摘要:
In a DIAC-like device that includes an n+ and a p+ region connected to the high voltage node, and an n+ and a p+ region connected to the low voltage node, at least two MOS devices are formed between the n+ and p+ region connected to the high voltage node, and the n+ and p+ region connected to the low voltage node.
摘要:
In an ESD clamp formed in a SOI process, voltage tolerance is increased by introducing multiple blocking junctions between the anode and cathode of the device.
摘要:
In a programmable circuit making use of fuse cells, a snapback NMOS or NPN transistor or SCR without reversible snapback capability is used as an anti-fuse, and programming comprises biasing the control electrode of the transistor to cause the transistor to go into snapback mode.
摘要:
In an LDMOS-SCR ESD protection structure gate voltage of an ESD protection LDSCR is defined by connecting the gate to the source of a reference LDSCR. The reference LDSCR is implemented as a self-triggering device in which the snapback drain-source voltage (avalanche breakdown voltage) is controlled to be lower than that for the major LDSCR by adjusting the RESURF layer-composite overlap for the reference LDSCR to be different to that of the major LDSCR.
摘要:
A MEMS magnetic flux switch is fabricated as a ferromagnetic core. The core includes a center cantilever that is fabricated as a free beam that can oscillate at a resonant frequency that is determined by its mechanical and material properties. The center cantilever is moved by impulses applied by an associated motion oscillator, which can be magnetic or electric actuators.
摘要:
In an on chip battery and method of making an on-chip battery, the electrodes are formed from metal layers deposited as part of the chip fabrication process. An electrolyte is preferably introduced between the electrodes at time of packaging of the chip.
摘要:
A diode for alternating current (DIAC) electrostatic discharge (ESD) protection circuit is formed in a silicon germanium (SiGe) hetrojunction bipolar transistor (HBT) process that utilizes a very thin collector region. ESD protection for a pair of to-be-protected pads is provided by utilizing the base structures and the emitter structures of the SiGe transistors.
摘要:
In multiple port chip circuit, an ESD protection circuit and method of protecting the ports of the multiple port circuit, includes providing a plurality of bi-directional snapback devices such as DIACs and connecting only one electrode to ground while connecting the other electrodes to the ports that are to be protected.
摘要:
Electrostatic discharge (ESD) protection clamp circuitry including current tunneling circuitry to provide control current for controlling current shunting circuitry for shunting ESD current from the protected signal terminal.
摘要:
In an ESD protection device making use of a LVTSCR-like structure or an IGBT-like structure, negative polarity over-voltage protection is achieved by providing a LVTSCR-like structure or IGBT-like structure that defines a PMOS device.