公开(公告)号：US20070215172A1

公开(公告)日：2007-09-20

申请号：US11717170

申请日：2007-03-13

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

IPC分类号： B08B3/12 ,  B08B3/00

CPC分类号： B08B3/12 ,  B01F15/00207 ,  B01F15/0022 ,  B01F15/0429 ,  B08B3/00 ,  C11D11/0047 ,  H01L21/67057

摘要： The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate to be processed W is subjected to an ultrasonic cleaning process. While the substrate to be processed is being cleaned, a dissolved gas concentration of a gas dissolved in the cleaning liquid contained in the cleaning tank is changed.

摘要翻译： 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中，将被处理基板W浸渍在清洗槽12内的清洗液中。 然后，在包含在清洗槽12中的清洗液中产生超声波，使待处理基板W进行超声波清洗处理。 当被处理基板被清洗时，溶解在清洗槽中所含的清洗液中的溶解气体浓度变化。

公开(公告)号：US06861371B2

公开(公告)日：2005-03-01

申请号：US10285410

申请日：2002-11-01

申请人： Yuji Kamikawa ,  Eiichi Mukai

发明人： Yuji Kamikawa ,  Eiichi Mukai

IPC分类号： H01L21/304 ,  B08B3/02 ,  H01L21/00 ,  H01L21/302 ,  H01L21/401

CPC分类号： H01L21/67023 ,  B08B3/02 ,  Y10S438/905

摘要： The present invention provides a substrate processing system and method which can prevent the filter from being stuffed with foreign objects and make the filter accordingly more durable.The substrate processing system 12 comprising a substrate processing unit 46 for processing substrates W with a processing liquid, and a processing liquid recovery passage 75 for passing the processing liquid discharged from the substrate processing unit 46, in which the processing liquid recovery passage 75 includes a filter 80 for removing foreign objects mixed in the processing liquid, a cleaning fluid supply passage 120 for feeding a cleaning fluid for cleaning the filter 80, and a discharge passage 115 for discharging the processing liquid and the cleaning fluid from the filter 80.

摘要翻译： 本发明提供一种基板处理系统和方法，其可以防止过滤器被异物填充，并且使过滤器相对更耐用。基板处理系统12包括用处理液体处理基板W的基板处理单元46，以及 处理液回收通道75，用于使从基板处理单元46排出的处理液体通过，其中处理液回收通道75包括用于除去混合在处理液体中的异物的过滤器80;清洁液供给通道120， 用于清洁过滤器80的清洁流体，以及用于从过滤器80排出处理液体和清洁流体的排出通道115。

公开(公告)号：US06776173B2

公开(公告)日：2004-08-17

申请号：US09888380

申请日：2001-06-26

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B304

CPC分类号： H01L21/67781 ,  H01L21/67051 ,  H01L21/67248 ,  H01L21/67303 ,  H01L21/67313 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67754 ,  H01L21/67757 ,  Y10S134/902

摘要： A liquid processing apparatus has a substrate rotating device including a holder for holding a substrate and a motor, a chamber for applying the liquid processing to the substrate, a posture changing mechanism for changing the posture of the substrate rotating device at outside of the chamber such that a state of the substrate held by the holder changes between vertical and horizontal, and a position adjusting mechanism for relatively adjusting the positions of the chamber and the substrate rotating device together with the posture changing mechanism such that the holder is housed in the chamber. The substrate is taken out from the container and held by the holder in a horizontal state. After the posture of the holder was changed to vertical, a process liquid is supplied to the substrate of vertical state.

摘要翻译： 液体处理装置具有基板旋转装置，该基板旋转装置包括用于保持基板的保持器和马达，用于向基板施加液体处理的腔室，用于改变在室外的基板旋转装置的姿势的姿势改变机构， 由保持器保持的基板的状态在垂直和水平之间变化;以及位置调整机构，用于相应地调节室和基板旋转装置的位置以及姿势改变机构，使得保持器容纳在室中。 将基板从容器中取出并保持在水平状态。 在保持器的姿势变为垂直状态之后，将处理液体供给垂直状态的基板。

公开(公告)号：US06589359B2

公开(公告)日：2003-07-08

申请号：US09927447

申请日：2001-07-10

申请人： Yuji Kamikawa ,  Hiroshi Tanaka

发明人： Yuji Kamikawa ,  Hiroshi Tanaka

IPC分类号： B08B300

CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B2230/01 ,  Y10S134/902

摘要： A cleaning method is provided for cleaning a semiconductor wafer. In this method, after removing adhering substances from the wafer by using a chemical liquid of organic amine type, there is carried out a pure-water cleaning capable of prevention of electrostatic destruction and alkaline corrosion on the wafer. In detail, it is executed to make a processing chamber have an atmosphere of carbon dioxide and subsequently introduce steam into the chamber to dissolve CO2-gas into the steam. Next, spray the pure water to the wafer. Then, the steam in which CO2-gas is dissolved dissolves in the pure water, so that the pure wafer becomes weak acid, accomplishing the reduction of resistivity of the pure water. Additionally, alkaline substances is neutralized by carbonated water to prevent an alkaline corrosion on a wiring layer on the wafer's surface.

