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198 条记录 (耗时 0.03 秒)

    COPPER COMPOUND-CONTAINING ANTIFOULING COATING COMPOSITION HAVING IMPROVED SLIME RESISTANCE AND STORAGE STABILITY
    92.
    发明申请
    COPPER COMPOUND-CONTAINING ANTIFOULING COATING COMPOSITION HAVING IMPROVED SLIME RESISTANCE AND STORAGE STABILITY 审中-公开
    具有改善耐滑性和储存稳定性的含铜复合防锈涂料组合物

    公开(公告)号：US20100209381A1

    公开(公告)日：2010-08-19

    申请号：US12682195

    申请日：2008-10-23

    申请人： Hideyuki Tanaka

    发明人： Hideyuki Tanaka

    IPC分类号： C09D5/16

    CPC分类号： C09D5/1687 ,  A01N59/20 ,  C09D5/1612 ,  C09D5/1668 ,  A01N25/10 ,  A01N47/04 ,  A01N2300/00

    摘要： The present invention provides an antifouling coating composition, which can form an antifouling coating film capable of giving excellent slime resistance and has a property such that the recrystallization of an antifouling agent in a paint is depressed. The antifouling coating composition of the present invention is obtainable by blending a coating film forming resin (A) with as an antifouling agent, an inorganic copper antifouling agent (B) such as copper suboxide, etc and N,N′-dimethyl-N′-tolyl(N-fluorodichloromethylthio)sulfamide (C). The antifouling agent (B) is contained in an amount of preferably 60 to 1000 parts by weight based on 100 parts by weight of the coating film forming resin (A), and the antifouling agent (C) is contained in an amount of preferably 1.4 to 80 parts by weight based on 100 parts by weight of the coating film forming resin (A) and also the antifouling agent (C) is contained in an amount of preferably 0.1 to 100 parts by weight based on 100 parts by weight of the antifouling agent (B).

    摘要翻译： 本发明提供一种防污涂料组合物，其可以形成能够赋予优异的耐粘着性的防污涂膜，并且具有使涂料中的防污剂重结晶受到抑制的性质。 本发明的防污涂料组合物可以通过将涂膜形成树脂（A）作为防污剂，无机铜防污剂（B）如低辛氧化钡等和N，N'-二甲基-N' （N-氟二氯甲硫基）磺酰胺（C）。 防污剂（B）相对于100重量份的成膜树脂（A）为100重量份优选为60〜1000重量份，防污剂（C）的含量优选为1.4 相对于100重量份的成膜树脂（A）100重量份，防污剂（C）的含量相对于100重量份的防污剂优选为0.1〜100重量份，优选为80重量份 代理（B）。

    Acylamide compounds having secretagogue or inducer activity of adiponectin
    94.
    发明授权
    Acylamide compounds having secretagogue or inducer activity of adiponectin 失效
    具有促分泌素或脂联素诱导活性的酰胺化合物

    公开(公告)号：US07732637B2

    公开(公告)日：2010-06-08

    申请号：US11835029

    申请日：2007-08-07

    申请人： Katsumi Maezono ,  Toshihiko Yoshimura ,  Nozomu Ishida ,  Naoyuki Fukuchi ,  Toshihiro Hatanaka ,  Osamu Ikehara ,  Yayoi Kawato ,  Hideyuki Tanaka

    发明人： Katsumi Maezono ,  Toshihiko Yoshimura ,  Nozomu Ishida ,  Naoyuki Fukuchi ,  Toshihiro Hatanaka ,  Osamu Ikehara ,  Yayoi Kawato ,  Hideyuki Tanaka

    IPC分类号： C07C229/06 ,  A61K31/20

    CPC分类号： C07C233/47 ,  A23L33/10 ,  C07C323/59

    摘要： The present invention provides an acylamide compound of the following formula (1), prodrugs thereof, or pharmaceutically acceptable salts thereof; and an adiponectin inducer or secretagogue, therapeutic agent of metabolic syndromes, therapeutic agent of hypoadiponectinemia, therapeutic agent of hyperlipemia, preventive/therapeutic agent of diabetes, improving agent of impaired glucose tolerance, improving agent of insulin resistance, enhancing agent of insulin sensitivity, therapeutic agent of hypertension, preventive/therapeutic agent of vascular disorders, an anti-inflammatory agent, therapeutic agent of hepatic inflammation, therapeutic agent of fatty liver, therapeutic agent of hepatic fibrosis, therapeutic agent of liver cirrhosis, preventive/therapeutic agent of non-alcoholic/nonviral steatohepatitis (NASH) or non-alcoholic/nonviral fatty liver disease (NAFLD), or therapeutic agent of obesity, each of which has the above compounds as an active ingredient.

