过从仰角不同的多个方向之一的细长形状的光束照射, 根据要检测的缺陷的种类从照明光源发射的光束。 通过用安装在不同仰角方向上的多个图像传感器捕获由细长形状光束照射的样本的多个光学图像,通过根据在照射细长的照射区域中在样品上形成的图案的密度来改变放大倍率 形状光通量。 通过处理由多个图像传感器捕获的图像来检测样本上的缺陷。

    METHOD AND APPARATUS FOR DETECTING DEFECTS
    4.
    发明申请
    METHOD AND APPARATUS FOR DETECTING DEFECTS 审中-公开
    检测缺陷的方法和装置

    公开(公告)号:US20100103409A1

    公开(公告)日:2010-04-29

    申请号:US12652452

    申请日:2010-01-05

    IPC分类号: G01N21/88

    摘要: An inspection apparatus projects a laser beam on the surface of a SOI wafer and detects foreign matter on and defects in the surface of the SOI wafer by receiving scattered light reflected from the surface of the SOI wafer. The wavelength of the laser beam used by the inspection apparatus is determined so that a penetration depth of the laser beam in a Si thin film may be 10 nm or below to detect only foreign matter on and defects in the outermost surface and not to detect foreign matter and defects in a BOX layer. Only the foreign matter on and defects in the outermost surface layer can be detected without being influenced by thin-film interference by projecting the laser beam on the surface of the SOI wafer and receiving scattered light rays.

    摘要翻译: 检查装置将激光束投射在SOI晶片的表面上,通过接收从SOI晶片的表面反射的散射光来检测SOI晶片的异物和表面的缺陷。 确定检查装置使用的激光束的波长,使得Si薄膜中的激光束的穿透深度可以为10nm以下,仅检测异物和最外表面的缺陷,并且不检测外部 BOX层的物质和缺陷。 只有通过将激光束投射在SOI晶片的表面上并且接收散射光线,才能够检测出最外层的异物和缺陷,而不受薄膜干涉的影响。

    Method Of Apparatus For Detecting Particles On A Specimen
    5.
    发明申请
    Method Of Apparatus For Detecting Particles On A Specimen 有权
    检测样品中颗粒物的方法

    公开(公告)号:US20080204724A1

    公开(公告)日:2008-08-28

    申请号:US12114139

    申请日:2008-05-02

    IPC分类号: G01N21/00

    CPC分类号: G01N21/956

    摘要: A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

    摘要翻译: 通过检查其中形成有多个图案的样本的表面的样本来检测缺陷的方法和装置,通过从仰角不同的多个方向之一的细长形状的光束照射, 根据要检测的缺陷的种类从照明光源发射的光束。 通过用安装在不同仰角方向上的多个图像传感器捕获由细长形状光束照射的样本的多个光学图像,通过根据在照射细长的照射区域中在样品上形成的图案的密度来改变放大倍率 形状光通量。 通过处理由多个图像传感器捕获的图像来检测样本上的缺陷。

    Method and apparatus for detecting defects
    6.
    发明授权
    Method and apparatus for detecting defects 失效
    检测缺陷的方法和装置

    公开(公告)号:US07643139B2

    公开(公告)日:2010-01-05

    申请号:US11206209

    申请日:2005-08-18

    IPC分类号: G01N21/00

    摘要: An inspection apparatus projects a laser beam on the surface of a SOI wafer and detects foreign matter on and defects in the surface of the SOI wafer by receiving scattered light reflected from the surface of the SOI wafer. The wavelength of the laser beam used by the inspection apparatus is determined so that a penetration depth of the laser beam in a Si thin film may be 10 nm or below to detect only foreign matter on and defects in the outermost surface and not to detect foreign matter and defects in a BOX layer. Only the foreign matter on and defects in the outermost surface layer can be detected without being influenced by thin-film interference by projecting the laser beam on the surface of the SOI wafer and receiving scattered light rays.

    摘要翻译: 检查装置将激光束投射在SOI晶片的表面上,通过接收从SOI晶片的表面反射的散射光来检测SOI晶片的异物和表面的缺陷。 确定检查装置使用的激光束的波长,使得Si薄膜中的激光束的穿透深度可以为10nm以下,仅检测异物和最外表面的缺陷,并且不检测外部 BOX层的物质和缺陷。 只有通过将激光束投射在SOI晶片的表面上并且接收散射光线,才能够检测出最外层的异物和缺陷,而不受薄膜干涉的影响。

    Method and apparatus for detecting defects
    7.
    发明申请
    Method and apparatus for detecting defects 失效
    检测缺陷的方法和装置

    公开(公告)号:US20060068512A1

    公开(公告)日:2006-03-30

    申请号:US11206209

    申请日:2005-08-18

    IPC分类号: H01L21/66 G01R31/26

    摘要: An inspection apparatus projects a laser beam on the surface of a SOI wafer and detects foreign matter on and defects in the surface of the SOI wafer by receiving scattered light reflected from the surface of the SOI wafer. The wavelength of the laser beam used by the inspection apparatus is determined so that a penetration depth of the laser beam in a Si thin film may be 10 nm or below to detect only foreign matter on and defects in the outermost surface and not to detect foreign matter and defects in a BOX layer. Only the foreign matter on and defects in the outermost surface layer can be detected without being influenced by thin-film interference by projecting the laser beam on the surface of the SOI wafer and receiving scattered light rays.