公开(公告)号：US06536452B1

公开(公告)日：2003-03-25

申请号：US09559343

申请日：2000-04-27

申请人： Kyouji Kohama ,  Eiji Shimbo ,  Yuji Kamikawa ,  Takayuki Toshima ,  Hiroki Ohno

发明人： Kyouji Kohama ,  Eiji Shimbo ,  Yuji Kamikawa ,  Takayuki Toshima ,  Hiroki Ohno

IPC分类号： B08B302

CPC分类号： H01L21/67086 ,  B08B3/02 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  Y10S134/902

摘要： A processing apparatus essentially includes a rotatable rotor 21 for carrying semiconductor wafers W, a motor 22 for driving to rotate the rotor 21, a plurality of processing chambers for surrounding the wafers W carried by the rotor 21, for example, an inner chamber 23 and an outer chamber 24, a chemical supplying unit 50, an IPA supplying unit 60, a rinse supplying unit 70 and a drying fluid supplying unit 80. With this constitution of the apparatus, it is possible to prevent the wafers from being contaminated due to the reaction of treatment liquids of different kinds, with the improvement of processing efficiency and miniaturization of the apparatus.

摘要翻译： 一种处理装置主要包括用于承载半导体晶片W的可旋转转子21，用于驱动转子21旋转的电动机22，用于围绕由转子21承载的晶片W的多个处理室，例如内室23和 外部室24，化学品供应单元50，IPA供应单元60，漂洗供应单元70和干燥流体供应单元80.通过该设备的这种结构，可以防止晶片被 不同种类的处理液的反应，提高了加工效率和设备的小型化。

公开(公告)号：US06532975B1

公开(公告)日：2003-03-18

申请号：US09635465

申请日：2000-08-11

申请人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

发明人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

IPC分类号： B08B300

CPC分类号： H01L21/67754 ,  H01L21/67051 ,  Y10S134/902 ,  Y10S414/138

摘要： An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a water lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

摘要翻译： 可以水平地移动能够围绕转子（24）的外覆盖壁（26）和内覆盖壁（27）。 晶片载架等待部分（30）设置在转子（24）的正下方。 包括在提升器（40）中的晶片保持构件（41）移动到包含晶片（W）的晶片载体（C）中并安装在包括在晶片载体等待部分（30）中的台（31）（滑台32）上 ），提升晶片（W）并将晶片（W）传送到转子（24）。 外覆盖壁（26）或内覆盖壁（27）围绕转子（24）以限定处理室。 保持在转子（24）上的晶片（W）在处理室中进行清洁处理。

公开(公告)号：US06510859B1

公开(公告)日：2003-01-28

申请号：US09615620

申请日：2000-07-13

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B310

CPC分类号： H01L21/67057 ,  B08B3/048 ,  B08B3/102 ,  B08B2203/005 ,  H01L21/67028 ,  Y10S134/902

摘要： A small-sized cleaning and drying apparatus is provided. Without generating particles, hydrogen gas, etc., the apparatus easily generates an ozone water to form an oxidation film on an object to be processed. The apparatus includes a cleaning part 1 for washing semiconductor wafers W and a drying part 2 for drying the wafers W. The cleaning part 1 is formed by a processing bath 10 storing a chemical liquid or a rinsing liquid. The processing bath 10 is communicated with a chemical source 17 and a pure water source 15 through a rinsing liquid pipeline 14 interposing an ozone water generating unit 21. After completing both chemical treatment and rinsing, it is possible to form the oxidation Elms on respective surfaces of the wafers W and dry them.

摘要翻译： 提供小型清洁和干燥设备。 在不产生颗粒，氢气等的情况下，该装置容易产生臭氧水，以在被处理物体上形成氧化膜。 该设备包括用于清洗半导体晶片W的清洁部分1和用于干燥晶片W的干燥部分2.清洁部分1由存储化学液体或冲洗液体的处理槽10形成。 处理槽10通过插入臭氧水生成单元21的冲洗液体管道14与化学源17和纯水源15连通。在完成化学处理和漂洗两者之后，可以在各个表面上形成氧化Elms 的晶片W并将其干燥。

公开(公告)号：US06495215B1

公开(公告)日：2002-12-17

申请号：US09577617

申请日：2000-05-25

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B29C7104

CPC分类号： H01L21/67057 ,  B03C1/023 ,  B08B3/048 ,  B08B3/10

摘要： A substrate processing method and a substrate processing apparatus are provided to remove a processing liquid from a substrate without using an organic solvent. Upon completion of liquid treatment to dip the substrate W in the processing liquid 30, when exposing a substrate W out of a processing liquid 30 for its removal, the liquid 30 is subjected to an electric field to generate an electric current on the liquid surface and also a magnetic field B. With the arrangement of the electric field and the magnetic field, an electromagnetic force F is produced and applied on the liquid 30 in a direction to leave from a surface of the substrate W.