    摘要翻译： 本发明提供下式（1）的酰胺化合物，其前体药物或其药学上可接受的盐; 和脂联素诱导剂或促分泌素，代谢综合征的治疗剂，低脂联素血症的治疗剂，高脂血症的治疗剂，糖尿病的预防/治疗剂，葡萄糖耐量降低的改善剂，胰岛素抵抗的改善剂，胰岛素敏感性的增强剂，治疗 高血压药物，血管疾病的预防/治疗剂，抗炎剂，肝脏炎症治疗剂，脂肪肝治疗剂，肝纤维化治疗剂，肝硬化治疗剂，非酒精性预防/治疗剂 /非病毒性脂肪性肝炎（NASH）或非酒精性/非病毒性脂肪性肝病（NAFLD）或肥胖症治疗剂，其各自具有上述化合物作为活性成分。

    Electrode pattern and wire bonding method
    95.
    发明授权
    Electrode pattern and wire bonding method 有权
    电极图案和引线接合方法

    公开(公告)号：US07550673B2

    公开(公告)日：2009-06-23

    申请号：US12042650

    申请日：2008-03-05

    申请人： Yoshihiro Hisa ,  Tsutomu Yamaguchi ,  Hideyuki Tanaka ,  Kazunori Matsuo

    发明人： Yoshihiro Hisa ,  Tsutomu Yamaguchi ,  Hideyuki Tanaka ,  Kazunori Matsuo

    IPC分类号： H01R4/18

    CPC分类号： H01R43/0221 ,  H01L2924/01074 ,  H01L2924/01079 ,  Y10T29/49218

    摘要： An electrode pattern for wire-bonding includes: a wire-bonding reference pattern indicating a reference position for determination of a wire-bonding position; and a wire-bonding recognition pattern. The distance between the reference position and a wire-bonding metal portion bonded to the electrode pattern and the distance between the wire-bonding recognition pattern and the wire-bonding metal portion satisfy predetermined relationships.

    摘要翻译： 用于引线接合的电极图案包括：指示用于确定引线接合位置的基准位置的引线接合基准图; 和引线键合识别图案。 接合到电极图案的基准位置与引线键合金属部分之间的距离以及引线接合识别图案和引线接合金属部分之间的距离满足预定关系。

    Plate material cutting unit, plate material cutting apparatus equipped with the plate material cutting unit, and plate material cutting system equipped with the plate material cutting apparatus
    96.
    发明申请
    Plate material cutting unit, plate material cutting apparatus equipped with the plate material cutting unit, and plate material cutting system equipped with the plate material cutting apparatus 有权
    板材切割单元，装有板材切割单元的板材切割装置，以及装有板材切割装置的板材切割系统

    公开(公告)号：US20090126550A1

    公开(公告)日：2009-05-21

    申请号：US11921404

    申请日：2006-06-02

    申请人： Keiji Tsujita ,  Hideyuki Tanaka ,  Morimasa Kuge ,  Syuichi Nakayama ,  Susumu Sugiyama

    发明人： Keiji Tsujita ,  Hideyuki Tanaka ,  Morimasa Kuge ,  Syuichi Nakayama ,  Susumu Sugiyama

    IPC分类号： B26D3/06

    CPC分类号： C03B33/0207 ,  B28D1/225 ,  B65G49/063 ,  B65G2249/045 ,  Y10T83/0304 ,  Y10T225/321 ,  Y10T225/325

    摘要： A plate material cutting unit is equipped with: support devices for supporting the lower edge of an upright plate material; fluid guides for applying fluid pressure on a surface of the plate material which is held upright on the support devices, to support the plate material in a non-contact manner; a scribe forming device, equipped with a scribing blade for forming a scribe for cutting on the plate material, by moving along the surface of the plate material, which is supported by the fluid guides; a clamp, for gripping a portion of the plate material adjacent to the movement trajectory of the scribing blade along the plate material; and a cutting device, equipped with a pressing member for pressing a portion of the plate material opposite the scribe in a planar direction with respect to the portion of the plate material which is gripped by the clamp.

