公开(公告)号：US20180246316A1

公开(公告)日：2018-08-30

申请号：US15754158

申请日：2016-01-07

Applicant: SHENZHEN GUOHUA OPTOELECTRONICS CO., LTD. ,  ACADEMY OF SHENZHEN GUOHUA OPTOELECTRONICS ,  SOUTH CHINA NORMAL UNIVERSITY

Inventor： Guofu ZHOU ,  Fangchao TIAN ,  Zhijie LUO ,  Weinan ZHANG

IPC: G02B26/00

CPC classification number: G02B26/005 ,  G02B26/00

Abstract: Three-layer full-color dynamic electronic paper, comprising a substrate, a controller, a first EWOD display layer, a second EWOD display layer and a third EWOD display layer, wherein each of the first, second and third EWOD display layer is comprised of an upper transparent electrode plate, a hydrophobic insulating layer, pixel walls, colored ink, colorless liquid, a lower transparent electrode plate, an encapsulation adhesive, and a driving chip connected to the upper transparent electrode plate and the lower transparent electrode plate respectively; the lower transparent electrode plate of the third EWOD display layer is located above the substrate; the colored ink filled in the first, second and third EWOD display layer is cyan ink, magenta ink and yellow ink, respectively; and, the controller controls voltage waveforms of the three driving chips according to a subtractive color mixture principle of three primary colors for printing, so as to realize full-color displaying.

公开(公告)号：US20180138983A1

公开(公告)日：2018-05-17

申请号：US15490479

申请日：2017-04-18

Applicant: South China Normal University

Inventor： Zhiyou GUO ,  Jie SUN ,  Jing HUANG ,  Huiqing SHUN ,  Hongyong HUANG ,  Yong HUANG ,  Xian YANG ,  Zhuding ZHANG ,  Yang LIU ,  Min GUO ,  Shunyu YAO ,  Xinyan YI ,  Xuancong FANG

IPC: H04B10/50 ,  H04B10/116 ,  H05B33/08 ,  H01L27/15 ,  H01L49/02 ,  H01L33/12 ,  H01L33/06 ,  H01L33/14 ,  H01L33/42

CPC classification number: H04B10/502 ,  H01L27/15 ,  H01L28/10 ,  H01L33/06 ,  H01L33/12 ,  H01L33/145 ,  H01L33/42 ,  H04B10/116 ,  H05B33/0821

Abstract: A visible light communication emission device with improved response frequency is provided, comprising a substrate, wherein an inductance coil module is provided on the substrate, a LED chip matrix formed by series connection of a plurality of LED chips is provided on the inductance coil module, and the inductance coil module and the LED chip matrix are connected in series, wherein inductance value L of the inductance coil module is configured to be: L=1/(ω2C), with C representing capacity in the device provided by LED chips and ω representing frequency, wherein the inductance coil module comprises more than one inductance coil whose composition materials from inside to outside are successively Cr, Al, Cr, Ti, and Ag.