利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

33 条记录 (耗时 0.017 秒)

    RELEASE SURFACES, PARTICULARLY FOR USE IN NANOIMPRINT LITHOGRAPHY
    2.
    发明申请
    RELEASE SURFACES, PARTICULARLY FOR USE IN NANOIMPRINT LITHOGRAPHY 审中-公开

    公开(公告)号：US20080217813A1

    公开(公告)日：2008-09-11

    申请号：US11932772

    申请日：2007-10-31

    申请人： Stephen Y. Chou

    发明人： Stephen Y. Chou

    IPC分类号： B29C59/00

    CPC分类号： B29C33/62 ,  B29C43/003 ,  B29C43/021 ,  B29C43/222 ,  B29C43/52 ,  B29C2043/025 ,  B29C2043/3211 ,  B29C2043/568 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)n-1— RELEASE-M(X)n-m-1Qm, Or RELEASE-M(OR)n-1—, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is a halogen or cyano, especially Cl, F, or Br; Q is hydrogen or alkyl group; M is the number Q represents R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and N is the valence −1 of M, and n-m-1 is at least 1 provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patters in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent process, reproduced in the substrate or in another material which is added onto the substrate.

    Method and apparatus of electrical field assisted imprinting
    4.
    发明授权
    Method and apparatus of electrical field assisted imprinting 有权
    电场辅助印迹的方法和装置

    公开(公告)号：US08852494B2

    公开(公告)日：2014-10-07

    申请号：US11933170

    申请日：2007-10-31

    申请人： Stephen Y. Chou ,  Xiaogan Liang

    发明人： Stephen Y. Chou ,  Xiaogan Liang

    IPC分类号： B29C35/00

    CPC分类号： B29C43/021 ,  B29C43/003 ,  B29C43/36 ,  B29C2043/025 ,  B29C2043/3211 ,  B29C2043/3488 ,  B29C2043/568 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： A method and apparatus for performing nanoimprint lithography. When an electric field is applied between the mold and the substrate, various forces can be generated among molds, substrates, and resists. The electrostatic force between the mold and the substrate can serve as an imprinting pressure to press the structured mold into the conformable resist. In addition, the electric field induces additional wetting forces (electrowetting or dielectrophoresis) in a liquid resist, which can assist the flow and filling of the liquid resist into fine structures.

    摘要翻译： 一种用于进行纳米压印光刻的方法和装置。 当在模具和基板之间施加电场时，可以在模具，基板和抗蚀剂之间产生各种力。 模具和基板之间的静电力可以用作将结构化模具压入适形抗蚀剂的压印压力。 此外，电场在液体抗蚀剂中引起额外的润湿力（电润湿或介电电泳），这可以帮助将液体抗蚀剂流动和填充到精细结构中。

    Methods and apparatus of pressure imprint lithography
    6.
    发明授权
    Methods and apparatus of pressure imprint lithography 有权
    压印压印法的方法和装置

    公开(公告)号：US07887739B2

    公开(公告)日：2011-02-15

    申请号：US11928844

    申请日：2007-10-30

    申请人： Stephen Y. Chou ,  Wei Zhang

    发明人： Stephen Y. Chou ,  Wei Zhang

    IPC分类号： B29C43/36 ,  B29C43/56

    CPC分类号： B29C43/003 ,  B29C33/62 ,  B29C43/021 ,  B29C43/36 ,  B29C43/52 ,  B29C43/56 ,  B29C59/022 ,  B29C59/026 ,  B29C2043/025 ,  B29C2043/3211 ,  B29C2043/568 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/7053

    摘要： An improved method of imprint lithography involves using fluid-induced pressure from electric or magnetic fields to press a mold onto a substrate having a moldable surface. In essence, the method comprises the steps of providing a substrate having a moldable surface, providing a mold having a molding surface and pressing the molding surface and the moldable surface together by electric or magnetic fields to imprint the molding surface onto the moldable surface. The molding surface advantageously comprises a plurality of projecting features of nanoscale extent or separation, but the molding surface can also be a smooth planar surface, as for planarization. The improved method can be practiced without mechanical presses and without sealing the region between the mold and the substrate.

    摘要翻译： 改进的压印光刻方法涉及使用来自电场或磁场的流体诱导压力将模具压到具有可模制表面的基底上。 实质上，该方法包括以下步骤：提供具有可模制表面的基底，提供具有模制表面的模具，并通过电场或磁场将成型表面和可模制表面压在一起，以将模制表面压印到可模制表面上。 模制表面有利地包括多个纳米尺度或分离的突出特征，但是成型表面也可以是平滑的平坦表面。 可以在没有机械压力机的情况下实施改进的方法，并且不密封模具和基板之间的区域。

    METHOD AND APPARATUS OF ELECTRICAL FIELD ASSISTED IMPRINTING
    7.
    发明申请
    METHOD AND APPARATUS OF ELECTRICAL FIELD ASSISTED IMPRINTING 有权
    电场辅助印刷的方法和装置

    公开(公告)号：US20080217822A1

    公开(公告)日：2008-09-11

    申请号：US11933170

    申请日：2007-10-31

    申请人： Stephen Y. Chou ,  Xiaogan Liang

    发明人： Stephen Y. Chou ,  Xiaogan Liang

    IPC分类号： B29C35/08

    CPC分类号： B29C43/021 ,  B29C43/003 ,  B29C43/36 ,  B29C2043/025 ,  B29C2043/3211 ,  B29C2043/3488 ,  B29C2043/568 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： A method and apparatus for performing nanoimprint lithography. When an electric field is applied between the mold and the substrate, various forces can be generated among molds, substrates, and resists. The electrostatic force between the mold and the substrate can serve as an imprinting pressure to press the structured mold into the conformable resist. In addition, the electric field induces additional wetting forces (electrowetting or dielectrophoresis) in a liquid resist, which can assist the flow and filling of the liquid resist into fine structures.