    摘要翻译： 板材切割单元配备有用于支撑直立板材料的下边缘的支撑装置; 用于在保持在支撑装置上直立的板材的表面上施加流体压力的流体引导件，以非接触的方式支撑板材; 划片成形装置，其具有用于形成用于在板材上切割的划片的划线刀片，通过由流体引导件支撑的板材表面移动; 用于夹紧与所述划片刀片沿着所述板材料的移动轨迹相邻的所述板材的一部分的夹具; 以及切割装置，其具有用于相对于由夹具夹持的板材的部分在平面方向上挤压与划片相对的板材的一部分的按压构件。

    ELECTRODE PATTERN AND WIRE BONDING METHOD
    97.
    发明申请
    ELECTRODE PATTERN AND WIRE BONDING METHOD 有权
    电极图案和线焊接方法

    公开(公告)号：US20080230255A1

    公开(公告)日：2008-09-25

    申请号：US12042650

    申请日：2008-03-05

    申请人： Yoshihiro Hisa ,  Tsutomu Yamaguchi ,  Hideyuki Tanaka ,  Kazunori Matsuo

    发明人： Yoshihiro Hisa ,  Tsutomu Yamaguchi ,  Hideyuki Tanaka ,  Kazunori Matsuo

    IPC分类号： H01R43/00 ,  H01B5/00

    CPC分类号： H01R43/0221 ,  H01L2924/01074 ,  H01L2924/01079 ,  Y10T29/49218

    摘要： An electrode pattern for wire-bonding includes: a wire-bonding reference pattern indicating a reference position for determination of a wire-bonding position; and a wire-bonding recognition pattern. The distance between the reference position and a wire-bonding metal portion bonded to the electrode pattern and the distance between the wire-bonding recognition pattern and the wire-bonding metal portion satisfy predetermined relationships.

    摘要翻译： 用于引线接合的电极图案包括：指示用于确定引线接合位置的基准位置的引线接合基准图; 和引线键合识别图案。 接合到电极图案的基准位置与引线键合金属部分之间的距离以及引线接合识别图案和引线接合金属部分之间的距离满足预定关系。

    Non-volatile memory and the fabrication method
    99.
    发明授权
    Non-volatile memory and the fabrication method 有权
    非易失性存储器及其制造方法

    公开(公告)号：US07394090B2

    公开(公告)日：2008-07-01

    申请号：US11798364

    申请日：2007-05-14

    申请人： Kiyoyuki Morita ,  Noboru Yamada ,  Akihito Miyamoto ,  Takashi Ohtsuka ,  Hideyuki Tanaka

    发明人： Kiyoyuki Morita ,  Noboru Yamada ,  Akihito Miyamoto ,  Takashi Ohtsuka ,  Hideyuki Tanaka

    IPC分类号： H01L47/00

    CPC分类号： G11C13/0004 ,  G11C14/009 ,  H01L27/1104 ,  H01L27/24 ,  H01L45/04 ,  H01L45/145

    摘要： A non-volatile memory comprising: a first substrate (100) and a second substrate (110), the first substrate (100) having a plurality of switching elements (4) arranged in matrix, and a plurality of first electrodes (18) connected to the switching element (4), the second substrate (110) having a conductive film (32), and a recording layer (34) whose resistance value changes by application of an electric pulse, wherein the plurality of first electrodes (18) are integrally covered by the recording layer (34), the recording layer (34) thereby being held between the plurality of first electrodes (18) and the conductive film (32); the first substrate (100) further comprising a second electrode (22), the second electrode (22) being electrically connected to the conductive film (32), the voltage of which is maintained at a set level while applying current to the recording layer (34). This non-volatile memory achieves high integration at low cost.

    摘要翻译： 一种非易失性存储器，包括：第一基板（100）和第二基板（110），所述第一基板（100）具有布置成矩阵的多个开关元件（4），并且多个第一电极（18）被连接 至所述开关元件（4），所述第二基板（110）具有导电膜（32）以及其电阻值通过施加电脉冲而改变的记录层（34），其中所述多个第一电极（18）为 由记录层（34）整体覆盖，记录层（34）由此保持在多个第一电极（18）和导电膜（32）之间; 所述第一基板（100）还包括第二电极（22），所述第二电极（22）电连接到所述导电膜（32），其电压保持在设定电平，同时向所述记录层施加电流（ 34）。 这种非易失性存储器以低成本实现高集成度。