公开(公告)号：US20080097647A1

公开(公告)日：2008-04-24

申请号：US11907518

申请日：2007-10-12

申请人： Hiroshi Tanaka ,  Hironobu Hyakutake ,  Yuji Kamikawa

发明人： Hiroshi Tanaka ,  Hironobu Hyakutake ,  Yuji Kamikawa

IPC分类号： G06F19/00

CPC分类号： H01L21/67057 ,  H01L21/67028

摘要： The feature of the present invention is to enhance the throughput of manufacturing semiconductor wafers and/or liquid crystal substrates, by reducing the time required for performing a rinsing process. In this invention, the position of an object to be processed is controlled, such that a distance (L1) between the surface position (LV1) of a rinsing liquid upon the rinsing process and a top end position (LV2) of the object to be processed (wafers 2) becomes shorter than a distance (L2) between the surface position (LV3) of a chemical liquid upon a chemical liquid process and the top end position (LV4) of the object to be processed (wafers 2). Alternatively, the position of the object to be processed is controlled, such that the distance (L1) between the surface position (LV1) of the rinsing liquid upon the rinsing process and the top end position (LV2) of the object to be processed (wafers 2) becomes shorter than a distance (L3) between the bottom face position (LV5) of the rinsing liquid and a bottom end position (LV6) of the object to be processed (wafers 2).

摘要翻译： 本发明的特征是通过减少进行漂洗处理所需的时间来提高制造半导体晶片和/或液晶基板的生产量。 在本发明中，对被处理物的位置进行控制，使得漂洗处理后的冲洗液的表面位置（LV1）与上述漂洗液的顶端位置（LV2）之间的距离（L 1） 待处理对象（晶片2）变得短于化学液体处理时的化学液体的表面位置（LV 3）与待处理物体的顶端位置（LV 4）之间的距离（L 2） 晶圆2）。 或者，控制待处理对象的位置，使得漂洗过程中的冲洗液体的表面位置（LV 1）与物体的顶端位置（LV2）之间的距离（L 1）与 （晶片2）变得比漂洗液体的底面位置（LV5）和待处理物体（晶片2）的底端位置（LV6）之间的距离（L 3）短。

公开(公告)号：US06241827B1

公开(公告)日：2001-06-05

申请号：US09250457

申请日：1999-02-16

申请人： Hiroshi Tanaka ,  Shinichiro Shimomura ,  Yuji Kamikawa

发明人： Hiroshi Tanaka ,  Shinichiro Shimomura ,  Yuji Kamikawa

IPC分类号： B08B304

CPC分类号： B08B3/102 ,  Y10S134/902

摘要： Wafers (W) is immersed in a cleaning liquid (L) contained in a cleaning tank (20). The cleaning liquid (L) is supplied into the cleaning tank (20) so that the cleaning liquid (L) overflows the cleaning tank (20). The cleaning liquid (L) overflowed the cleaning tank (20) is filtered, circulated and returned into the cleaning tank (20). A motor-operated bellows pump (30) is connected by a suction pipe (51) to the cleaning tank (20). A particle counter (5) for counting particles contained in a sample of the cleaning liquid (L) sampled by the motor-operated bellows pump (30) is placed on the suction pipe (51) and connected to the suction side of the motor-operated bellows pump (30).

摘要翻译： 将晶片（W）浸渍在清洗槽（20）中所含的清洗液（L）中。 清洗液（L）被供​​给至清洗槽（20），以使清洗液（L）溢出清洗槽（20）。 清洗槽（20）溢出的清洗液（L）被过滤，循环并返回清洗槽（20）。 电动波纹管泵（30）通过吸管（51）连接到清洗槽（20）。 用于计数由电动波纹管泵（30）取样的清洗液（L）的样品中所含的微粒的粒子计数器（5）被放置在吸入管（51）上，并与电机 - 操作波纹管泵（30）。

公开(公告)号：US5488964A

公开(公告)日：1996-02-06

申请号：US880068

申请日：1992-05-07

申请人： Shinya Murakami ,  Yuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

发明人： Shinya Murakami ,  Yuji Kamikawa ,  Sinichiro Izumi ,  Noriyuki Anai ,  Takami Satoh ,  Hirofumi Shiraishi ,  Koji Harada ,  Takayuki Tomoeda ,  Hiroshi Tanaka

IPC分类号： B08B3/02 ,  B08B3/04 ,  B08B3/10 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67754 ,  B08B3/02 ,  B08B3/04 ,  B08B3/102 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67757 ,  Y10S134/902

摘要： Disclosed herein is a washing apparatus comprising a washing chamber, an opening/closing mechanism, and a nozzle. The chamber has an opening and is designed for washing the objects transported from outside through the opening. The opening/closing mechanism is designed to open and close the opening of the washing chamber. The nozzle is used to wash the opening/closing mechanism. The apparatus further comprises a washing vessel filled with a washing liquid, for washing the objects, and also a nozzle for applying a washing liquid to the objects located in the washing vessel when the objects are partly exposed as the washing liquid is discharged from the washing vessel.

