Etchant, method of etching, laminate formed thereby, and device
    102.
    发明申请
    Etchant, method of etching, laminate formed thereby, and device 有权
    蚀刻剂,蚀刻方法,由此形成的层压体和装置

    公开(公告)号:US20060289386A1

    公开(公告)日:2006-12-28

    申请号:US11167719

    申请日:2005-06-27

    CPC classification number: H01L21/31111

    Abstract: An etchant including a halogenated salt, such as Cryolite (Na3AlF6) or potassium tetrafluoro borate (KBF4), is provided. The salt may be present in the etchant in an amount sufficient to etch a substrate and may have a melt temperature of greater than about 200 degrees Celsius. A method of wet etching may include contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the support layer may include aluminum oxide; or contacting an etchant to at least one surface of a support layer of a multi-layer laminate, wherein the etchant may include Cryolite (Na3AlF6), potassium tetrafluoro borate (KBF4), or both; and etching at least a portion of the support layer. The method may provide a laminate produced by growing a crystal onto an aluminum oxide support layer, and chemically removing at least a portion of the support layer by wet etch. An electronic device, optical device or combined device including the laminate is provided.

    Abstract translation: 提供了包括卤化盐的蚀刻剂,例如Cryolite(Na 3 AlF 6)或四氟硼酸钾(KBF 4 N 4)。 盐可以以足以蚀刻基材的量存在于蚀刻剂中,并且可以具有大于约200摄氏度的熔体温度。 湿蚀刻的方法可以包括使蚀刻剂与多层层压体的支撑层的至少一个表面接触,其中所述支撑层可以包括氧化铝; 或使蚀刻剂与多层层压体的支撑层的至少一个表面接触,其中所述蚀刻剂可以包括冰晶石(Na 3 AlF 6 N),四氟硼酸钾 (KBF 4)或两者; 并蚀刻所述支撑层的至少一部分。 该方法可以提供通过将结晶生长到氧化铝载体层上并通过湿蚀刻化学去除至少一部分载体层而制备的层压体。 提供了包括层压板的电子设备,光学设备或组合设备。

    Three dimensional high aspect ratio micromachining
    104.
    发明授权
    Three dimensional high aspect ratio micromachining 有权
    三维高宽比微加工

    公开(公告)号:US07045466B2

    公开(公告)日:2006-05-16

    申请号:US10607838

    申请日:2003-06-27

    CPC classification number: B81C1/00626 B81B2201/033 H01L21/3086

    Abstract: Multi-level structures are formed in a semiconductor substrate by first forming a pattern of lines or structures of different widths. Width information on the pattern is decoded by processing steps into level information to form a MEMS structure. The pattern is etched to form structures having a first floor. The structures are oxidized until structures of thinner width are substantially fully oxidized. A portion of the oxide is then etched to expose the first floor. The first floor is then etched to form a second floor. The oxide is then optionally removed, leaving a multi-level structure. In one embodiment, high aspect ratio comb actuators are formed using the multi-level structure process.

    Abstract translation: 通过首先形成不同宽度的线或结构的图案,在半导体衬底中形成多层结构。 图案上的宽度信息通过处理步骤被解码成级信息以形成MEMS结构。 蚀刻图案以形成具有一层的结构。 结构被氧化,直到较薄宽度的结构基本上被完全氧化。 然后蚀刻一部分氧化物以露出第一层。 然后蚀刻第一层以形成二楼。 然后任选地除去氧化物,留下多层结构。 在一个实施例中,使用多层结构工艺形成高纵横比梳状致动器。

    Method of wet etching vias and articles formed thereby
    106.
    发明申请
    Method of wet etching vias and articles formed thereby 失效
    湿法蚀刻通孔和​​由此形成的制品的方法

    公开(公告)号:US20060055048A1

    公开(公告)日:2006-03-16

    申请号:US10938247

    申请日:2004-09-13

    Abstract: A method for forming smooth walled, prismatically-profiled through-wafer vias and articles formed through the method. An etch stop material is provided on a wafer, which may be a silicon wafer. A mask material is provided on the etch stop material and patterned in such a way as to lead to the formation of vias that have at least one pair of opposing side walls that run parallel to a plane in the wafer. A wet etchant, such as potassium hydroxide, is used to etch vias in the wafer. The use of a wet etchant leads to the formation of smooth side walls. This method allows an aspect ratio of height versus width of the vias of greater than 75 to 1.

    Abstract translation: 用于形成通过该方法形成的平滑壁,棱镜通孔晶片通孔和制品的方法。 在晶片上提供蚀刻停止材料,晶片可以是<110>硅晶片。 在蚀刻停止材料上提供掩模材料,并以这样的方式图案化,以便导致形成通孔,其具有平行于晶片中的111平面延伸的至少一对相对的侧壁。 使用诸如氢氧化钾的湿蚀刻剂来蚀刻晶片中的通孔。 使用湿蚀刻剂导致形成平滑的侧壁。 该方法允许通孔的高度与宽度的长宽比大于75至1。

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