公开(公告)号：US20090153024A1

公开(公告)日：2009-06-18

申请号：US12106348

申请日：2008-04-21

申请人： Yu-Huan Liu ,  Chieh-Hsiu Lin ,  Chih-Lin Wang ,  Yun-Yi Tien

发明人： Yu-Huan Liu ,  Chieh-Hsiu Lin ,  Chih-Lin Wang ,  Yun-Yi Tien

IPC分类号： H01J1/62 ,  H01J9/02

CPC分类号： H01L33/502 ,  H01L25/0756 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

摘要： A white-light emitting device comprises a substrate, a short wavelength light source, a protective layer, a first structure, and a second structure. The short wavelength light source is disposed on the substrate for generating a first light, and the protective layer covering the short wavelength light source is pervious to the first light. The first structure is disposed on the protective layer for generating a second light, in which the first structure includes a first quantum well and a transmission layer. The second structure is disposed on the first structure for generating a third light. Finally, the first light, the second light, and the third light are mixed to generate a white light.

摘要翻译： 白色发光器件包括衬底，短波长光源，保护层，第一结构和第二结构。 短波长光源设置在用于产生第一光的基板上，覆盖短波长光源的保护层可透过第一光。 第一结构设置在用于产生第二光的保护层上，其中第一结构包括第一量子阱和透射层。 第二结构设置在用于产生第三光的第一结构上。 最后，混合第一光，第二光和第三​​光以产生白光。

公开(公告)号：US07965028B2

公开(公告)日：2011-06-21

申请号：US12106348

申请日：2008-04-21

申请人： Yu-Huan Liu ,  Chieh-Hsiu Lin ,  Chih-Lin Wang ,  Yun-Yi Tien

发明人： Yu-Huan Liu ,  Chieh-Hsiu Lin ,  Chih-Lin Wang ,  Yun-Yi Tien

IPC分类号： H01L51/00

CPC分类号： H01L33/502 ,  H01L25/0756 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

摘要： A white-light emitting device comprises a substrate, a short wavelength light source, a protective layer, a first structure, and a second structure. The short wavelength light source is disposed on the substrate for generating a first light, and the protective layer covering the short wavelength light source is pervious to the first light. The first structure is disposed on the protective layer for generating a second light, in which the first structure includes a first quantum well and a transmission layer. The second structure is disposed on the first structure for generating a third light. Finally, the first light, the second light, and the third light are mixed to generate a white light.

摘要翻译： 白色发光器件包括衬底，短波长光源，保护层，第一结构和第二结构。 短波长光源设置在用于产生第一光的基板上，覆盖短波长光源的保护层可透过第一光。 第一结构设置在用于产生第二光的保护层上，其中第一结构包括第一量子阱和透射层。 第二结构设置在用于产生第三光的第一结构上。 最后，混合第一光，第二光和第三​​光以产生白光。

公开(公告)号：US08431948B2

公开(公告)日：2013-04-30

申请号：US13414555

申请日：2012-03-07

申请人： Yu-Huan Liu

发明人： Yu-Huan Liu

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.

摘要翻译： 提供一种发光二极管封装及其制造方法。 发光二极管封装包括引线框架，其具有框体和覆盖框体的导电层。 反射器具有夹着引线框架的第一部分和第二部分，其中第一部分具有凹陷以暴露引线框架，并且发光二极管芯片设置在凹陷中的引线框架上。 该制造方法包括：形成框体并形成覆盖框体的导电层，以形成引线框架。 形成反射器的第一部分和第二部分以夹住引线框架，其中第一部分具有凹陷以暴露引线框架。 发光二极管芯片设置在凹陷中的引线框架上。

公开(公告)号：US20070034834A1

公开(公告)日：2007-02-15

申请号：US11164018

申请日：2005-11-07

申请人： Yu-Huan Liu ,  Ru-Shi Liu ,  Yi-Shan Lin ,  Chuen-Ming Gee ,  Ching-Jang Lin ,  Biing-Jyh Weng ,  Tzong-Liang Tsai ,  Tzer-Perng Chen

发明人： Yu-Huan Liu ,  Ru-Shi Liu ,  Yi-Shan Lin ,  Chuen-Ming Gee ,  Ching-Jang Lin ,  Biing-Jyh Weng ,  Tzong-Liang Tsai ,  Tzer-Perng Chen

IPC分类号： H01J63/04 ,  H01J1/62

CPC分类号： C09K11/7734 ,  C09K11/0883 ,  H01L33/502

摘要： A compound represented by the following formula: SrxMyAlzSi12−zN16−zO2+z wherein, M is selected from the group consisting of rare earth elements and yttrium, x>0, y>0, x+y=2, and 0≦z≦5. The compound may be used as a phosphor. It emits a visible light upon being excited by a blue light and/or an ultra-violet light. When M is Eu, the compound emits a yellow-green light upon being excited by a blue light and/or an ultra-violet light.