    摘要翻译： 一种用于进行纳米压印光刻的方法和装置。 当在模具和基板之间施加电场时，可以在模具，基板和抗蚀剂之间产生各种力。 模具和基板之间的静电力可以用作将结构化模具压入适形抗蚀剂的压印压力。 此外，电场在液体抗蚀剂中引起额外的润湿力（电润湿或介电电泳），这可以帮助将液体抗蚀剂流动和填充到精细结构中。

    Methods and apparatus of field-induced pressure imprint lithography
    8.
    发明申请
    Methods and apparatus of field-induced pressure imprint lithography 审中-公开
    场诱导压印法的方法和装置

    公开(公告)号：US20040036201A1

    公开(公告)日：2004-02-26

    申请号：US10445578

    申请日：2003-05-27

    申请人： PRINCETON UNIVERSITY

    发明人： Stephen Y. Chou ,  Wei Zhang

    IPC分类号： B29C043/02

    CPC分类号： B29C43/003 ,  B29C33/62 ,  B29C43/021 ,  B29C43/36 ,  B29C43/52 ,  B29C43/56 ,  B29C59/022 ,  B29C59/026 ,  B29C2043/025 ,  B29C2043/3211 ,  B29C2043/568 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/7053

    摘要： An improved method of imprint lithography involves using fluid-induced pressure from electric or magnetic fields to press a mold onto a substrate having a moldable surface. In essence, the method comprises the steps of providing a substrate having a moldable surface, providing a mold having a molding surface and pressing the molding surface and the moldable surface together by electric or magnetic fields to imprint the molding surface onto the moldable surface. The molding surface advantageously comprises a plurality of projecting features of nanoscale extent or separation, but the molding surface can also be a smooth planar surface, as for planarization. The improved method can be practiced without mechanical presses and without sealing the region between the mold and the substrate.

    摘要翻译： 改进的压印光刻方法涉及使用来自电场或磁场的流体诱导压力将模具压到具有可模制表面的基底上。 实质上，该方法包括以下步骤：提供具有可模制表面的基底，提供具有模制表面的模具，并通过电场或磁场将成型表面和可模制表面压在一起，以将模制表面压印到可模制表面上。 模制表面有利地包括多个纳米尺度或分离的突出特征，但是成型表面也可以是平滑的平坦表面。 可以在没有机械压力机的情况下实施改进的方法，并且不密封模具和基板之间的区域。

    Lithographic method for molding pattern with nanoscale features
    9.
    发明申请
    Lithographic method for molding pattern with nanoscale features 审中-公开
    具有纳米尺度特征的成型图案的平版印刷方法

    公开(公告)号：US20030080471A1

    公开(公告)日：2003-05-01

    申请号：US10244276

    申请日：2002-09-16

    发明人： Stephen Y. Chou

    IPC分类号： B29C033/60

    CPC分类号： B29C43/021 ,  B29C33/62 ,  B29C43/003 ,  B29C43/52 ,  B29C59/022 ,  B29C59/026 ,  B29C2043/025 ,  B29C2043/3211 ,  B29C2043/568 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/7053

    摘要： The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)nnull1nullRELEASE-M(X)nnullmnull1Qm, or RELEASE-M(OR)nnull1null, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is halogen or cyano, especially Cl, F, or Br, Q is hydrogen or alkyl group; m is the number of Q groups; R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and; n is the valence null1 of M, and nnullmnull1 is at least 1 provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent processes, reproduced in the substrate or in another material which is added onto the substrate.

    摘要翻译： 持续释放材料的薄涂层（小于和接近单分子涂层）的添加包括优选的下式化合物：RELEASE-M（X）n-1-RELEASE-M（X）nm-1Qm或RELEASE-M（或 ）n-1-，其中RELEASE是长度为4至20个原子，优选6至16个原子长度的分子链，该分子具有极性或非极性; M是金属原子，半导体原子或半金属原子; X是卤素或氰基，特别是Cl，F或Br，Q是氢或烷基; m是Q组的数量; R是氢，烷基或苯基，优选氢或1至4个碳原子的烷基; 和; n是M的价数-1，n-m-1至少为1提供了良好的剥离性质。 涂布的基材特别适用于光刻方法，并且提供了在涂布在基材上的薄膜中产生超细（次25nm）图案的设备，其中具有至少一个突出特征的模具被压入薄 薄膜承载在基板上。 模具中的突出特征产生薄膜的凹部。 模具从薄膜中取出。 然后对薄膜进行处理，使得去除暴露下面的基底的凹槽中的薄膜。 因此，在薄膜中更换模具中的图案，完成光刻。 在随后的工艺中，薄膜中的图案将在衬底中或在添加到衬底上的另一种材料中再现。