摘要:
A flat-object holder can hold a flat object-and-frame assembly, and the holder has the flat object fixed to the frame with protection tape. The flat-object holder includes at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force, and a frame fixing area for fastening the frame. The flat-object holder bearing the flat object-and-frame assembly can be fixedly held by a selected chuck table by applying a negative pressure to the flat object supporting area. The flat-object holder can transfer and put the flat object-and-frame assembly in a container. Thus, no matter how thin the flat object may be, it can be handled without the fear of breaking.
摘要:
A flat-object holder can hold a flat object-and-frame assembly, and the holder has the flat object fixed to the frame with protection tape. The flat-object holder includes at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force, and a frame fixing area for fastening the frame. The flat-object holder bearing the flat object-and-frame assembly can be fixedly held by a selected chuck table by applying a negative pressure to the flat object supporting area. The flat-object holder can transfer and put the flat object-and-frame assembly in a container. Thus, no matter how thin the flat object may be, it can be handled without the fear of breaking.
摘要:
A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin film in contact with a suction surface of a chuck table in a grinding apparatus, and the exposed back-side surface of the wafer is ground. Unevenness in thickness of the resin film is suppressed, whereby the thickness of the wafer subjected to back grinding is made to be uniform.
摘要:
A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin film in contact with a suction surface of a chuck table in a grinding apparatus, and the exposed back-side surface of the wafer is ground. Unevenness in thickness of the resin film is suppressed, whereby the thickness of the wafer subjected to back grinding is made to be uniform.
摘要:
A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness.
摘要:
A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting step). Next, the wafer is held by sucking the surface of the cut appendant part directly onto the suction surface of the chuck table, and the back-side surface of the wafer is ground (back-side surface grinding step), followed by removing the resist layer. The wafer is held onto the chuck table without using any protective tape but by directly holding the wafer, whereby the wafer can be ground to have a uniform thickness.
摘要:
A metal member includes a first layer and a second layer. The second layer has an average crystal grain size different from an average crystal grain size of the first layer. An intermediate layer having an average crystal grain size smaller than the average crystal grain sizes of the first layer and the second layer is interposed between the first layer and the second layer.
摘要:
A channel substrate includes a plurality of individual channels and a plurality of linear machining marks. The plurality of individual channels is arrayed in row. The plurality of linear machining marks is substantially parallel to a direction in which the plurality of individual channels is arrayed in row.
摘要:
In a printing blanket, a manufacturing method of the printing blanket, a blanket cylinder, and a printing press, a printing unit is configured to include a plate cylinder to which a plate is attached, and a blanket cylinder that has a blanket attached thereto, rotates synchronously with the plate cylinder, and can transfer an ink image transferred from the plate cylinder onto a web, a circumference of the blanket cylinder is set to be twice as large as a circumference of the plate cylinder, and a notch and a concave portion along an axial direction are provided on a surface of the blanket at a uniform interval to correspond to a notch of the plate cylinder.
摘要:
An image processor includes an encoding unit encoding inputted data. The encoding unit includes a first processing unit splitting the data into a first partial data in a first digit range on an upper side and a second partial data in a second digit range on a lower side, a second processing unit encoding only the first partial data between the first partial data and the second partial data, and a third processing unit performing correction to set a value of the first partial data at “0”.