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    LED lighting system with reflective board
    2.
    发明授权
    LED lighting system with reflective board 有权
    LED照明系统带反光板

    公开(公告)号：US07431479B2

    公开(公告)日：2008-10-07

    申请号：US11725410

    申请日：2007-03-19

    申请人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

    发明人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

    IPC分类号： F21V7/00

    CPC分类号： H05K1/181 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/4025 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/2054 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

    摘要翻译： 发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。 印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。 焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

    Heat exchange assembly and methods of assembling same
    4.
    发明授权
    Heat exchange assembly and methods of assembling same 有权
    换热组件及组装方法

    公开(公告)号：US08811014B2

    公开(公告)日：2014-08-19

    申请号：US13340058

    申请日：2011-12-29

    申请人： Shakti Singh Chauhan ,  Stanton Earl Weaver, Jr. ,  Tao Deng ,  Christopher Michael Eastman ,  Wenwu Zhang

    发明人： Shakti Singh Chauhan ,  Stanton Earl Weaver, Jr. ,  Tao Deng ,  Christopher Michael Eastman ,  Wenwu Zhang

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.

    摘要翻译： 本文描述了用于冷却电气部件的热交换组件。 热组件包括壳体，其包括蒸发器部分，冷凝器部分和沿着纵向轴线在蒸发器部分和冷凝器部分之间延伸的输送部分。 壳体被构造成沿着相对于传送部分定向的弯曲轴线弯曲。 壳体还包括至少一个侧壁，其包括在蒸发器部分和冷凝器部分之间延伸的至少一个流体室，以在蒸发器部分和冷凝器部分之间引导工作流体。 多个流体通道限定在内表面内以将液体流体从冷凝器部分引导到蒸发器部分。 至少一个蒸汽通道限定在内表面内，以将气态流体从蒸发器部分引导到冷凝器部分。

    Device for solid state thermal transfer and power generation
    5.
    发明授权
    Device for solid state thermal transfer and power generation 有权
    固态热转印和发电装置

    公开(公告)号：US07498507B2

    公开(公告)日：2009-03-03

    申请号：US11081986

    申请日：2005-03-16

    申请人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

    发明人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

    IPC分类号： H01L35/30 ,  H02N10/00

    CPC分类号： H01L35/32 ,  Y10T156/1092

    摘要： A solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

    摘要翻译： 固态热转印装置包括彼此相对定位的第一和第二导电基板。 固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电 底物。

    Thermal transfer device and system and method incorporating same
    6.
    发明授权
    Thermal transfer device and system and method incorporating same 失效
    热转印装置及其组合方法

    公开(公告)号：US07260939B2

    公开(公告)日：2007-08-28

    申请号：US11015260

    申请日：2004-12-17

    申请人： Stanton Earl Weaver, Jr.

    发明人： Stanton Earl Weaver, Jr.

    IPC分类号： F25B21/00 ,  H01L35/30 ,  H01L29/36 ,  H01L29/74 ,  H01J1/00

    CPC分类号： H01L35/00 ,  B82Y10/00 ,  B82Y30/00 ,  F25B21/00 ,  F25B2321/003 ,  H01J45/00 ,  Y02B30/66 ,  Y10T29/4935

    摘要： A method of manufacturing a thermal transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier having a plurality of closed shapes on the first thermally conductive substrate and providing a nanotube catalyst material on the first thermally conductive substrate in a nanotube growth area oriented within each of the plurality of closed shapes of the patterned electrical barrier. The method also includes orienting the second thermally conductive substrate opposite the first thermally conductive substrate such that the patterned electrical barrier is disposed between the first and second thermally conductive substrates and providing a precursor gas proximate the nanotube catalyst material to facilitate growth of nanotubes in the nanotube growth areas from the first thermally conductive substrate toward, and limited by, the second thermally conductive substrate. In this thermal transfer device, introduction of current flow between the first and second thermally conductive substrates enables heat transfer between the first and second thermally conductive substrates via a flow of electrons between the first and second thermally conductive substrates.

    摘要翻译： 一种制造热转印装置的方法，包括提供基本上原子上平坦的第一和第二导热基底，在第一导热基底上提供具有多个封闭形状的图案化电屏障，并在第一导热基底上提供纳米管催化剂材料 衬底在取向于图案化电屏障的多个封闭形状的每一个内的纳米管生长区域中。 该方法还包括将第二导热衬底定位成与第一导热衬底相对的方向，使得图案化电阻挡层设置在第一和第二导热衬底之间，并提供靠近纳米管催化剂材料的前体气体，以促进纳米管在纳米管中的生长 生长区域从第一导热衬底朝向第二导热衬底限制。 在该热转印装置中，在第一导热基板和第二导热基板之间引入电流可以使第一和第二导热基板之间的电流经由第一和第二导热基板之间的电流传递。

    Heat exchange assembly for use with electrical devices and methods of assembling an electrical device
    7.
    发明授权
    Heat exchange assembly for use with electrical devices and methods of assembling an electrical device 有权
    用于电气设备的热交换组件和组装电气设备的方法

    公开(公告)号：US08780559B2

    公开(公告)日：2014-07-15

    申请号：US13340309

    申请日：2011-12-29

    申请人： Stanton Earl Weaver, Jr. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    发明人： Stanton Earl Weaver, Jr. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.

    摘要翻译： 这里描述了一种电气设备。 电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件， 与第一架飞机不同。 热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。 热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。 热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

    Thermal transfer device and system and method incorporating same
    10.
    发明授权
    Thermal transfer device and system and method incorporating same 失效
    热转印装置及其组合方法

    公开(公告)号：US07805950B2

    公开(公告)日：2010-10-05

    申请号：US11925396

    申请日：2007-10-26

    申请人： Stanton Earl Weaver, Jr.

    发明人： Stanton Earl Weaver, Jr.

    IPC分类号： F25B21/02 ,  F25B21/00 ,  H01L35/28

    CPC分类号： F25B21/00 ,  F25B2321/003 ,  Y02B30/66 ,  Y10T29/49147

    摘要： A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.

    摘要翻译： 一种热转印装置，具有第一基底层，第二基底层和设置在第一基底层和第二基底层之间的第一和第二电极。 热转印装置还包括设置在第一电极和第二电极之间的释放层和邻近第一和第二电极设置的致动器。 致动器适于将第一和第二电极与释放层分开以打开第一和第二电极之间的热电穿孔间隙，并且其中致动器适于主动地控制热电穿孔间隙。