High speed composite layup via multiple machines

    公开(公告)号:US10710318B2

    公开(公告)日:2020-07-14

    申请号:US15606498

    申请日:2017-05-26

    Abstract: Systems and methods are provided for laying up laminates. One embodiment is a method that includes laying up a multi-layer laminate of fiber reinforced material onto a surface, by: feeding a tape of fiber reinforced material to tape cutters which cut the tape into pieces, picking up pieces of the fiber reinforced material via pick-and-place devices at each of multiple lamination units that are in sequence in a direction of travel, and placing the pieces of fiber reinforced material via the pick-and-place devices to form a laminate as the surface and the lamination units change position with respect to each other and multiple pieces are laid-up concurrently.

    Systems and methods for bonding semiconductor elements

    公开(公告)号:US10692783B2

    公开(公告)日:2020-06-23

    申请号:US15830164

    申请日:2017-12-04

    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure for supporting a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; an alignment structure including first alignment markings; an alignment element configured to be placed on the alignment structure using the bonding tool, the alignment element including second alignment markings; an imaging system configured to image relative positions of the first alignment markings and corresponding ones of the second alignment markings; and a computer system configured to provide an adjustment to a position of at least one of the bonding tool and the support structure during bonding of ones of the plurality of semiconductor elements to the substrate, the computer being configured to provide the adjustment at least partially based on the relative positions of the first alignment markings and the corresponding ones of the second alignment markings, the adjustment being specific to bonding of the ones of the plurality of semiconductor elements to a corresponding region of the substrate.

    Measurement of ply boundaries
    97.
    发明授权

    公开(公告)号:US10661512B2

    公开(公告)日:2020-05-26

    申请号:US15497034

    申请日:2017-04-25

    Abstract: A system comprises a laser projector, an automated material placement head, and a laser inspection system. The laser projector is configured to project boundary projection line onto a part. The automated material placement head is configured to lay down a course of composite material. The laser inspection system is connected to the automated material placement head and configured to project a laser beam into a laser line parallel to the motion of the automated material placement head in laying the composite material.

    Methods for manufacturing printed laminates

    公开(公告)号:US10647535B2

    公开(公告)日:2020-05-12

    申请号:US15912625

    申请日:2018-03-06

    Abstract: Methods for manufacturing printed laminates or elastic printed laminates are disclosed. The printed laminates may have a first extensible material and a second extensible material. The first extensible material may have a plurality of repeating graphic sets each having a repeating graphic set length. The first extensible material may have a first strain and the second extensible material may have a second, different strain. The second strain may be constant. The first strain may be variable to correspond to the repeating graphic set lengths to a predetermined laminate pitch. The first and second extensible material may be joined together at a point of joinder. An elastic member, such as a plurality of elastic strands, for example, may be positioned intermediate the first and second extensible materials to form an elastic laminate.

    Controlled translation method of affixing a termination to a multi-stranded tensile member

    公开(公告)号:US10591022B2

    公开(公告)日:2020-03-17

    申请号:US16154379

    申请日:2018-10-08

    Abstract: A method for creating a termination by attaching some kind of fitting to the end of a tensile member such as a cable. The end fitting is provided with one or more internal cavities. Each cavity has a proximal portion that is adjacent to the area where the tensile member exits the fitting and a distal portion on its opposite end. A length of the tensile member's filaments is placed within this expanding cavity and infused with liquid potting compound. The method exploits the characteristic of a liquid potting compound as it transitions to a solid. Once the potting compound in at least a portion of the cavity has transitioned sufficiently to hold the filaments at a desired level, tension is placed on the tensile member and a small linear displacement may be imposed on the tensile member. This linear displacement tends to pull the filaments residing in the potting compound into better alignment and improve load sharing. The invention can be applied to single fittings having multiple cavities and to multiple fittings having only one cavity per fitting.

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