公开(公告)号：US07913735B2

公开(公告)日：2011-03-29

申请号：US12390661

申请日：2009-02-23

申请人： Masayuki Yamamoto ,  Saburo Miyamoto

发明人： Masayuki Yamamoto ,  Saburo Miyamoto

IPC分类号： B29C65/50

CPC分类号： H01L21/67132 ,  Y10T156/1168 ,  Y10T156/1195

摘要： An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.

摘要翻译： 本发明的胶带接合装置采用倒置的“T”形布置，其配置有在平面中横向延伸的矩形截面，以及连接在矩形部分中心的突出部分。 粘合带接合部分设置在突出部分中，并将粘合带连接到环形框架和晶片。 传送机构设置在矩形部分中并传送由环形框架保持的晶片，环形框架和晶片。 电子基板处理单元设置在与矩形部分相邻的两个区域中的至少一个中，其中插入有突出部分，并且联接到输送机构。

公开(公告)号：US20110048609A1

公开(公告)日：2011-03-03

申请号：US12848290

申请日：2010-08-02

申请人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yukitoshi Hase ,  Masayuki Yamamoto

IPC分类号： B32B37/12 ,  B32B38/04

CPC分类号： B65H35/0013 ,  B65H37/002 ,  B65H2301/460186 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1085 ,  Y10T156/1195

摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.

摘要翻译： 联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。 控制器控制每个机构进行操作以满足计算单元确定的结果。 此后，将包括接头的胶带切割并除去。

公开(公告)号：US07875145B2

公开(公告)日：2011-01-25

申请号：US12569625

申请日：2009-09-29

申请人： Masayuki Yamamoto ,  Naoki Ishii

发明人： Masayuki Yamamoto ,  Naoki Ishii

IPC分类号： B32B37/10

CPC分类号： H01L21/67132 ,  Y10T156/1062 ,  Y10T156/1348

摘要： An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism.

摘要翻译： 将胶带提供到环形框架的背面侧，并通过连接辊连接到环形框架上，并且沿着环形框架枢转切割刀片进行切割。 随后，检查机构的检查环在与邻近环形框架的内周的粘合带接触的同时对粘合带进行抽吸。 基于吸入压力的变化来确定胶带与环形框架的分离。 当检测到胶带与环形框架的分离时，胶带再次与设置在切割机构中的接合辊接合。

公开(公告)号：US07849900B2

公开(公告)日：2010-12-14

申请号：US11358140

申请日：2006-02-22

申请人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

发明人： Saburo Miyamoto ,  Yasuji Kaneshima ,  Masayuki Yamamoto

IPC分类号： B29C65/18

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  H01L2221/6839 ,  Y10T156/1105 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/19 ,  Y10T156/1906 ,  Y10T156/1978

摘要： During relative and horizontal movement of a mount frame, in which a semiconductor wafer with a protective tape is supported on a ring frame through a supporting adhesive tape, and a joining member, a position of an end edge of the protective tape is detected in a non-contact manner. Based on the detection result, a joining member is stopped in the position of the end edge of the protective tape and is moved close to the semiconductor wafer to press and bring a separation tape against and into contact with an end of the protective tape. In this state, the mount frame and the joining member are relatively and horizontally moved to join the separation tape onto the protective tape. Then, the mount frame and the joining member are relatively and horizontally moved to separate the separation tape together with the protective tape from a surface of the semiconductor wafer.

摘要翻译： 在具有保护带的半导体晶片通过支撑胶带被支撑在环形框架上的安装框架的相对和水平移动以及接合构件中，在保护带的端部边缘的位置被检测到 非接触式 基于检测结果，接合构件停止在保护带的端缘的位置，并且移动靠近半导体晶片，以将分离带抵靠并与保护带的端部接触。 在这种状态下，安装框架和接合构件被相对且水平地移动以将分离带连接到保护带上。 然后，安装框架和接合构件被相对且水平地移动，以将分离带与保护带一起从半导体晶片的表面分离。