    摘要翻译: 检查装置将激光束投射在SOI晶片的表面上,通过接收从SOI晶片的表面反射的散射光来检测SOI晶片的异物和表面的缺陷。 确定检查装置使用的激光束的波长,使得Si薄膜中的激光束的穿透深度可以为10nm以下,仅检测异物和最外表面的缺陷,并且不检测外部 BOX层的物质和缺陷。 只有通过将激光束投射在SOI晶片的表面上并且接收散射光线,才能够检测出最外层的异物和缺陷,而不受薄膜干涉的影响。

    Method and apparatus for detecting defects
    8.
    发明申请
    Method and apparatus for detecting defects 审中-公开
    检测缺陷的方法和装置

    公开(公告)号:US20050264797A1

    公开(公告)日:2005-12-01

    申请号:US11136664

    申请日:2005-05-25

    摘要: The present invention relates to a defect detection apparatus and method by which foreign particles and circuit pattern defects can be detected in distinction from the edge roughness of wiring on the substrate. The defect detection apparatus comprises an irradiation optical system includes: a beam expander; an optical member group formed by stacking multiple plate-like optical members each having a different optical path length at least in a beam-converging direction in order to admit the laser beam with the beam diameter extended by the beam expander and emit multiple slit-like beams each spatially reduced in coherence in the beam-converging direction; and beam-converging optical system by which the multiple slit-like beams each emitted from the optical member group is converged into a slit-like beam in the beam-converging direction and the slit-like beam is irradiated from an oblique direction onto the surface of the subject.

    摘要翻译: 本发明涉及一种缺陷检测装置和方法,通过该缺陷检测装置和方法可以检测与基板上的布线的边缘粗糙度相关的异物和电路图案缺陷。 缺陷检测装置包括:照射光学系统,包括:扩束器; 光学构件组,其通过至少在束会聚方向上堆叠具有不同光程长度的多个板状光学构件而形成,以便允许具有由扩束器延伸的光束直径的激光束并且发射多个狭缝状 光束在束收敛方向上的相干性在空间上减小; 以及束光聚光光学系统,其中从光学构件组发射的多个狭缝状光束在束会聚方向上会聚到狭缝状光束中,并且狭缝状光束从倾斜方向照射到表面上 的主题。

    Method of apparatus for detecting particles on a specimen
    9.
    发明申请
    Method of apparatus for detecting particles on a specimen 失效
    用于检测样品上的颗粒的装置的方法

    公开(公告)号:US20050213086A1

    公开(公告)日:2005-09-29

    申请号:US11086442

    申请日:2005-03-23

    CPC分类号: G01N21/956

    摘要: An apparatus for inspecting a pattern to detect a small pattern defect has an illuminating light source, as illuminating optical system having a plurality of illuminating portions for switching an optical path of illuminating light flux to a surface of board constituting the inspected object from a plurality of directions different from each other, a detecting optical system having a variable magnification using an object lens for condensing reflected diffracted light from the illuminated board, a focusing optical system having a variable magnification capable of focusing an optical image by converged reflected diffracted light with a desired focusing magnification and an optical detector for detecting the optical image focused by the focusing optical system to convert it into an image signal, an A/D converter for converting the image signal into a digital image signal, and an image signal processor for processing the digital image signal to detect the defect.

    摘要翻译: 用于检查图案以检测小图案缺陷的装置具有照明光源,作为具有多个照明部的照明光学系统,所述照明光学系统具有多个照明部分,用于将照明光束的光路从多个照明部分切换到构成被检查物体的板的表面 方向不同的检测光学系统,使用用于聚焦来自照明板的反射衍射光的物镜具有可变放大倍数的检测光学系统,具有可变倍率的聚焦光学系统,其能够通过会聚的反射衍射光聚焦光学图像,具有期望的 聚焦放大率和用于检测由聚焦光学系统聚焦的光学图像以将其转换成图像信号的光学检测器,用于将图像信号转换为数字图像信号的A / D转换器和用于处理数字图像信号的图像信号处理器 图像信号来检测缺陷。

    Method of apparatus for detecting particles on a specimen
    10.
    发明授权
    Method of apparatus for detecting particles on a specimen 失效
    用于检测样品上的颗粒的装置的方法

    公开(公告)号:US07369223B2

    公开(公告)日:2008-05-06

    申请号:US11086442

    申请日:2005-03-23

    IPC分类号: G01N21/00

    CPC分类号: G01N21/956

    摘要: An apparatus for inspecting a pattern to detect a small pattern defect has an illuminating light source, as illuminating optical system having a plurality of illuminating portions for switching an optical path of illuminating light flux to a surface of board constituting the inspected object from a plurality of directions different from each other, a detecting optical system having a variable magnification using an object lens for condensing reflected diffracted light from the illuminated board, a focusing optical system having a variable magnification capable of focusing an optical image by converged reflected diffracted light with a desired focusing magnification and an optical detector for detecting the optical image focused by the focusing optical system to convert it into an image signal, an A/D converter for converting the image signal into a digital image signal, and an image signal processor for processing the digital image signal to detect the defect.

    摘要翻译: 用于检查图案以检测小图案缺陷的装置具有照明光源,作为具有多个照明部的照明光学系统,所述照明光学系统具有多个照明部分,用于将照明光束的光路从多个照明部分切换到构成被检查物体的板的表面 方向不同的检测光学系统,使用用于聚焦来自照明板的反射衍射光的物镜具有可变放大倍数的检测光学系统,具有可变倍率的聚焦光学系统,其能够通过会聚的反射衍射光聚焦光学图像,具有期望的 聚焦放大率和用于检测由聚焦光学系统聚焦的光学图像以将其转换成图像信号的光学检测器,用于将图像信号转换为数字图像信号的A / D转换器和用于处理数字图像信号的图像信号处理器 图像信号来检测缺陷。