摘要翻译： 由下式表示的化合物：<？in-line-formula description =“In-line Formulas”end =“lead”？> Sr M α2-z N 2 -Z 2 -Z 2 -Z-α-in-line-formula description =“ 其中，M选自稀土元素和钇，x> 0，y> 0，x + y = 2，0 <= z <= 5 。 该化合物可以用作荧光体。 当被蓝光和/或紫外线激发时，它发出可见光。 当M为Eu时，由蓝色光和/或紫外线激发时，该化合物发出黄绿色光。

公开(公告)号：US20130045603A1

公开(公告)日：2013-02-21

申请号：US13213887

申请日：2011-08-19

申请人： Chao-Yu Tsai ,  Chih-Chung Huang ,  Tsz-Yuan Chen ,  Kung-Hsun Tsao ,  Huan-Hsin Yeh ,  Yu-Huan Liu

发明人： Chao-Yu Tsai ,  Chih-Chung Huang ,  Tsz-Yuan Chen ,  Kung-Hsun Tsao ,  Huan-Hsin Yeh ,  Yu-Huan Liu

IPC分类号： H01L21/31

CPC分类号： H01L21/32139 ,  H01L21/02244 ,  H01L21/02252 ,  H01L21/0276 ,  H01L21/76838 ,  H01L21/76856

摘要： A semiconductor process is described as follows. A material layer is provided on a substrate. A low-temperature oxidation treatment is performed to the material layer. A photoresist layer is formed on the material layer after the low-temperature oxidation treatment. The photoresist layer is patterned.

摘要翻译： 半导体工艺描述如下。 材料层设置在基板上。 对材料层进行低温氧化处理。 在低温氧化处理后，在材料层上形成光致抗蚀剂层。 对光致抗蚀剂层进行图案化。

公开(公告)号：US20100193816A1

公开(公告)日：2010-08-05

申请号：US12606013

申请日：2009-10-26

申请人： Yu-Huan Liu

发明人： Yu-Huan Liu

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.

摘要翻译： 提供一种发光二极管封装及其制造方法。 发光二极管封装包括引线框架，其具有框体和覆盖框体的导电层。 反射器具有夹着引线框架的第一部分和第二部分，其中第一部分具有凹陷以暴露引线框架，并且发光二极管芯片设置在凹陷中的引线框架上。 该制造方法包括：形成框体并形成覆盖框体的导电层，以形成引线框架。 形成反射器的第一部分和第二部分以夹住引线框架，其中第一部分具有凹陷以暴露引线框架。 发光二极管芯片设置在凹陷中的引线框架上。

公开(公告)号：US07718551B2

公开(公告)日：2010-05-18

申请号：US12044621

申请日：2008-03-07

申请人： Yu-Huan Liu ,  Chih-Jung Chen ,  Chih-Chung Huang

发明人： Yu-Huan Liu ,  Chih-Jung Chen ,  Chih-Chung Huang

IPC分类号： H01L21/00 ,  H01L21/8242 ,  B05D3/12 ,  C08J7/04

CPC分类号： H01L21/6715 ,  G03F7/162 ,  Y10S430/15

摘要： A method for forming a photoresist layer is provided. The method includes following steps. A wafer is provided in a semiconductor machine. The wafer is spun at a first spin speed. A pre-wet solvent is dispensed on the spinning wafer by using a nozzle disposed at a fixed position. The pre-wet solvent then stops dispensing. The spin speed of the wafer is adjusted from the first spin speed to a second spin speed which is faster than the first spin speed. Thereafter, a photoresist layer is coated on the wafer.

摘要翻译： 提供了形成光致抗蚀剂层的方法。 该方法包括以下步骤。 在半导体机器中设置晶片。 以第一旋转速度旋转晶片。 通过使用设置在固定位置的喷嘴将预湿溶剂分配在旋转晶片上。 预湿溶剂然后停止分配。 将晶片的旋转速度从第一旋转速度调整到比第一旋转速度快的第二旋转速度。 此后，将光致抗蚀剂层涂覆在晶片上。

公开(公告)号：US08604510B2

公开(公告)日：2013-12-10

申请号：US13649348

申请日：2012-10-11

申请人： Ssu-Yuan Weng ,  Yu-Huan Liu

发明人： Ssu-Yuan Weng ,  Yu-Huan Liu

IPC分类号： H01L33/00 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L21/00 ,  F21V3/00 ,  F21V5/00

CPC分类号： H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.

摘要翻译： 公开了一种发光二极管（LED）及其制造方法。 LED包括透明基板，多个透明导电层，多个金属电路和LED芯片。 LED芯片适用于发光，一部分光朝向透明基板发射。 LED的制造方法包括以下步骤。 首先，在透明基板上形成透明导电层。 接下来，通过蚀刻透明导电层形成导电图案。 交叉金属电路通过将金属设置在透明导电层的一部分上而形成。 最后，将LED芯片设置在金属电路上，使得LED芯片电连接到金属电路。

公开(公告)号：US08389307B2

公开(公告)日：2013-03-05

申请号：US12606013

申请日：2009-10-26

申请人： Yu-Huan Liu

发明人： Yu-Huan Liu

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression.

公开(公告)号：US20130032850A1

公开(公告)日：2013-02-07

申请号：US13649348

申请日：2012-10-11

申请人： Ssu-Yuan Weng ,  Yu-Huan Liu

发明人： Ssu-Yuan Weng ,  Yu-Huan Liu

IPC分类号： H01L33/42

CPC分类号： H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit.

摘要翻译： 公开了一种发光二极管（LED）及其制造方法。 LED包括透明基板，多个透明导电层，多个金属电路和LED芯片。 LED芯片适用于发光，一部分光朝向透明基板发射。 LED的制造方法包括以下步骤。 首先，在透明基板上形成透明导电层。 接下来，通过蚀刻透明导电层形成导电图案。 交叉金属电路通过将金属设置在透明导电层的一部分上而形成。 最后，将LED芯片设置在金属电路上，使得LED芯片电连接到金属电路。