公开(公告)号：US20070012562A1

公开(公告)日：2007-01-18

申请号：US11484333

申请日：2006-07-11

申请人： Hien Minh Le ,  Akihiro Hosokawa ,  Avi Tepman

发明人： Hien Minh Le ,  Akihiro Hosokawa ,  Avi Tepman

IPC分类号： C23C14/00 ,  C23C14/32

CPC分类号： C23C14/35 ,  H01J37/3408 ,  H01J37/3455

摘要： A rectangular magnetron placed at the back of a rectangular sputtering target for coating a rectangular panel and having magnets of opposed polarities arranged to form a gap therebetween corresponding to a plasma track adjacent the target which extends in a closed serpentine or spiral loop. The spiral may have a large number of wraps and the closed loop may be folded before wrapping. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of the target with a scan length of, for example, about 100 mm for a 2 m target corresponding to at least the separation of the gap between parallel portions of the loop. A central ferromagnetic shim beneath some magnets in the loop may compensate for vertical droop. The magnetron may be scanned in two alternating double-Z patterns rotated 90° between them.

摘要翻译： 放置在矩形溅射靶的背面的矩形磁控管，用于涂覆矩形面板并且具有相对极性的磁体，所述磁体布置成在对应于邻近靶的等离子体轨道之间形成间隙，所述等离子体轨道以闭合的蛇形或螺旋形环路延伸。 螺旋可以具有大量的包装，并且闭合的环可以在包装之前折叠。 磁控管的尺寸仅稍低于目标的尺寸，并且在目标的两个垂直方向上扫描，对于对应于至少间隙间隔的2m靶的扫描长度例如为约100mm 在环路的平行部分之间。 环路中一些磁铁下方的中心铁磁垫片可以补偿垂直下垂。 磁控管可以以它们之间旋转90°的两个交替的双Z图案进行扫描。

公开(公告)号：US20070006936A1

公开(公告)日：2007-01-11

申请号：US11176747

申请日：2005-07-07

申请人： Akihiro Hosokawa ,  Makoto Inagawa

发明人： Akihiro Hosokawa ,  Makoto Inagawa

IPC分类号： B65B31/00

CPC分类号： H01L21/67201

摘要： A load lock chamber and method for regulating the temperature of substrates positioned within a chamber are provided. In one embodiment, the load lock chamber is configured to remove gases heated during venting of the load lock chamber. In another embodiment, the load lock chamber is configured to provide a cross flow of vent gases. In yet another embodiment, the load lock chamber includes a resistive heating element configured to uniformly head substrates positioned within the load lock chamber.

摘要翻译： 提供了一种负载锁定室和用于调节位于室内的基板的温度的方法。 在一个实施例中，负载锁定室被配置为去除在负载锁定室的排气期间被加热的气体。 在另一个实施例中，负载锁定室被配置成提供排气的交叉流。 在另一个实施例中，负载锁定室包括电阻加热元件，该电阻加热元件被配置成使位于负载锁定室内的基板均匀地顶起。

公开(公告)号：US20060266639A1

公开(公告)日：2006-11-30

申请号：US11414016

申请日：2006-04-28

申请人： Hien-Minh Huu Le ,  Bradley Stimson ,  Akihiro Hosokawa

发明人： Hien-Minh Huu Le ,  Bradley Stimson ,  Akihiro Hosokawa

IPC分类号： C23C14/32 ,  C23C14/00

CPC分类号： C23C14/3407 ,  H01J37/3423 ,  H01J37/3435 ,  H01J37/3491

摘要： A target assembly composed of multiple target tiles bonded in an array to a backing plate of another material. The edges of the tile within the interior of the array are formed with complementary structure edges to form a gap between the tiles having at least a portion that is inclined to the target normal. The gap may be simply beveled and slant at an angle of between 10° and 55°, preferably 15° and 50°, with respect to the target normal or they may be convolute with one portion horizontal or otherwise inclined to prevent a line of sight from the bottom to top. The area of the backing plate underlying the gap may be coated or overlain with a foil of the material of the target, for both perpendicular and sloping gaps, and have a polymeric foil adjacent an elastomeric bonding layer to exclude bonding material from the gap.