摘要翻译： 提供基板处理方法和基板处理装置，以在不使用有机溶剂的情况下从基板上除去处理液。 在完成液体处理以将衬底W浸入处理液体30中时，当将衬底W从处理液体30中除去以去除时，液体30经受电场以在液面上产生电流，并且 也是磁场B.通过电场和磁场的排列，产生电磁力F并在从衬底W的表面离开的方向上施加在液体30上。

公开(公告)号：US06435199B1

公开(公告)日：2002-08-20

申请号：US09551951

申请日：2000-04-19

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B304

CPC分类号： H01L21/67161 ,  H01L21/67028 ,  H01L21/67207 ,  Y10S134/902

摘要： In an apparatus for treating semiconductor wafers, a plurality of chemical treatment tanks 21a to 21c filled with treatment liquids for processing semiconductor wafers W and a plurality of rinse treatment tanks 22a to 22c filled with rinse liquids for rinsing the semiconductor wafers W are disposed in a direction across the direction of conveyance of a wafer holder conveyor carriage 5, such as a direction perpendicular thereto. A transportation device provided with a wafer boat 14 is disposed at a position in the vicinity of the chemical treatment tanks 21a to 21c and the rinse treatment tanks 22a to 22c, to transfer the wafers W to and from the wafer holder conveyor carriage 5 and also transport the thus transferred wafers W to the chemical treatment tanks 21a to 21c and the rinse treatment tanks 22a to 22c. This configuration makes it possible to reduce the size of the treatment apparatus and also improve the processing efficiency thereof.

摘要翻译： 在处理半导体晶片的装置中，填充有用于处理半导体晶片W的处理液的多个化学处理槽21a〜21c和填充有冲洗半导体晶片W的冲洗液的多个冲洗处理槽22a〜22c配置在 方向横跨晶片保持器输送台5的输送方向，例如与其垂直的方向。 设置有晶片舟14的输送装置设置在化学处理槽21a〜21c和冲洗处理槽22a〜22c附近的位置，将晶片W向晶片保持架输送台5移送并从晶片保持架输送台5移送 将这样转移的晶片W输送到化学处理槽21a至21c和冲洗处理槽22a至22c。 这种构造使得可以减小治疗装置的尺寸并且还提高其处理效率。

公开(公告)号：US06319329B1

公开(公告)日：2001-11-20

申请号：US09432422

申请日：1999-11-02

申请人： Yuji Kamikawa ,  Kinya Ueno ,  Satoshi Nakashima

发明人： Yuji Kamikawa ,  Kinya Ueno ,  Satoshi Nakashima

IPC分类号： B08B310

CPC分类号： H01L21/67028 ,  B08B3/08 ,  Y10S134/902

摘要： A method for cleaning an object to be processed in which the atmosphere in a drying chamber is replaced by an inert gas prior to placing an object to be cleaned from an external environment into the chamber. The object is then transported by an elongated retaining member from the drying chamber through a lower opening in the chamber into a processing bath disposed below the chamber. The object is then cleaned in the processing bath. The object is then transported from the processing bath to the drying chamber where it is dried by filling the atmosphere of the drying chamber with organic solvent. The cleaning process in the cleaning bath is carried out while the bath is screened by a nitrogen-gas curtain. The method also includes opening a lid of the chamber prior to insertion of the object into the chamber and closing the lid after insertion of the object, as well as the opening and closing of the lower opening in the chamber. The method may also include exhausting an atmosphere in the drying chamber while supplying inert gas, decompressing the atmosphere in the drying chamber as well as chemical cleaning, water cleaning, and ozone cleaning of the object.

摘要翻译： 一种用于清洁待处理物体的方法，其中在将待清洁物体从外部环境放置到所述室中之前，将干燥室中的气氛替换为惰性气体。 然后，物体通过细长的保持构件从干燥室通过室中的下部开口输送到设置在室下方的处理槽中。 然后将物体在处理槽中清洁。 然后将物体从处理槽输送到干燥室，在其中通过用有机溶剂填充干燥室的气氛将其干燥。 在通过氮气幕筛选浴的同时进行清洗浴中的清洁处理。 该方法还包括在将物体插入室内之前打开腔室的盖子，并且在插入物体之后关闭盖子以及在腔室中打开和关闭下部开口。 该方法还可以包括在供应惰性气体的同时在干燥室中排出气氛，减少干燥室中的气氛以及化学清洁，水清洗和对象的臭氧清洁。