公开(公告)号：US07811899B2

公开(公告)日：2010-10-12

申请号：US11949593

申请日：2007-12-03

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： H01L23/58 ,  H01L21/30 ,  H01L21/46 ,  B23B41/00 ,  B23B41/02

CPC分类号： H01L21/67132 ,  B32B37/003 ,  B32B37/10 ,  B32B2457/14 ,  H01L21/67092 ,  Y10T156/10

摘要： A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece, the supporting substrate is pressed by a pressing member made of an approximately hemispherical elastic body from an approximate center of a non-adhering surface of this supporting substrate, the supporting substrate is laminated by elastically deforming this pressing member on the wafer while making the supporting substrate surface contact in a flat condition.

摘要翻译： 将支撑基板层叠在晶片上，使得利用多个锁定爪锁定在周边的支撑基板设置在工件上的双面粘合片的粘附表面附近并面向工件上的双面粘合片的粘合表面，支撑基板 基板被由大致半球形的弹性体制成的按压部件从该支撑基板的非粘接面的大致中心压制，支撑基板通过使该按压部件在晶片上弹性变形而层叠，同时使支撑基板表面接触 在平坦的条件。

公开(公告)号：US07789988B2

公开(公告)日：2010-09-07

申请号：US11723239

申请日：2007-03-19

申请人： Masayuki Yamamoto ,  Takao Matsushita ,  Masaki Sakata

发明人： Masayuki Yamamoto ,  Takao Matsushita ,  Masaki Sakata

IPC分类号： B29C65/50 ,  B32B38/10 ,  B32B43/00

CPC分类号： B29C63/0013 ,  H01L21/67132 ,  Y10T156/1089 ,  Y10T156/1184 ,  Y10T156/1961

摘要： A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.

摘要翻译： 连接到半导体晶片的前表面的保护带的外围边缘被阻塞在具有尖锐尖端的针上，从而与半导体晶片的前表面部分地分离; 因此，形成分离部分。 接下来，从分离部开始将分离带接合到保护带的表面的操作，并且保护带与分离带从半导体晶片的前表面分离，分离部分作为起始端 。

公开(公告)号：US20100023713A1

公开(公告)日：2010-01-28

申请号：US12230903

申请日：2008-09-08

申请人： Hiroshi Nasu ,  Masayuki Yamamoto

发明人： Hiroshi Nasu ,  Masayuki Yamamoto

IPC分类号： G06F12/02

CPC分类号： G06F11/2094 ,  G06F11/1461 ,  G06F16/113 ,  G06F16/122

摘要： There is provided an archive system that performs processing on arbitrary contents, the system including a grouping section that groups multiple archive nodes included in a cluster, a policy section that defines a requirement for performing processing on the arbitrary contents, and a control section that determines a group for performing processing on the arbitrary contents based on the group information about the definition of the grouping of the multiple archive nodes and the requirement and controls the determined group to perform the processing.

摘要翻译： 提供了一种对任意内容执行处理的归档系统，该系统包括对包括在群集中的多个归档节点进行分组的分组部分，定义对任意内容执行处理的要求的策略部分，以及确定 基于关于多个归档节点的分组的定义的组信息和要求来对任意内容执行处理的组，并且控制所确定的组以执行处理。

公开(公告)号：US20090272403A1

公开(公告)日：2009-11-05

申请号：US12426958

申请日：2009-04-20

申请人： Masayuki Yamamoto ,  Yukitoshi Hase

发明人： Masayuki Yamamoto ,  Yukitoshi Hase

IPC分类号： B08B1/00 ,  B32B38/00 ,  B26D7/08

CPC分类号： B26D7/088 ,  B26F1/3806 ,  Y10T83/242 ,  Y10T156/1348

摘要： In a container that retains a wash liquid, a cutter blade having a cutting edge is inserted into a slit formed on a cleaning member impregnated with the wash liquid from an opening side of the slit and is moved horizontally by a predetermined amount with two side faces thereof being brought into contact with the slit. Then, the cutter blade is pulled out upward, so that adherents on the two side faces of the cutter blade are removed from the cuter blade.

