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28 条记录 (耗时 0.046 秒)

    Method of preparing carbon substrate for gas diffusion layer of polymer electrolyte fuel cell, carbon substrate prepared by using the method, and system for manufacturing the same
    3.
    发明授权
    Method of preparing carbon substrate for gas diffusion layer of polymer electrolyte fuel cell, carbon substrate prepared by using the method, and system for manufacturing the same 有权
    制备聚合物电解质燃料电池气体扩散层碳基板的方法，使用该方法制备的碳基板及其制造方法

    公开(公告)号：US08747796B2

    公开(公告)日：2014-06-10

    申请号：US13112500

    申请日：2011-05-20

    申请人： Chang Woo Lee ,  Eun Sook Lee ,  Jy Young Jyoung ,  Do Hun Kim ,  Yong Won Jin ,  Jung Mi Gwak ,  Young Uk Jyoung

    发明人： Chang Woo Lee ,  Eun Sook Lee ,  Jy Young Jyoung ,  Do Hun Kim ,  Yong Won Jin ,  Jung Mi Gwak ,  Young Uk Jyoung

    IPC分类号： C01B31/00 ,  B28B11/24 ,  B29C65/02 ,  D04H5/02

    CPC分类号： D04H1/4242 ,  D04H1/488 ,  D04H1/64

    摘要： A carbon substrate, method, and a system for manufacturing the same. The method includes forming an oxidized carbon precursor fiber preweb comprising oxidized carbon precursor staple fibers and binder staple fibers; impregnating the oxidized carbon precursor fiber preweb with a slurry including a thermosetting resin and carbonaceous fillers and drying the resulting preweb to obtain an oxidized carbon precursor fiber web; applying heat and pressure to the oxidized and impregnated carbon precursor fiber web, to cure the thermosetting resin and press the oxidized carbon precursor fiber web; and heating the oxidized carbon precursor fiber web in an inert atmosphere, thereby stabilizing and carbonizing the oxidized carbon precursor staple fibers to obtain a carbon substrate. The present invention may utilize a combination of carbon precursor staple fibers in an oxidized form with low ductility and high stiffness; and binder staple fibers composed of a polymer resin.

    摘要翻译： 碳基板，方法及其制造系统。 该方法包括形成包含氧化碳前体短纤维和粘合剂短纤维的预氧化的氧化碳前体纤维; 用包含热固性树脂和碳质填料的浆料浸渍氧化碳前体纤维，并干燥所得的预浸料以获得氧化碳前体纤维网; 对氧化和浸渍的碳前体纤维网施加热和压力，固化热固性树脂并压制氧化碳前体纤维网; 并在惰性气氛中加热氧化碳前体纤维网，由此稳定和碳化氧化碳前体短纤维以获得碳基质。 本发明可以利用具有低延展性和高刚度的氧化形式的碳前体短纤维的组合; 和由聚合物树脂组成的粘合剂短纤维。

    Apparatus and method for detecting malicious sites
    4.
    发明授权
    Apparatus and method for detecting malicious sites 有权
    用于检测恶意站点的装置和方法

    公开(公告)号：US08745740B2

    公开(公告)日：2014-06-03

    申请号：US13505858

    申请日：2010-11-01

    申请人： Ju Hyun Oh ,  Chang Woo Lee ,  Chong Phil Park

    发明人： Ju Hyun Oh ,  Chang Woo Lee ,  Chong Phil Park

    IPC分类号： H04L29/06 ,  G06F21/00 ,  G06F21/52

    CPC分类号： H04L63/168 ,  G06F21/52 ,  H04L63/1441

    摘要： The invention relates to an apparatus for detecting malicious sites, comprising: a monitoring unit for monitoring all processes being executed in a computing apparatus; a hook code insertion unit for inserting a hook code in a process executed in a browser when the execution of the browser is detected by the monitoring unit; a danger level determining unit that, upon the detection of a website movement, uses the hook code to inspect a stack structure of a process implemented according to the website movement and determine whether or not to perform the stack structure inspection, and determines whether or not the website to which the movement has been made is a malicious site; and a database for storing a list of sites determined to be malicious.

    摘要翻译： 本发明涉及一种用于检测恶意站点的装置，包括：监视单元，用于监视在计算设备中执行的所有进程; 钩子代码插入单元，用于在由监视单元检测到浏览器的执行时，在浏览器中执行的处理中插入挂钩代码; 危险度确定单元，其在检测到网站移动时使用所述挂钩代码来检查根据所述网站移动实现的处理的堆栈结构，并且确定是否执行所述堆栈结构检查，并且确定是否执行所述堆栈结构检查 运动所在的网站是恶意网站; 以及用于存储确定为恶意的站点列表的数据库。

    TAPER TENSION CONTROL METHOD OF WINDING PROCESS FOR WEB HANDLING SYSTEM
    5.
    发明申请
    TAPER TENSION CONTROL METHOD OF WINDING PROCESS FOR WEB HANDLING SYSTEM 失效
    网络处理系统卷绕过程的TAPER张力控制方法

    公开(公告)号：US20100186873A1

    公开(公告)日：2010-07-29

    申请号：US12669818

    申请日：2008-06-28

    申请人： Kee-Hyun Shin ,  Chang Woo Lee ,  Jang Won Lee

    发明人： Kee-Hyun Shin ,  Chang Woo Lee ,  Jang Won Lee

    IPC分类号： B29C70/56

    CPC分类号： B65H23/1955 ,  B65H2511/142 ,  B65H2515/31 ,  B65H2551/18 ,  B65H2557/24 ,  B65H2220/03 ,  B65H2220/01 ,  B65H2220/02

    摘要： According to the disclosed is a method for controlling taper tension in the winding section of a web handling system, a more stable, high-quality wound roll can be produced by stabilizing radial stress distribution and minimizing telescoping, which is the lateral displacement of material in the winding section, using either hybrid taper tension control through a hybrid factor (α) or heaviside taper tension control through a heaviside factor (φ), in the winding process, which is the final section of the roll-to-roll or web handling system.

