公开(公告)号：US10104792B2

公开(公告)日：2018-10-16

申请号：US15021457

申请日：2013-10-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yu-Chuan (Tony) Kang ,  Kuan-Ting Wu

IPC: H05K5/02 ,  A45C11/00 ,  A45F5/00 ,  C25D13/06 ,  C25D13/12 ,  C25D13/20

Abstract: A method is provided for modifying a layer of a plastics material containing conductive fibers. The method includes electrophoretically depositing a bead of a polymer material at locations of a surface of the layer where the conductive fibers are exposed.

公开(公告)号：US20180267572A1

公开(公告)日：2018-09-20

申请号：US15988175

申请日：2018-05-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chung-Hung Huang ,  Yu-Chuan Kang, JR. ,  Chien-Ting Lin ,  Kuan-Ting Wu

IPC: G06F1/16 ,  B32B1/02

CPC classification number: G06F1/1626 ,  B32B1/02 ,  B32B15/08 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2457/00 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/10 ,  C25D11/26 ,  C25D11/30 ,  G06F2200/1633 ,  H04M1/0283

Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.

公开(公告)号：US10073496B2

公开(公告)日：2018-09-11

申请号：US15563983

申请日：2015-06-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wei-Chung Chen ,  Kuan-Ting Wu ,  Wen-Hua (Jerry) Ni

IPC: G06F1/16 ,  E05D7/00 ,  E05D3/06 ,  F16C11/04 ,  H05K5/02 ,  H04M1/02

CPC classification number: G06F1/1681 ,  E05D3/06 ,  E05D7/00 ,  E05Y2900/606 ,  F16C11/04 ,  G06F1/1652 ,  G09F9/301 ,  H04M1/0268 ,  H05K5/0226

Abstract: Examples disclosed herein provide a hinge for a foldable display unit. One example hinge includes a plurality of brackets. A bracket from the plurality of brackets is to operably couple to an adjacent bracket from the plurality of brackets, to be folded into an arcuate shape. The hinge further includes a plurality of links to operably couple the plurality of brackets to each other. A first end of a first link from the plurality of links is rotatably connected to an end of a second link from the plurality of links according to a first frictional value. A second end of the first link is rotatably connected to an end of a third link from the plurality of links according to a second frictional value less than the first frictional value.

公开(公告)号：US12181743B2

公开(公告)日：2024-12-31

申请号：US18428631

申请日：2024-01-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Chi-Hao Chang

IPC: G02F1/137 ,  G02F1/1335 ,  G02F1/13357 ,  G02F1/1337 ,  G02F1/1343 ,  G02F1/1368 ,  H10N30/20

Abstract: A display device includes an aperture layer, a first plurality of light sources, a second plurality of light sources, and a piezo material coupled to the first plurality of light sources and the second plurality of light sources. The aperture layer includes a first plurality of apertures and a second plurality of apertures, and the first plurality of light sources is arranged to correspond to the first plurality of apertures, and the second plurality of light sources is arranged to correspond to the second plurality of apertures. The piezo material is configured to alter a first position of the first plurality of light sources relative to the first plurality of apertures, and to alter a second position of the second plurality of light sources relative to the second plurality of apertures.

公开(公告)号：US11952665B2

公开(公告)日：2024-04-09

申请号：US17298901

申请日：2019-06-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Hsing-Hung Hsieh ,  Super Liao

IPC: C23C28/00 ,  C09D5/24 ,  C09D5/44 ,  C25D13/12

CPC classification number: C23C28/00 ,  C09D5/24 ,  C09D5/4411 ,  C09D5/443 ,  C25D13/12

Abstract: A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.

公开(公告)号：US11939677B2

公开(公告)日：2024-03-26

申请号：US17297210

申请日：2019-06-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Hsing-Hung Hsieh

IPC: C23C22/57 ,  C09D5/44 ,  C23C22/78 ,  C25D13/12

CPC classification number: C23C22/57 ,  C09D5/4411 ,  C09D5/4419 ,  C23C22/78 ,  C25D13/12

Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least one chamfered edge comprises a hydrophobic anti-fingerprint layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and a water based paint layer deposited on the passivation layer.

公开(公告)号：US11887993B2

公开(公告)日：2024-01-30

申请号：US17424911

申请日：2019-05-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Super Liao

IPC: H01L27/12 ,  H01L29/786 ,  H10K59/12 ,  H01L29/66

CPC classification number: H01L27/1225 ,  H01L29/66969 ,  H01L29/7869 ,  H10K59/12

Abstract: The present disclosure is drawn to thin-film transistors, electronic displays that include thin-film transistors, and methods of making thin-film transistors. In one example, a thin-film transistor can include a nonconductive substrate, a semiconductor layer on the nonconductive substrate, a source electrode adjacent a first side of the semiconductor layer and partially overlapping a first peripheral portion of the semiconductor layer, a drain electrode adjacent a second side of the semiconductor layer and partially overlapping a second peripheral portion of the semiconductor layer, an etch stop layer on the semiconductor layer, a gat insulator layer on the etch stop layer, and a gate electrode on the gate insulator layer. The source electrode and the drain electrode do not overlap the etch stop layer.

公开(公告)号：US11775017B2

公开(公告)日：2023-10-03

申请号：US17911568

申请日：2020-04-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Super Liao ,  Kuan-Ting Wu ,  Hsing-Hung Hsieh

IPC: G09G5/00 ,  G06F1/16 ,  H10K85/10 ,  H10K102/00 ,  H10K77/10 ,  G09G3/3208 ,  G09G3/36

CPC classification number: G06F1/1652 ,  G06F1/1647 ,  H10K85/111 ,  G09G3/3208 ,  G09G3/36 ,  H10K77/111 ,  H10K2102/311

Abstract: The present disclosure is drawn to bendable displays for electronic devices. In one example, a first display region including a glass panel that is rigid, the glass panel including a first interlocking edge. A second display region can include a plastic panel that is bendable, the plastic panel including a second interlocking edge that is shaped to inversely correspond with the first interlocking edge. An interlock zone where the first interlocking edge can be joined with the second interlocking edge such that the first display region and the second display region form a continuous display panel that is bendable at a location along the second display region.

公开(公告)号：US11694613B2

公开(公告)日：2023-07-04

申请号：US17419315

申请日：2019-07-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Dehuei Chen

IPC: G09G3/3208

CPC classification number: G09G3/3208 ,  G09G2300/0439 ,  G09G2320/0626 ,  G09G2360/14

Abstract: A display having an area of non-transparent pixels, an area of transparent pixels, a camera positioned behind the transparent pixels to capture an image when light passes through the transparent pixels, and a display controller for driving the non-transparent pixels at a first brightness and driving the transparent pixels at a second brightness greater than the first brightness during image capture by the camera.

公开(公告)号：US11379014B2

公开(公告)日：2022-07-05

申请号：US16980868

申请日：2018-03-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei-Chung Chen ,  Kuan-Ting Wu

IPC: H05K5/00 ,  G06F1/16 ,  H05K5/02

Abstract: Examples of hinge assemblies are described. In an example, a hinge assembly includes a first hinge element having a first shaft, a second hinge element having a second shaft, and a clip coupling the first shaft to the second shaft. The clip includes a first portion formed of c a composite material and a second portion formed of a metal.