摘要翻译： 在保持洗涤液的容器中，具有切割刃的切割刀片从狭缝的开口侧插入形成在浸渍有洗涤液的清洁部件上的狭缝中，并且通过两个侧面水平移动预定量 其与狭缝接触。 然后，将切割刀片向上拉出，从而切割刀片的两个侧面上的附着物从切割刀片上移除。

公开(公告)号：US07610467B2

公开(公告)日：2009-10-27

申请号：US11905889

申请日：2007-10-05

申请人： Yasuyuki Mimatsu ,  Masayuki Yamamoto

发明人： Yasuyuki Mimatsu ,  Masayuki Yamamoto

IPC分类号： G06F12/00

CPC分类号： G06F3/0653 ,  G06F3/0605 ,  G06F3/0632 ,  G06F3/0644 ,  G06F3/0665 ,  G06F3/067 ,  H04L29/12047 ,  H04L41/085 ,  H04L41/0856 ,  H04L41/12 ,  H04L61/15 ,  H04L67/1097 ,  H04L67/16

摘要： It is made possible to update information registered in a database of iSNS, SLP and the like in response to a configurational change in a storage device, and for a host computer to discover a disk volume. In response to changes in contents of operation to alter a storage configuration such as in creating or deleting a volume or LUN, contents of the alteration are reflected in the database of iSNS or SLP. Also, in response to a change in setting of LUN masking, a discovery domain of iSNS or attribute values of SLP are updated so that the host computer can discover the disk volume. Also, objects and services are reregistered periodically according to a registration period of iSNS or lifetime of SLP to prevent registered contents from expiring.

摘要翻译： 响应于存储设备中的配置变化，以及主计算机发现磁盘卷，可以更新登记在iSNS，SLP等的数据库中的信息。 响应于更改存储配置（如创建或删除卷或LUN）的操作内容的更改，更改的内容将反映在iSNS或SLP的数据库中。 另外，响应LUN屏蔽设置的更改，更新iSNS的发现域或SLP的属性值，以便主机可以发现磁盘卷。 此外，根据iSNS的注册期限或SLP的生存周期，定期重新登记对象和服务，以防止注册的内容过期。

公开(公告)号：US20090265522A1

公开(公告)日：2009-10-22

申请号：US12493395

申请日：2009-06-29

申请人： Masayasu ASANO ,  Takayuki Nagai ,  Masayuki Yamamoto

发明人： Masayasu ASANO ,  Takayuki Nagai ,  Masayuki Yamamoto

IPC分类号： G06F12/16 ,  G06F12/00 ,  G06F12/14

CPC分类号： G06F21/6218 ,  H04L63/10

摘要： A computer system including a copy source volume and a copy target volume which may be selectably PAIRED or SPLIT. User management information stores: an entry indicating that a first user is permitted to effect a PAIR operation and a PATH operation; and, an entry indicating that a second user is permitted to effect a PATH operation. Operation management information indicates permitted PATH and PAIR operations in relation to each user and a volume's PAIR or SPLIT status, and stores: an entry indicating that the first user is permitted to effect the PAIR operation in which the PAIR status is PAIR, or is SPLIT WITH BACKUP DISABLED; and, an entry indicating that the second user is permitted to effect the PATH operations in which the PAIR status is SPLIT WITH BACKUP ENABLED. PAIR management information stores the PAIR status and the BACKUP ENABLED or DISABLED status.

摘要翻译： 一种计算机系统，包括复制源卷和复制目标卷，其可选地配对或分页。 用户管理信息存储：指示允许第一用户执行对等操作和PATH操作的条目; 以及指示允许第二用户执行PATH操作的条目。 操作管理信息指示与每个用户相关的允许的PATH和PAIR操作以及卷的PAIR或SPLIT状态，并且存储：指示第一用户被允许实现PAIR状态为对等体的对偶操作的条目，或者是SPLIT 带备份禁用 以及指示第二用户被允许实现其中PAIR状态是SPLIT WITH BACKUP ENABLED的PATH操作的条目。 PAIR管理信息存储PAIR状态和BACKUP ENABLED或DISABLED状态。