    摘要翻译： 根据所公开的方法，用于控制幅材处理系统的卷绕部分中的锥形张力的方法，可以通过稳定径向应力分布和最小化伸缩来产生更稳定，高质量的卷绕辊，这是将材料的横向位移最小化 卷绕部分，在卷绕过程中使用通过混合因子（α）的混合锥形张力控制或通过重质因子（＆phgr）的重度锥度张力控制，其是卷对卷或卷材的最终部分 处理系统。

    Flame-retardant additive for li-ion batteries
    8.
    发明授权
    Flame-retardant additive for li-ion batteries 失效
    锂离子电池用阻燃添加剂

    公开(公告)号：US06455200B1

    公开(公告)日：2002-09-24

    申请号：US09645381

    申请日：2000-08-24

    申请人： Jai Prakash ,  Chang Woo Lee ,  Khalil Amine

    发明人： Jai Prakash ,  Chang Woo Lee ,  Khalil Amine

    IPC分类号： H01M458

    CPC分类号： H01M10/0567 ,  H01M10/0525 ,  H01M10/0569 ,  H01M10/4235 ,  H01M2300/0037 ,  Y02T10/7011

    摘要： A lithium-ion battery having an anode electrode, a cathode electrode and a non-aqueous solvent lithium electrolyte. At least one cyclophosphazene is added to the non-aqueous solvent lithium electrolyte, which cyclophosphazene acts as a flame-retardant material. The non-aqueous solvent lithium electrolyte is preferably a carbonate-based electrolyte and the preferred cyclophosphazene is hexamethoxycyclotriphosphazene.

    摘要翻译： 一种具有阳极电极，阴极电极和非水溶剂锂电解质的锂离子电池。 将至少一种环磷腈加入到非水溶剂锂电解质中，该环磷腈作为阻燃材料。 非水溶剂锂电解质优选为碳酸酯类电解质，优选的环磷腈为六甲氧基环三磷腈。

    Device of filling metal in through-via-hole of semiconductor wafer and method using the same
    9.
    发明授权
    Device of filling metal in through-via-hole of semiconductor wafer and method using the same 有权
    在半导体晶片的通孔中填充金属的装置及其使用方法

    公开(公告)号：US08486827B2

    公开(公告)日：2013-07-16

    申请号：US13262293

    申请日：2009-12-30

    申请人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

    发明人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

    IPC分类号： H01L21/768

    CPC分类号： H01L21/68785 ,  H01L21/68721 ,  H01L21/76898

    摘要： A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

    摘要翻译： 公开了一种在半导体晶片中形成的通孔中填充金属的装置以及使用该通孔的贯通孔中填充金属的方法。 在半导体晶片中形成的通孔中填充金属的装置包括夹具基座，其包括夹具，其被配置为固定其中形成有通孔的晶片; 安装在夹具基座上的上腔室120; 安装在夹具底下的下腔室; 安装在所述上部腔室中的加热器，所述加热器构造成对放置在所述晶片上的填充金属施加热量以熔化所述填充金属; 以及真空泵，其构造成通过下部腔室130的空气排出而被下部腔室的压力产生上部腔室和下部腔室之间的压力差，仅将填充金属填充到通孔中。

    DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME
    10.
    发明申请
    DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME 有权
    在半导体波长通孔中填充金属的装置及其使用方法

    公开(公告)号：US20120034776A1

    公开(公告)日：2012-02-09

    申请号：US13262293

    申请日：2009-12-30

    申请人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

    发明人： Se Hoon Yoo ,  Chang Woo Lee ,  Jun Ki Kim ,  Jeong Han Kim ,  Cheol Hee Kim ,  Young Ki Ko ,  Yue Seon Shin

    IPC分类号： H01L21/768 ,  B23K9/04

    CPC分类号： H01L21/68785 ,  H01L21/68721 ,  H01L21/76898

    摘要： A device of filling metal in a through-via-hole formed in a semiconductor wafer and a method of filling metal in a through-via-hole using the same are disclosed. A device of filling metal in a through-via-hole formed in a semiconductor wafer includes a jig base comprising a jig configured to fix the wafer having the through-via-hole formed therein; a upper chamber 120 installed on the jig base; a lower chamber installed under the jig base; a heater installed in the upper chamber, the heater configured to apply heat to filling metal placed on the wafer to melt the filling metal; and a vacuum pump configured to generate pressure difference between the upper chamber and the lower chamber by the pressure of the lower chamber reduced by discharging air of the lower chamber 130 outside, only to fill the melted filling metal in the through-via-hole.

    摘要翻译： 公开了一种在半导体晶片中形成的通孔中填充金属的装置以及使用该通孔的贯通孔中填充金属的方法。 在半导体晶片中形成的通孔中填充金属的装置包括夹具基座，其包括夹具，其被配置为固定其中形成有通孔的晶片; 安装在夹具基座上的上腔室120; 安装在夹具底下的下腔室; 安装在所述上部腔室中的加热器，所述加热器构造成对放置在所述晶片上的填充金属施加热量以熔化所述填充金属; 以及真空泵，其构造成通过下部腔室130的空气排出而被下部腔室的压力产生上部腔室与下部腔室之间的压力差，仅将填充金属填充到通孔中。