OLED package structure, display panel and method for preparing package structure

    公开(公告)号:US11183661B2

    公开(公告)日:2021-11-23

    申请号:US16071107

    申请日:2017-09-29

    Inventor: Tao Wang Song Zhang

    Abstract: The present disclosure discloses an OLED package structure, a display panel and a method for preparing a package structure. The OLED package structure includes a substrate, an OLED disposed on the substrate, and a reinforcement hole disposed on at least one of the substrate and the OLED and extending along a side of the OLED towards the substrate; and an encapsulation layer covering the OLED, and at least a portion of the encapsulation layer extending into the reinforcement hole. Therefore, the reliability of the package structure can be increased, the adhesive strength of the package layer can be increased, peeling or package failure can be prevented, and the service life of the package structure can be improved.

    Method for manufacturing a display motherboard

    公开(公告)号:US11094894B2

    公开(公告)日:2021-08-17

    申请号:US16212754

    申请日:2018-12-07

    Abstract: The present disclosure provides a display motherboard and a method for manufacturing the same, a display substrate and a method for manufacturing the same, and a display device, and belongs to the field of display technology. In the method for manufacturing the display motherboard of the present disclosure, the display motherboard includes a plurality of display substrate areas each including a sub display area and a sub bending area; and the method for manufacturing the display motherboard includes: forming an adhesive force variable back film material having a first adhesive force on a flexible underlying substrate; removing the back film material in positions above the sub bending areas; and treating the remaining back film material to form a back film having a second adhesive force, wherein the second adhesive force is greater than the first adhesive force.

    ORGANIC LIGHT EMITTING COMPONENT, FABRICATION METHOD THEREOF, AND DISPLAY DEVICE

    公开(公告)号:US20210159447A1

    公开(公告)日:2021-05-27

    申请号:US16301669

    申请日:2018-02-07

    Abstract: The present disclosure provides an organic light emitting component The organic light emitting component includes a substrate, an intermediate structure layer disposed on the substrate. The intermediate structure layer includes a display area and a non-display area at a periphery of the display area. The intermediate structure layer further includes a planarization layer, and an anti-shrinkage stop structure disposed at the non-display area and a display structure portion disposed at the display area are both disposed on the planarization layer and spaced apart from each other. The organic light emitting component includes a thin film encapsulation structure layer disposed on the surface of the intermediate structure layer facing away from the substrate. The anti-shrinkage stop structure is disposed between the thin film encapsulation structure layer and the planarization layer, and a free end of the anti-shrinkage stop structure extends into the thin film encapsulation structure layer.

    Auxiliary spreading layer in a thin film package for an organic light emitting diode

    公开(公告)号:US10026927B2

    公开(公告)日:2018-07-17

    申请号:US15228657

    申请日:2016-08-04

    Abstract: A thin film package structure is provided. The thin film package structure includes a plurality of film layers arranged on the outside of a device, the plurality of film layers including inorganic and organic layers alternately laminated, wherein the innermost film layer and the outermost film layer among the plurality of film layers are inorganic layers, and an auxiliary spreading layer arranged between at least one pair of an inorganic layer and an organic layer adjacent within the plurality of film layers, wherein the hydrophilicity-hydrophobicity of the auxiliary spreading layer is the same as that of the organic layer in contact with the auxiliary spreading layer.

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