Abstract:
A multi-state low-current-switching magnetic memory element (magnetic memory element) comprising a free layer, two stacks, and a magnetic tunneling junction is disclosed. The stacks and magnetic tunneling junction are disposed upon surfaces of the free layer, with the magnetic tunneling junction located between the stacks. The stacks pin magnetic domains within the free layer, creating a free layer domain wall. A current passed from stack to stack pushes the domain wall, repositioning the domain wall within the free layer. The position of the domain wall relative to the magnetic tunnel junction corresponds to a unique resistance value, and passing current from a stack to the magnetic tunnel junction reads the magnetic memory element's resistance. Thus, unique memory states may be achieved by moving the domain wall.
Abstract:
An embodiment of the present invention includes a multi-state current-switching magnetic memory element having a magnetic tunneling junction (MTJ), for storing more than one bit of information. The MTJ includes a fixed layer, a barrier layer, and a non-uniform free layer. In one embodiment, having 2 bits per cell, when one of four different levels of current is applied to the memory element, the applied current causes the non-uniform free layer of the MTJ to switch to one of four different magnetic states. The broad switching current distribution of the MTJ is a result of the broad grain size distribution of the non-uniform free layer.
Abstract:
A system and method of generating an output signal of very precise frequency without the use of a crystal oscillator. An input signal is generated using any convenient such as an RC oscillator. A circuit for producing a frequency-controlled output signal comprises a phase lock loop having a VCO and a down counter. The down counter reduces the frequency of a VCO clock signal in accordance with a down count value. The down count value is loaded in a register and stored in non-volatile memory. The down count value is set during a calibration operation using a precision external clock signal. In this way, a clock signal with a highly precise frequency is generated without using a crystal oscillator.
Abstract:
In an EEPROM memory cell of the kind which relies on tunneling action through a thin oxide layer to store charge on a floating gate, the floating gate and the channel regions of the memory cell are provided with additional doping of the same kind as in the substrate in order to raise the virgin state threshold voltage of the memory cell to a high positive value, such as 4 volts. Additionally, the overlap area between the control gate and the floating gate is reduced to the extent that the capacitance between the floating gate and the control gate is substantially equal to the capacitance between the floating gate and the substrate during programming, but the effective capacitance between the floating gate and the substrate is greatly reduced during erase mode. As a result, little or no tunneling occurs during programming and the threshold voltage level is the same as the virgin threshold value of the memory cell. However, during erase, very efficient tunneling occurs from the floating gate to the substrate and the threshold voltage level decreases to a negative value. The difference between positive and negative values of the threshold voltage is comparable to that of conventional memory cells.
Abstract:
A non-volatile memory cell (20) contains a pair of cross-coupled like-polarity FET's (Q1 and Q2) that serve as a volatile location (21) for storing a data bit and a like-polarity variable-threshold insulated-gate FET (Q3) that serves as a non-volatile storage location (22). The variable-threshold FET has its source coupled to the drain of one of the cross-coupled FET's, its insulated-gate electrode coupled to the drain of the other of the cross-coupled FET's, and its drain coupled to a power supply. A pair of impedance elements (R1 and R2) are coupled between the drains of the cross-coupled FET's, respectively, on one hand and the power supply on the other hand. Just before a power shutdown which causes the data bit to evaporate, the power supply is pulsed to a suitable level to cause the bit to be transferred to the non-volatile location. When power is restored to the normal level, the original data bit automatically returns to the volatile location.