SUBSTRATE TREATING APPARATUS, SUBSTRATE TREATING SYSTEM, AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20230256463A1

    公开(公告)日:2023-08-17

    申请号:US18168508

    申请日:2023-02-13

    CPC classification number: B05B12/122 B05D1/002 B05B13/0228

    Abstract: Disclosed is a substrate treating apparatus for performing a predetermined treatment on a substrate. The apparatus includes a design information memory unit configured to store three-dimensional design information, an imaging unit configured to capture a real image containing the target components, a matching processing unit configured to determine which of the target components matches a real image shape as a two-dimensional shape in the real image captured by the imaging unit in accordance with a degree of coincidence of feature points between the real image shape and a two-dimensional design shape based on three-dimensional design information about the target components, and an abnormality detecting unit configured to detect an abnormality of the target component through comparison between the reality information about the matched target component based on the real image and the normal information based on the three-dimensional design information when the target component is normal.

    BASE-MATERIAL DRYING DEVICE AND PRINTING DEVICE

    公开(公告)号:US20230249475A1

    公开(公告)日:2023-08-10

    申请号:US18160425

    申请日:2023-01-27

    CPC classification number: B41J11/002 B41J11/007 B41J29/02 B41J2/145

    Abstract: A dryer includes a plurality of transport rollers, turn bars, and a heater. Some of the transport rollers support the continuous base material transported in the +Y direction in a first position in the Z direction. Some of the transport rollers support the continuous base material transported in the −Y direction in a second position in the Z direction. The turn bars support the continuous base material in a third position in the Z direction while bending the continuous base material so that the continuous base material is transported in the −X direction. The heater is capable of heating part of the continuous base material in a position on the transport path TR between the transport rollers and the turn bars. The transport rollers and the turn bars are located on the second surface side of the continuous base material.

    Inkjet printing apparatus
    93.
    发明授权

    公开(公告)号:US11707931B2

    公开(公告)日:2023-07-25

    申请号:US17587391

    申请日:2022-01-28

    CPC classification number: B41J2/145 B41J13/0009

    Abstract: An inkjet printing apparatus for printing on a printing medium by dispensing inks thereto. The apparatus includes a transport device; print heads for performing printing by dispensing the inks to the printing medium; and a drying section including a heat source for generating heat for drying the inks dispensed to the printing medium, and a shutter switchable between an open state and a closed state. In the open state, a drying amount of heat is applied for drying the inks dispensed to the printing medium, and in the closed state, the heat from the heat source is applied in a minute amount of heat smaller than the drying amount of heat. A controller switches the shutter to the open state when a transporting speed of the printing medium is faster than a predetermined threshold, and switches the shutter to the closed state when the transporting speed of the printing medium becomes equal to or less than the predetermined threshold.

    Focusing position detection method, focusing position detection device and recording medium

    公开(公告)号:US11706526B2

    公开(公告)日:2023-07-18

    申请号:US17554701

    申请日:2021-12-17

    Inventor: Takuya Yasuda

    CPC classification number: H04N23/67

    Abstract: In a focusing position detection method, a plurality of object images are acquired by imaging an imaging object by an imager while changing a focal position in M stages along an optical axis. A saturation consecutive region is acquired. The saturation consecutive region is included in all N (where N is a natural number equal to or more than three and equal to and less M) object images acquired while successively changing the focal position in N stages along the optical axis. A focusing degree decrease as the focal position approaches focusing position in the saturation consecutive region. Based on this property, the focusing position is detected.

    Printing apparatus for performing printing to an elongated print medium

    公开(公告)号:US11697293B2

    公开(公告)日:2023-07-11

    申请号:US17387262

    申请日:2021-07-28

    CPC classification number: B41J11/0024 B41J11/0022 B41J11/00216

    Abstract: Disclosed is a printing apparatus in which web paper is transported to a printing face contact roller in a swirling form while a direction thereof is turned by first to fourth turning rollers. Heating units are arranged so as to face a printing face of the web paper between the two first and second turning rollers, between the two third and fourth turning rollers, and between the fourth turning roller and the printing face contact roller individually. Such arrangement can achieve a compact drying mechanism. The heating units each directly heat inks on the printing face, and thus do not overheat the web paper. Moreover, the heating units are not directed upward. This avoids contact of the web paper to a front side face of each of the heating units when the web paper slackens.

    HEAT TREATMENT APPARATUS
    97.
    发明公开

    公开(公告)号:US20230207348A1

    公开(公告)日:2023-06-29

    申请号:US17926642

    申请日:2021-05-25

    Abstract: A plurality of substrate support pins are erected on a susceptor that holds a semiconductor wafer that is an object being treated. The plurality of substrate support pins are set in a ring shape at equal intervals. A flash lamp irradiates the semiconductor wafer supported by the plurality of substrate support pins with flash light to heat the semiconductor wafer. The radius of a setting circle in which the plurality of substrate support pins are set is made larger as the pulse width of flash light emitted from the flash lamp decreases. To irradiate the semiconductor wafer with flash light while having the semiconductor wafer supported by the plurality of substrate support pins can prevent cracking of the semiconductor wafer despite possible abrupt deformation of the semiconductor wafer due to the flash-light irradiation.

    Moving device, moving method and printing apparatus

    公开(公告)号:US11679608B2

    公开(公告)日:2023-06-20

    申请号:US17469074

    申请日:2021-09-08

    CPC classification number: B41J25/001

    Abstract: Both end parts of a cord are fixed to a maintenance mounting frame, and an intermediate part of the cord is laid on a first body-side rotating member, a head-side rotating member and a second body-side rotating member. Here, when a motor is driven, the movement restriction of the cord is released and a movement of a head mounting frame is restricted, whereby only the maintenance mounting frame moves together with a maintenance part while the movement of the head mounting frame is restricted. Further, when the motor is driven, a movement of the cord is restricted and the movement restriction of the head mounting frame is released, whereby only the head mounting frame moves together with a discharge head while a movement of the maintenance part is restricted.

    Substrate treating apparatus
    100.
    发明授权

    公开(公告)号:US11676842B2

    公开(公告)日:2023-06-13

    申请号:US16695260

    申请日:2019-11-26

    Inventor: Joji Kuwahara

    Abstract: A substrate treating apparatus includes a transporting space, transport mechanisms, and heat-treating sections. The transport mechanisms are provided in the transporting space. The heat-treating section, transporting space, and heat-treating section are aligned in the stated order in a transverse direction. One heat-treating section includes a plurality of heat-treating units. The heat-treating units are arranged in a longitudinal direction. The other heat-treating section includes a plurality of heat-treating units. These heat-treating units are also arranged in the longitudinal direction. One transport mechanism transports substrates to the heat-treating units. The other transport mechanism also transports substrates to the heat-treating units.

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