公开(公告)号：US06589359B2

公开(公告)日：2003-07-08

申请号：US09927447

申请日：2001-07-10

申请人： Yuji Kamikawa ,  Hiroshi Tanaka

发明人： Yuji Kamikawa ,  Hiroshi Tanaka

IPC分类号： B08B300

CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B2230/01 ,  Y10S134/902

摘要： A cleaning method is provided for cleaning a semiconductor wafer. In this method, after removing adhering substances from the wafer by using a chemical liquid of organic amine type, there is carried out a pure-water cleaning capable of prevention of electrostatic destruction and alkaline corrosion on the wafer. In detail, it is executed to make a processing chamber have an atmosphere of carbon dioxide and subsequently introduce steam into the chamber to dissolve CO2-gas into the steam. Next, spray the pure water to the wafer. Then, the steam in which CO2-gas is dissolved dissolves in the pure water, so that the pure wafer becomes weak acid, accomplishing the reduction of resistivity of the pure water. Additionally, alkaline substances is neutralized by carbonated water to prevent an alkaline corrosion on a wiring layer on the wafer's surface.

公开(公告)号：US08577502B2

公开(公告)日：2013-11-05

申请号：US11907518

申请日：2007-10-12

申请人： Hiroshi Tanaka ,  Hironobu Hyakutake ,  Yuji Kamikawa

发明人： Hiroshi Tanaka ,  Hironobu Hyakutake ,  Yuji Kamikawa

IPC分类号： G05B21/00 ,  G01N21/00 ,  G01N35/02

CPC分类号： H01L21/67057 ,  H01L21/67028

摘要： A processing apparatus is provided for enhancing throughput in the manufacture of semiconductor wafers and/or liquid crystal substrates, by reducing the time required for performing a rinsing process. A position of an object to be processed is controlled, such that a distance between the surface position of a rinsing liquid upon the rinsing process and a top end position of the object to be processed becomes shorter than a distance between the surface position of a chemical liquid upon a chemical liquid process and the top end position of the object to be processed. Alternatively, the position of the object to be processed is controlled, such that the distance between the surface position of the rinsing liquid upon the rinsing process and the top end position of the object to be processed becomes shorter than a distance between the bottom face position of the rinsing liquid and a bottom end position of the object to be processed.

摘要翻译： 提供了一种处理装置，用于通过减少进行漂洗处理所需的时间来增加制造半导体晶片和/或液晶基板的生产量。 控制待处理物体的位置，使得漂洗过程中的冲洗液体的表面位置与待处理物体的顶端位置之间的距离短于化学品的表面位置之间的距离 液体在化学液体处理和被处理物体的顶端位置。 或者，控制被处理物的位置，使得冲洗处理时的冲洗液的表面位置与待处理物体的上端位置之间的距离比底面位置 的冲洗液体和待处理物体的底端位置。

公开(公告)号：US06357458B2

公开(公告)日：2002-03-19

申请号：US09833000

申请日：2001-04-11

申请人： Hiroshi Tanaka ,  Shinichiro Shimomura ,  Yuji Kamikawa

发明人： Hiroshi Tanaka ,  Shinichiro Shimomura ,  Yuji Kamikawa

IPC分类号： B08B304

CPC分类号： B08B3/102 ,  Y10S134/902

摘要： Wafers (W) is immersed in a cleaning liquid (L) contained in a cleaning tank (20). The cleaning liquid (L) is supplied into the cleaning tank (20) so that the cleaning liquid (L) overflows the cleaning tank (20). The cleaning liquid (L) overflowed the cleaning tank (20) is filtered, circulated and returned into the cleaning tank (20). A motor-operated bellows pump (30) is connected by a suction pipe (51) to the cleaning tank (20). A particle counter (5) for counting particles contained in a sample of the cleaning liquid (L) sampled by the motor-operated bellows pump (30) is placed on the suction pipe (51) and connected to the suction side of the motor-operated bellows pump (30).

