公开(公告)号：US08981560B2

公开(公告)日：2015-03-17

申请号：US13923011

申请日：2013-06-20

Applicant: mCube, Inc.

Inventor： Dave Paul Jensen ,  Hong Wan ,  Jon Ewanich

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B81B3/00

CPC classification number: H01L24/05 ,  B81B3/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/10175 ,  H01L2224/1145 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16238 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01047

Abstract: A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.

Abstract translation: 用于使用具有互连的垂直安装来制造传感器或电子设备的方法和结构。 该方法包括提供所形成的装置，其包括形成在模具构件上的至少一个传感器或电子装置，其具有在其上形成有一个或多个导电材料的接触区域。 所得到的器件然后可以在接触区域的附近被单个化，以形成一个或多个单个模具，每一个具有单个的表面区域。 单个模具可以耦合到具有第一表面区域的衬底构件，使得单个模具的单个表面区域耦合到第一表面区域的一部分。 可以使用导电粘合剂，焊接工艺或其它导电接合工艺在管芯和衬底构件之间形成互连。