摘要翻译： 由多个靶阵列组成的目标组件，其以阵列的形式结合到另一材料的背板上。 在阵列内部的瓦片的边缘形成有互补的结构边缘，以在具有至少一部分倾斜于目标法线的瓦片之间形成间隙。 间隙可以简单地倾斜并相对于目标法线倾斜10°至55°，优选15°和50°之间的角度，或者它们可以与一部分水平或以其它方式倾斜以防止视线 从下到上。 在间隙下面的背板的区域可以对于垂直和倾斜的间隙进行涂覆或覆盖靶的材料的箔，并且具有邻近弹性体粘结层的聚合物箔，以从间隙排除粘合材料。

公开(公告)号：US20050285419A1

公开(公告)日：2005-12-29

申请号：US10876439

申请日：2004-06-25

申请人： Takayuki Matsumoto ,  Akihiro Hosokawa

发明人： Takayuki Matsumoto ,  Akihiro Hosokawa

IPC分类号： B65G49/07

CPC分类号： H01L21/67742 ,  Y10S294/902 ,  Y10S414/141

摘要： Embodiments of an end effector assembly for a substrate robot are provided herein. In one embodiment, the end effector assembly includes a wrist and a first and a second end effector coupled to the wrist in a spaced apart relationship. The first end effector includes a base coupled to the wrist and a tip coupled to the base opposite the wrist. The base and the tip may be made of the same or different materials. The first and the second end effectors may have different resonant frequencies to minimize vibration. Optionally, a low emissivity coating may be provided on the first and second end effector. The low emissivity coating may further have a plurality of stress relief grooves to reduce or prevent flaking of the coating due to differences in rates of thermal expansion between the coating and the underlying end effector.

摘要翻译： 本文提供了用于衬底机器人的端部执行器组件的实施例。 在一个实施例中，端部执行器组件包括手腕和以间隔开的关系耦合到手腕的第一和第二端部执行器。 第一端部执行器包括联接到手腕的底座和与手腕相对的底座。 基部和尖端可以由相同或不同的材料制成。 第一和第二端部执行器可具有不同的谐振频率以使振动最小化。 任选地，可以在第一和第二端部执行器上提供低辐射率涂层。 低辐射率涂层可以进一步具有多个应力消除凹槽，以减少或防止涂层由于涂层和下面的末端执行器之间的热膨胀率的差异而剥落。

公开(公告)号：US06949143B1

公开(公告)日：2005-09-27

申请号：US09464362

申请日：1999-12-15

申请人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

发明人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

IPC分类号： G02F1/13 ,  B65G49/06 ,  C23C14/56 ,  C23C16/44 ,  H01L21/00 ,  H01L21/205 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/677 ,  H01L21/687 ,  C23C16/00

CPC分类号： H01L21/68742 ,  B65G49/068 ,  B65G2249/02 ,  B65G2249/04 ,  C23C14/566 ,  C23C14/568 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67745 ,  H01L21/67748

摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as wall as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

摘要翻译： 一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。 第一支撑结构位于第二支撑结构的上方。 负载锁包括用于控制支撑结构的垂直位置的电梯。 负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中，并且将加工的衬底从负载锁上移除，作为壁作为第二孔，以允许将未加工的衬底从负载锁中移除并将处理的衬底插入 负载锁。 一个冷却板也位于负载锁中。 冷却板包括适于在其上支撑经处理的基板的表面。 加热装置可以位于第一支撑结构上方的装载锁中。

公开(公告)号：US06825447B2

公开(公告)日：2004-11-30

申请号：US10321289

申请日：2002-12-17

申请人： Sam H. Kim ,  Akihiro Hosokawa ,  Dong Choon Suh

发明人： Sam H. Kim ,  Akihiro Hosokawa ,  Dong Choon Suh

IPC分类号： F27B514

CPC分类号： H01L21/67109

摘要： Embodiments of the invention generally provides an apparatus and method for heating substrates, comprising a heater disposed within a chamber, a plurality of heated supports movably disposed within the chamber to support at least two substrates thereon and a contamination collector disposed in communication with the chamber.

