摘要:
A process for producing a thermoplastic resin molded product, comprising: a placement step of placing a thermoplastic resin particle composition 6A into a cavity 22 of a rubber die 2 made of a rubber material; a particle heating step of irradiating the thermoplastic resin particle composition 6A in the cavity 22 with electromagnetic waves having wavelengths ranging from 0.78 to 2 μm through the rubber die 2, thereby heating to melt the thermoplastic resin particle composition 6A; a filling step of filling a thermoplastic resin 6 in a molten state into a space 220 left in the cavity 22; and a cooling step of cooling a thermoplastic resin 6 in the cavity 22 thereby obtaining a thermoplastic resin molded product.
摘要:
The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)n-1— RELEASE-M(X)n-m-1Qm, Or RELEASE-M(OR)n-1—, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is a halogen or cyano, especially Cl, F, or Br; Q is hydrogen or alkyl group; M is the number Q represents R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and N is the valence −1 of M, and n-m-1 is at least 1 provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patters in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent process, reproduced in the substrate or in another material which is added onto the substrate.
摘要:
The present invention relates to a structure for preventing the adhesion of microorganisms, which is capable of preventing microorganisms from adhering to and growing on a surface of an object, and a method of manufacturing the same. The structure for preventing the adhesion of microorganisms includes: a nano-structure configured to include a plurality of protruding structures each having a sharp end, and made of a resin composition; and a plurality of nano-metal particles configured to be distributed inside the nano-structure. A method of manufacturing a structure for preventing adhesion of microorganisms includes preparing a liquid resin; mixing the liquid resin with nano-metal particles; depositing the liquid resin on a substrate; pressing the liquid resin with a master template on which a pattern corresponding to a plurality of protruding structures is formed; and setting or curing the liquid resin.
摘要:
A method and apparatus for performing nanoimprint lithography. When an electric field is applied between the mold and the substrate, various forces can be generated among molds, substrates, and resists. The electrostatic force between the mold and the substrate can serve as an imprinting pressure to press the structured mold into the conformable resist. In addition, the electric field induces additional wetting forces (electrowetting or dielectrophoresis) in a liquid resist, which can assist the flow and filling of the liquid resist into fine structures.
摘要:
A method for forming a part with a tooling assembly includes forming an MRF bladder located within the tooling assembly into a desired shape, then placing the part in the tooling assembly, and forming the part with the tooling assembly by applying pressure until the part obtains the desired shape from the MRF bladder.
摘要:
An improved method of imprint lithography involves using fluid-induced pressure from electric or magnetic fields to press a mold onto a substrate having a moldable surface. In essence, the method comprises the steps of providing a substrate having a moldable surface, providing a mold having a molding surface and pressing the molding surface and the moldable surface together by electric or magnetic fields to imprint the molding surface onto the moldable surface. The molding surface advantageously comprises a plurality of projecting features of nanoscale extent or separation, but the molding surface can also be a smooth planar surface, as for planarization. The improved method can be practiced without mechanical presses and without sealing the region between the mold and the substrate.
摘要:
A method and apparatus for performing nanoimprint lithography. When an electric field is applied between the mold and the substrate, various forces can be generated among molds, substrates, and resists. The electrostatic force between the mold and the substrate can serve as an imprinting pressure to press the structured mold into the conformable resist. In addition, the electric field induces additional wetting forces (electrowetting or dielectrophoresis) in a liquid resist, which can assist the flow and filling of the liquid resist into fine structures.
摘要:
An improved method of imprint lithography involves using fluid-induced pressure from electric or magnetic fields to press a mold onto a substrate having a moldable surface. In essence, the method comprises the steps of providing a substrate having a moldable surface, providing a mold having a molding surface and pressing the molding surface and the moldable surface together by electric or magnetic fields to imprint the molding surface onto the moldable surface. The molding surface advantageously comprises a plurality of projecting features of nanoscale extent or separation, but the molding surface can also be a smooth planar surface, as for planarization. The improved method can be practiced without mechanical presses and without sealing the region between the mold and the substrate.
摘要:
The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)nnull1nullRELEASE-M(X)nnullmnull1Qm, or RELEASE-M(OR)nnull1null, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is halogen or cyano, especially Cl, F, or Br, Q is hydrogen or alkyl group; m is the number of Q groups; R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and; n is the valence null1 of M, and nnullmnull1 is at least 1 provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent processes, reproduced in the substrate or in another material which is added onto the substrate.
摘要:
A process for producing a thermoplastic resin molded product, comprising: a placement step of placing a thermoplastic resin particle composition 6A into a cavity 22 of a rubber die 2 made of a rubber material; a particle heating step of irradiating the thermoplastic resin particle composition 6A in the cavity 22 with electromagnetic waves having wavelengths ranging from 0.78 to 2 μm through the rubber die 2, thereby heating to melt the thermoplastic resin particle composition 6A; a filling step of filling a thermoplastic resin 6 in a molten state into a space 220 left in the cavity 22; and a cooling step of cooling a thermoplastic resin 6 in the cavity 22 thereby obtaining a thermoplastic resin molded product.