摘要翻译： 将晶片（W）浸渍在清洗槽（20）中所含的清洗液（L）中。 清洗液（L）被供​​给至清洗槽（20），以使清洗液（L）溢出清洗槽（20）。 清洗槽（20）溢出的清洗液（L）被过滤，循环并返回清洗槽（20）。 电动波纹管泵（30）通过吸管（51）连接到清洗槽（20）。 用于计数由电动波纹管泵（30）取样的清洗液（L）的样品中所含的微粒的粒子计数器（5）被放置在吸入管（51）上，并与电机 - 操作波纹管泵（30）。

公开(公告)号：US09773597B2

公开(公告)日：2017-09-26

申请号：US13979988

申请日：2012-02-22

申请人： Hiroaki Ikeda ,  Hiroshi Tanaka ,  Kazunori Igarashi

发明人： Hiroaki Ikeda ,  Hiroshi Tanaka ,  Kazunori Igarashi

IPC分类号： H01F1/24 ,  H01F41/02 ,  B22F1/02 ,  B22F3/16 ,  C22C33/02 ,  C22C38/02 ,  H01F3/08 ,  H01F27/255 ,  H01F1/26 ,  H01F1/33

CPC分类号： H01F1/24 ,  B22F1/02 ,  B22F1/025 ,  B22F3/16 ,  B22F3/24 ,  B22F2998/10 ,  B22F2999/00 ,  C22C33/0214 ,  C22C33/0278 ,  C22C38/02 ,  C22C2202/02 ,  H01F1/26 ,  H01F1/33 ,  H01F3/08 ,  H01F27/255 ,  H01F41/0246 ,  B22F3/02 ,  B22F2003/248 ,  B22F2201/02 ,  B22F2201/20

摘要： A composite soft magnetic material having low magnetostriction and high magnetic flux density contains: pure iron-based composite soft magnetic powder particles that are subjected to an insulating treatment by a Mg-containing insulating film or a phosphate film; and Fe—Si alloy powder particles including 11%-16% by mass of Si. A ratio of an amount of the Fe—Si alloy powder particles to a total amount is in a range of 10%-60% by mass. A method for producing the composite soft magnetic material comprises the steps of: mixing a pure iron-based composite soft magnetic powder, and the Fe—Si alloy powder in such a manner that a ratio of the Fe—Si alloy powder to a total amount is in a range of 10%-60%; subjecting a resultant mixture to compression molding; and subjecting a resultant molded body to a baking treatment in a non-oxidizing atmosphere.

公开(公告)号：US09399189B2

公开(公告)日：2016-07-26

申请号：US14004708

申请日：2012-04-11

申请人： Tatsuya Tsujiuchi ,  Hiroshi Tanaka ,  Hiromitsu Nagayasu ,  Takuya Hirata ,  Tsuyoshi Oishi ,  Masahiko Tatsumi ,  Koji Kadono

发明人： Tatsuya Tsujiuchi ,  Hiroshi Tanaka ,  Hiromitsu Nagayasu ,  Takuya Hirata ,  Tsuyoshi Oishi ,  Masahiko Tatsumi ,  Koji Kadono

IPC分类号： B01D53/14

CPC分类号： B01D53/1425 ,  B01D53/1406 ,  B01D53/1475 ,  B01D2252/204 ,  B01D2257/504 ,  B01D2258/0283 ,  Y02A50/2342 ,  Y02C10/04 ,  Y02C10/06

摘要： A CO2 recovery device includes a cooling tower including a cooling unit for bringing the flue gas, which contains CO2, into contact with water so as to cool flue gas; a CO2-absorbing unit for bringing the flue gas into contact with a CO2 absorbent (lean solution) so as to remove CO2 from flue gas; and a regenerator including an absorbent regenerating unit for releasing CO2 from a rich solution so as to regenerate the CO2 absorbent. The CO2-absorbing unit includes: a cocurrent flow CO2-absorbing unit provided in a cocurrent flow CO2 absorber, for bringing the flue gas into contact with the CO2 absorbent in a cocurrent flow so as to remove CO2 from flue gas and a countercurrent CO2-absorbing unit provided in a CO2 absorber, for bringing the flue gas into contact with the CO2 absorbent in a countercurrent flow so as to remove CO2 from flue gas.

摘要翻译： CO 2回收装置包括：冷却塔，其包括用于使含有CO 2的烟道气与水接触以冷却烟道气的冷却单元; 用于使烟道气与CO 2吸收剂（贫溶液）接触以便从烟道气中除去CO 2的CO 2吸收单元; 以及再生器，其包括用于从富溶液中释放CO 2以便再生CO 2吸收剂的吸收剂再生单元。 二氧化碳吸收单元包括：并流CO2吸收单元，其设置在并流CO2吸收器中，用于使烟道气与CO 2吸收剂以并流方式接触，以便从烟气中除去CO 2和逆流CO2- 提供在CO 2吸收器中的吸收单元，用于使烟气以逆流流动与CO 2吸收剂接触，以便从烟道气中除去CO 2。

