公开(公告)号：US20090150123A1

公开(公告)日：2009-06-11

申请号：US11950747

申请日：2007-12-05

申请人： Matthew R. ARCHIBALD ,  Richard C. CHU ,  Hendrik F. HAMANN ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT

发明人： Matthew R. ARCHIBALD ,  Richard C. CHU ,  Hendrik F. HAMANN ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT

IPC分类号： G06F17/50 ,  G06G7/50

CPC分类号： G06F17/509 ,  G06F1/20 ,  G06F17/5004 ,  G06F2217/78 ,  G06F2217/80

摘要： A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.

摘要翻译： 提供了一种便于在数据中心内安装一个或多个电子机架的方法。 该方法包括：将多个热模拟器放置在数据中心中的数据中心布局中，以建立热仿真数据中心，每个热模拟器模拟多个模拟数据中心的相应电子机架的气流吸入或加热气流排气中的至少一个 电子机架要安装在数据中心; 监测多个位置的热仿真数据中心内的温度，以及如果测量温度在包含多个电子机架时数据中心的可接受温度范围内，则验证数据中心布局; 以及使用已验证的数据中心布局在所述数据中心内建立所述多个电子机架，所述建立包括用相应的电子机架重新配置或替换每个热模拟器中的至少一个。

公开(公告)号：US07492593B2

公开(公告)日：2009-02-17

申请号：US12049632

申请日：2008-03-17

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20754

摘要： Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

摘要翻译： 使用冷却液增强电子系统的空气冷却，以冷却进入系统的空气，并消除由电子设备消散的热量。 冷却的电子系统包括具有抽屉的框架，其中包含要冷却的电子元件。 框架包括一个带空气入口的前部和一个带有空气出口的后部。 框架包围框架，并且包括位于空气入口上方的前盖，位于空气出口上方的后盖，并且第一和第二侧面空气在框架的相对侧返回。 至少一个空气移动装置在电子抽屉之间建立空气流。 空气流在后盖处分叉并经由第一和第二侧面空气返回和前盖返回到进气口。 空气对液体的热交换器冷却流过电子抽屉的空气。

公开(公告)号：US07486512B2

公开(公告)日：2009-02-03

申请号：US12020688

申请日：2008-01-28

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20745 ,  F24F13/04 ,  H05K7/20736

摘要： An apparatus is provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

摘要翻译： 提供了一种用于便于冷却电子机架的设备，该电子机架采用联接到电子机架的空气输送结构。 空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流 。 输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却 的电子机架。

公开(公告)号：US07450385B1

公开(公告)日：2008-11-11

申请号：US11763678

申请日：2007-06-15

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20781 ,  F28F9/0275 ,  H05K7/20772 ,  Y10T29/5313

摘要： A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate swivel connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.

摘要翻译： 提供了一种用于促进电子机架的电子抽屉的冷却的冷却装置。 该装置包括构造成用于安装到电子机架的双折门组件。 门组件包括第一门和第二门，每个门被配置为单独地铰接安装到电子机架上。 该装置还包括冷却剂分配装置，其中冷却剂供应歧管安装到第一门，并且其冷却剂返回歧管安装到第二门。 单独的旋转连接件与冷却剂供应和返回歧管流体连通地联接，以便于冷却剂供给和从歧管返回并且用于促进门相对于电子机架的枢转运动。 多个冷却剂分配端口设置在供应和返回歧管内，并且设置成便于冷却剂供应和返回到电子抽屉。

公开(公告)号：US20080265404A1

公开(公告)日：2008-10-30

申请号：US11742161

申请日：2007-04-30

申请人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

发明人： Bruce Furman ,  Madhusudan K. Iyengar ,  Paul A. Lauro ,  Yves Martin ,  Roger R. Schmidt ,  Da-Yuan Shih ,  Theodore G. Van Kessel ,  Wei Zou

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

摘要翻译： 公开了用于从集成电路和电路芯片散热的组件。 组件包括作为用于将热从芯片传递到散热器（HS）的热界面材料（TIM）的低熔点焊料，其中低熔点焊料的熔点低于芯片的最大工作温度。 还公开了制造组件的方法。

公开(公告)号：US20080232069A1

公开(公告)日：2008-09-25

申请号：US12131301

申请日：2008-06-02

申请人： Richard C. Chu ,  Michael J. Ellsworth ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth ,  Donald W. Porter ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K5/00

CPC分类号： H05K7/2079

摘要： An apparatus is provided for facilitating cooling of an electronics rack. The apparatus includes a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and second perforated planar surfaces covering first and second main sides, respectively, of the air-to-liquid heat exchanger. The heat exchanger is supported by the support frame and includes inlet and outlet plenums disposed adjacent to the edge of the outlet door cover hingedly mounted to the rack. Each plenum is in fluid communication with a respective connect coupling, and the heat exchanger further includes multiple horizontally-oriented heat exchange tube sections each having serpentine cooling channel with an inlet and an outlet coupled to the inlet plenum and outlet plenum, respectively. Fins extend from the heat exchange tube sections.