摘要翻译： 本发明的实施例总体上提供了一种用于加热衬底的装置和方法，包括设置在室内的加热器，可移动地设置在腔室内的多个加热支架，以支撑其中的至少两个基板和与室连通的污染物收集器。

公开(公告)号：US06765178B2

公开(公告)日：2004-07-20

申请号：US10025152

申请日：2001-12-18

申请人： Quanyuan Shang ,  Janine Kardokus ,  Akihiro Hosokawa

发明人： Quanyuan Shang ,  Janine Kardokus ,  Akihiro Hosokawa

IPC分类号： F27B514

CPC分类号： H01L21/67109

摘要： Embodiments of the invention generally provide an apparatus and a method for providing a uniform thermal profile to a plurality of substrates during heat processing. In one embodiment, a cassette containing one or more heated substrate supports is moveably disposed within a heating chamber having an about uniform thermal profile therein to more uniformly heat the substrates.

摘要翻译： 本发明的实施例通常提供一种用于在热处理期间向多个基板提供均匀热分布的装置和方法。 在一个实施例中，包含一个或多个加热的衬底支撑件的盒可移动地设置在其中具有大致均匀的热分布的加热室内，以更均匀地加热衬底。

公开(公告)号：US5518593A

公开(公告)日：1996-05-21

申请号：US303098

申请日：1994-09-08

申请人： Akihiro Hosokawa ,  Richard E. Demaray ,  David E. Berkstresser

发明人： Akihiro Hosokawa ,  Richard E. Demaray ,  David E. Berkstresser

IPC分类号： C23C14/34 ,  C23C14/56 ,  H01J37/32 ,  H01J37/34 ,  H01L21/203

CPC分类号： H01J37/32458 ,  C23C14/3407 ,  C23C14/564 ,  H01J37/3411 ,  H01J37/3435 ,  H01J37/3497 ,  H01J2237/022

摘要： A shield in a PVD vacuum processing chamber having a configuration which minimizes or eliminates particulates originating from flaking or peeling off from the shield and from arcing between the biased target and surrounding grounded pieces is disclosed. The shield has an "h" cross section with the lower arch of the "h" facing a heater assembly which heats the shield to a temperature approximately equivalent to the temperature of the sputter deposited material. The surface of the shield is polished to promote the release of H.sub.2 O molecules from its surface during the time when a vacuum is initially being pumped. The inside surface of the shield (facing a heater assembly) is treated to have a higher coefficient of surface emissivity than the outer surface to retain more energy and provide more efficient heating. A shadow frame which spans the gap between the edge of the shield and the edge of the substrate being processed is indirectly heated by having a portion of its surface facing a matching portion of the shield, both portions having high emissivities. The shield is supported in the vacuum chamber and the shadow frame on the shield by a series of knife edge support assemblies.

摘要翻译： 公开了一种PVD真空处理室中的屏蔽罩，其具有最小化或消除源自屏蔽件剥离或剥离的微粒以及偏置的目标和周围的接地片之间的电弧的结构。 屏蔽件具有“h”横截面，其中“h”的下拱形面向加热器组件，该加热器组件将屏蔽件加热至与溅射沉积材料的温度大致相同的温度。 在最初抽真空时，屏蔽表面被抛光以促进H2O分子从其表面的释放。 屏蔽件的内表面（面向加热器组件）被处理成具有比外表面更高的表面发射系数，以保持更多的能量并提供更有效的加热。 通过使屏蔽体的一部分面对屏蔽件的匹配部分，间隔地加热跨越屏蔽边缘和正被处理的基板的边缘之间的间隙的阴影框架，两部分具有高的发射率。 屏蔽通过一系列刀刃支撑组件支撑在真空室和屏蔽罩上的阴影框架上。