公开(公告)号：US09340117B2

公开(公告)日：2016-05-17

申请号：US13814154

申请日：2011-07-29

申请人： Nobuo Momose ,  Makoto Kataniwa ,  Yasuhiro Nakai ,  Hiroyuki Kumazawa ,  Tatsuji Munaka ,  Yoshitaka Okazaki ,  Yuichiro Shimura ,  Hiroshi Tanaka ,  Hiroshi Irie ,  Hitoshi Maejima

发明人： Nobuo Momose ,  Makoto Kataniwa ,  Yasuhiro Nakai ,  Hiroyuki Kumazawa ,  Tatsuji Munaka ,  Yoshitaka Okazaki ,  Yuichiro Shimura ,  Hiroshi Tanaka ,  Hiroshi Irie ,  Hitoshi Maejima

IPC分类号： G06F19/00 ,  B60L11/18 ,  H02J3/32

CPC分类号： B60L11/1838 ,  B60L11/1816 ,  B60L11/1824 ,  B60L11/1825 ,  B60L11/184 ,  B60L11/1842 ,  B60L11/1844 ,  B60L11/1846 ,  B60L11/1877 ,  B60L2210/30 ,  B60L2230/22 ,  B60L2230/24 ,  B60L2230/40 ,  B60L2240/545 ,  B60L2240/70 ,  B60L2250/16 ,  H02J3/28 ,  H02J3/32 ,  Y02E60/721 ,  Y02T10/7005 ,  Y02T10/705 ,  Y02T10/7088 ,  Y02T10/7241 ,  Y02T10/7291 ,  Y02T90/121 ,  Y02T90/127 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/16 ,  Y02T90/163 ,  Y02T90/168 ,  Y02T90/169 ,  Y04S10/126 ,  Y04S30/12 ,  Y04S30/14

摘要： The invention judges a total power supply/demand condition of the electricity consumers 2 as a whole according to an individual power supply/demand condition of electricity consumers 2, judges a total usable capacity of all batteries 17 according to a usable capacity of the batteries 17 of electric vehicles 10 parked at electricity consumers 2, obtains required charge/discharge amounts of all the batteries 17 according to a result of comparison of the total power supply/demand condition of the electricity consumers 2 as a whole with the total usable capacity of all the batteries 17, subjects the batteries 17 to charge/discharge controls according to the required charge/discharge amounts, the power supply/demand conditions of the electricity consumers 2, and the usable capacities of the batteries.

摘要翻译： 根据电力用户2的个体供电条件，本发明判断电力用户2整体的总供电状况，根据电池17的可使用容量来判断全部电池17的总可使用容量 停电在电力用户2上的电动车辆10，根据电力用户2的整体供电/供给状况的比较结果与所有电池17的总可用容量的比较结果，获得所有电池17的所需充放电量 电池17根据所需的充电/放电量，电力用户2的供电/需求条件以及电池的可用容量对电池17进行充放电控制。

公开(公告)号：US09264332B2

公开(公告)日：2016-02-16

申请号：US14129075

申请日：2012-06-12

申请人： Akira Sakurai ,  Hiroshi Tanaka ,  Masaki Umayabashi

发明人： Akira Sakurai ,  Hiroshi Tanaka ,  Masaki Umayabashi

IPC分类号： G01R31/08 ,  G06F11/00 ,  G08C15/00 ,  H04L12/26

CPC分类号： H04L43/0829 ,  H04L43/0835 ,  H04L43/0841 ,  H04L43/0852 ,  H04L43/106

摘要： In a transmission system capable of measuring packet loss ratio between arbitrary devices upon a transmission path without increasing bandwidth of an OAM frame band, a plurality of transmission devices which have been disposed upon a transmission path are provided with a frame analysis unit which receives data frames so as to analyze the type of the data frames, a count processing unit which stores the number of received frames included in the data frames into storage module provided beforehand, an output line end portion which outputs the data frames, and an OAM processing unit which calculates the packet loss ratio in the transmission path using the number of received frames. The frame analysis unit has a function which, if the data frames are OAM frames, copies the data frames and the OAM processing unit has a function which calculates the packet loss ratio using the copied OAM frames.

摘要翻译： 在能够测量传输路径上的任意设备之间的分组丢失率而不增加OAM帧频带宽的传输系统中，设置在传输路径上的多个传输设备设置有帧分析单元，其接收数据帧 为了分析数据帧的类型，将数据帧中包含的接收帧的数量存储在预先提供的存储模块中的计数处理单元，输出数据帧的输出线路端部分和OAM处理单元， 使用接收帧的数量来计算传输路径中的丢包率。 帧分析单元具有这样的功能：如果数据帧是OAM帧，则复制数据帧，并且OAM处理单元具有使用复制的OAM帧来计算分组丢失率的功能。