摘要翻译： 提供了一种用于促进电子机架的冷却的装置。 该装置包括安装到铰链地固定到机架的空气出口侧的出口门盖的热交换组件。 热交换组件包括支撑框架，空气 - 液体热交换器和分别覆盖空气 - 液体热交换器的第一和第二主侧的第一和第二穿孔平面。 热交换器由支撑框架支撑并且包括邻近出口门盖的边缘设置的入口和出口增压室，其铰接地安装到机架。 每个气室与相应的连接联接件流体连通，并且热交换器还包括多个水平定向的热交换管段，每个管路具有蛇形冷却通道，分别具有连接到入口压力室和出口增压室的入口和出口。 翅片从热交换管段延伸。

公开(公告)号：US07408776B2

公开(公告)日：2008-08-05

申请号：US11539905

申请日：2006-10-10

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Randall G. Kemink ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/20509 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K7/20009 ,  H05K7/20772 ,  H01L2224/0401

摘要： A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

摘要翻译： 提供导电热传输冷却系统和方法来冷却电子系统的一次和二次发热部件。 冷却系统包括液体冷却子系统，其包括物理耦合到电子系统的至少一个主要发热部件的至少一个液体冷却冷却板，以及耦合到流体连通的流体传导冷却剂管 至少一个液冷冷板。 导热辅助结构耦合到冷却剂承载管和电子系统的至少一个二次发热部件。 当使用时，导热辅助结构提供从至少一个二次发热部件到耦合到其上的至少一个导热冷却剂输送管的导热传输，并且因此通过对流通过其中的液体冷却剂。

公开(公告)号：US20080174961A1

公开(公告)日：2008-07-24

申请号：US12055455

申请日：2008-03-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20736 ,  F28F1/20 ,  F28F1/22 ,  H05K7/20009 ,  H05K7/20554 ,  H05K7/20772

摘要： A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

摘要翻译： 为多组件电子系统提供混合冷却系统和制造方法。 该冷却系统包括用于建立穿过要被冷却的至少一个主要和至少一个次要发热部件的空气流的空气移动装置; 以及液体冷却子系统，其包括物理耦合到所述至少一个主发热部件的至少一个冷板和与所述至少一个冷板流体连通的导热冷却剂供给管。 导热辅助结构联接到冷却剂承载管并且包括从其表面延伸的多个导热翅片。 多个导热翅片至少部分地设置在待冷却的至少一个二次发热组件上，并且为跨越电子系统的多个部件建立的空气流的至少一部分提供补充冷却。

公开(公告)号：US20080165499A1

公开(公告)日：2008-07-10

申请号：US12053863

申请日：2008-03-24

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： A coolant control unit for a liquid cooled electronics system is provided, which includes an external coolant inlet and outlet for receiving and returning external coolant; an internal coolant loop for circulating coolant to the electronics system; a first and second control valve coupling the external coolant inlet and outlet to the internal coolant loop; a heat exchanger connected between the first and second control valves; and control logic for controlling operation of the coolant control unit in one of an external coolant mode and an internal coolant mode. In the external coolant mode, the first and second control valves allow passage of external coolant through the internal coolant loop to the electronics system, and in the internal coolant mode, the first and second control valves isolate coolant within the internal coolant loop from the external coolant inlet and outlet, and pass the coolant therein through the heat exchanger.

摘要翻译： 提供了一种用于液冷电子系统的冷却剂控制单元，其包括用于接收和返回外部冷却剂的外部冷却剂入口和出口; 用于将冷却剂循环到电子系统的内部冷却剂回路; 将外部冷却剂入口和出口连接到内部冷却剂回路的第一和第二控制阀; 连接在第一和第二控制阀之间的热交换器; 以及用于控制冷却剂控制单元在外部冷却剂模式和内部冷却剂模式之一中的操作的控制逻辑。 在外部冷却剂模式中，第一和第二控制阀允许外部冷却剂通过内部冷却剂回路到电子系统，并且在内部冷却剂模式中，第一和第二控制阀将内部冷却剂回路内的冷却剂与外部 冷却剂入口和出口，并使冷却剂通过热交换器。

公开(公告)号：US07362574B2

公开(公告)日：2008-04-22

申请号：US11462735

申请日：2006-08-07

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20 ,  H01L23/24 ,  F28D15/00

CPC分类号： H01L23/4735 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10S165/908 ,  H01L2224/0401

摘要： A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

摘要翻译： 提供冷却装置和直接冷却冲击模块，以及其制造方法。 冷却装置和直接冲击冷却模块包括歧管结构和用于将冷却剂喷射到待冷却表面上的喷射孔板。 喷射孔板包括用于在要冷却的表面引导冷却剂的多个喷射孔，其是配置有多个喷射孔结构的整体板。 每个喷射孔结构从喷射孔板的下表面朝向要冷却的表面突出，并且包括相应的喷射孔。 喷射孔结构被间隔开以限定其间的冷却剂流出物去除区域，其有助于将冷却剂流出物从被冷却到其周边区域的电子部件的中心区域上方移除，从而减少喷射孔板上的压降。