Abstract:
A semiconductor device having a self-aligned gate conductive layer and a method of fabricating the same are disclosed. In embodiments of the present invention, a plurality of field isolation patterns are formed on a semiconductor substrate to define a plurality of active regions in the semiconductor substrate. The density of the field isolation patterns is then increased by, for example, a thermal annealing process. A plurality of gate insulation patterns are then formed on respective of the active regions. A plurality of first conductive patterns are then formed on respective of the gate insulation patterns.
Abstract:
Methods for erasing an integrated circuit memory device having a cell array region that includes a main cell array region, a first dummy cell array region on a first side of the main cell array region and a second dummy cell array region on a second side of the main cell array region are provided. A first erasure voltage is applied to a plurality of main control gate electrodes in the main cell array region. The plurality of main control gate electrodes include a first outermost main control gate electrode adjacent to the first dummy cell array region and a second outermost main control gate electrode adjacent to the second dummy cell array region. A second erasure voltage is applied to an integrated circuit substrate in the main cell array region. The second erasure voltage is greater than the first erasure voltage. A third erasure voltage is applied to a first inner dummy control gate electrode adjacent to the first outermost main control gate electrode and a second inner dummy control gate electrode adjacent to the second outermost main control gate electrode. The third erasure voltage is less than the second erasure voltage. Related devices are also provided.
Abstract:
A floating trap type non-volatile memory device and fabrication method thereof are provided. The floating trap type device comprises a substrate, a gate electrode formed on the substrate. A charge storage layer is interposed between the substrate and the gate electrode. A tunneling layer is interposed between the substrate and charge storage layer. The charge storage layer comprises a material having a narrower band gap than silicon nitride. The charge storage layer preferably formed of tetrahedral amorphous carbon. The potential barrier between the charge storage layer and the tunneling layer is increased by using the tetrahedral amorphous carbon as the charge storage layer. Therefore, the charge retention characteristic of the floating trap type device is improved.
Abstract:
An abrasive wheel to grind or cut a variety of materials comprising a core part fixed to a tool transmitting motive power and long tips and short tips alternately attached on the base surface of a shank around the core part. The tips are arranged to cover the base surface with space therebetween at predetermined intervals along the circumference of the shank.
Abstract:
A molten steel refining apparatus and a method therefor, in which the carbon component of molten steel can be easily removed, the temperature drop of molten steel can be effectively reduced, and a stable operation is realized. The apparatus for refining molten steel for manufacturing ultra low carbon steel includes an RH vacuum-degassing device consisting of a vessel and a snorkel composed of an up-leg and a down-leg. The apparatus further includes a plurality of gas injection lance nozzles each consisting of an inner tube and an outer tube, and installed on the side wall of the vessel of the RH vacuum-degassing device so as to inject gas toward molten steel within the vessel. The inner tube includes a throat for forming a jet stream of super-sonic velocity, and the outer tube injects cooling gas for cooling the inner tube.
Abstract:
Semiconductor devices are provided. The semiconductor devices may include a substrate, a ground selection gate electrode, and a channel structure. The channel structure may extend the ground selection gate electrode in a first direction perpendicular to a top surface of the substrate, and include a channel layer, a channel contact layer, and a stepped portion. The channel contact layer may contact the substrate and include a first width in a second direction perpendicular to the first direction. The channel layer may contact the channel contact layer, include a bottom surface between a bottom surface of the ground selection gate electrode and the top surface of the substrate in the first direction, and include a second width in the second direction different from the first width.
Abstract:
A non-volatile memory device including a cell array area including a plurality of memory cells and word lines and bit lines, which are connected to the plurality of memory cells, a core circuit area including a page buffer circuit and a row decoder circuit, the pager buffer circuit configured to temporarily store data input to and output from the plurality of memory cells, and the row decoder circuit configured to select some of the word lines corresponding to an address input thereto, and an input/output circuit area including a data input/output buffer circuit, the data input/output buffer circuit configured to at least one of transmit data to the page buffer circuit and receive data from the page buffer circuit, and the input/output circuit area including at least one asymmetrical transistor having a source region and a drain region asymmetrically disposed with respect to the gate structure may be provided.