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公开(公告)号:US10096663B2
公开(公告)日:2018-10-09
申请号:US14785777
申请日:2015-03-12
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Zheng Liu , Xiaoyong Lu , Xiaolong Li , Chien Hung Liu , Chunping Long
Abstract: A manufacturing method of an array substrate, an array substrate and a display device are provided. The manufacturing method of the array substrate comprises: forming a first conductive thin film (100) on a base substrate (1); and patterning the first conductive thin film (100), to form a pattern of a cathode (11) on a first region (11) of the base substrate (1), and form a pattern of a gate electrode (4) on a second region (12) of the base substrate (1). Complexity and process time of a fabrication process of an array substrate can be reduced, a fabrication process of an organic electroluminescent panel can be simplified, and production cost can be reduced, by forming a cathode layer of a light-emitting diode and a gate electrode layer of a thin film transistor in different regions of the base substrate at the same time by one patterning process.
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公开(公告)号:US10049873B2
公开(公告)日:2018-08-14
申请号:US15228140
申请日:2016-08-04
Applicant: BOE Technology Group Co., Ltd.
Inventor: Xiaowei Xu , Xiaolong Li
IPC: H01L21/02 , H01L21/67 , H01L29/66 , H01L29/786 , B23K26/00
Abstract: The invention provides a preparation method of a low temperature poly-silicon thin film, a preparation method of a low temperature poly-silicon thin film transistor, and a laser crystallization apparatus, and belongs to the technical field of display. The preparation method of a low temperature poly-silicon thin film of the invention comprises: forming an amorphous silicon thin film on a transparent substrate; and performing laser annealing on said amorphous silicon thin film from a side of said amorphous silicon thin film departing from said substrate, and performing laser irradiation from a side of said substrate departing from said amorphous silicon thin film, to form a low temperature poly-silicon thin film. The preparation method of a low temperature poly-silicon thin film of the invention may not only perform laser annealing on an amorphous silicon thin film form a side of the amorphous silicon thin film departing from the substrate, but also perform laser irradiation from a side of the substrate departing from the amorphous silicon thin film, and the temperature of the amorphous silicon thin film can be retained by performing laser irradiation from a side of the substrate departing from the amorphous silicon thin film. In this way, the crystallization period of poly-silicon may be elongated, and it is possible to obtain crystal grains with larger sizes, to increase carrier mobility, and to reduce drain current.
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93.
公开(公告)号:US20170207086A1
公开(公告)日:2017-07-20
申请号:US15228140
申请日:2016-08-04
Applicant: BOE Technology Group Co., Ltd.
Inventor: Xiaowei Xu , Xiaolong Li
IPC: H01L21/02 , H01L29/66 , H01L21/67 , H01L29/786
CPC classification number: H01L21/02675 , B23K26/00 , B23K26/0006 , B23K26/0619 , B23K26/0622 , B23K26/352 , B23K2101/40 , B23K2103/172 , B23K2103/18 , B23K2103/56 , H01L21/02164 , H01L21/0217 , H01L21/02422 , H01L21/02488 , H01L21/02502 , H01L21/02532 , H01L21/02686 , H01L21/02691 , H01L29/6675 , H01L29/78672
Abstract: The invention provides a preparation method of a low temperature poly-silicon thin film, a preparation method of a low temperature poly-silicon thin film transistor, and a laser crystallization apparatus, and belongs to the technical field of display. The preparation method of a low temperature poly-silicon thin film of the invention comprises: forming an amorphous silicon thin film on a transparent substrate; and performing laser annealing on said amorphous silicon thin film from a side of said amorphous silicon thin film departing from said substrate, and performing laser irradiation from a side of said substrate departing from said amorphous silicon thin film, to form a low temperature poly-silicon thin film. The preparation method of a low temperature poly-silicon thin film of the invention may not only perform laser annealing on an amorphous silicon thin film form a side of the amorphous silicon thin film departing from the substrate, but also perform laser irradiation from a side of the substrate departing from the amorphous silicon thin film, and the temperature of the amorphous silicon thin film can be retained by performing laser irradiation from a side of the substrate departing from the amorphous silicon thin film. In this way, the crystallization period of poly-silicon may be elongated, and it is possible to obtain crystal grains with larger sizes, to increase carrier mobility, and to reduce drain current.
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